|
US4166018A
(en)
*
|
1974-01-31 |
1979-08-28 |
Airco, Inc. |
Sputtering process and apparatus
|
|
US3956093A
(en)
*
|
1974-12-16 |
1976-05-11 |
Airco, Inc. |
Planar magnetron sputtering method and apparatus
|
|
JPS51117933A
(en)
*
|
1975-04-10 |
1976-10-16 |
Tokuda Seisakusho |
Spattering apparatus
|
|
FR2324755A1
(fr)
*
|
1975-09-19 |
1977-04-15 |
Anvar |
Dispositif de pulverisation cathodique de grande vitesse de depot
|
|
US4046660A
(en)
*
|
1975-12-29 |
1977-09-06 |
Bell Telephone Laboratories, Incorporated |
Sputter coating with charged particle flux control
|
|
US4179351A
(en)
*
|
1976-09-09 |
1979-12-18 |
Hewlett-Packard Company |
Cylindrical magnetron sputtering source
|
|
DE2655942A1
(de)
*
|
1976-12-10 |
1978-06-15 |
Tokuda Seisakusho Kawasaki Kk |
Zerstaeubungsvorrichtung
|
|
US4126530A
(en)
*
|
1977-08-04 |
1978-11-21 |
Telic Corporation |
Method and apparatus for sputter cleaning and bias sputtering
|
|
FR2423065A1
(fr)
*
|
1978-04-12 |
1979-11-09 |
Battelle Memorial Institute |
Procede de fabrication d'electrodes pour piles a combustible, dispositif pour la mise en oeuvre du procede et electrodes resultant de ce procede
|
|
GB2028377B
(en)
*
|
1978-08-21 |
1982-12-08 |
Vac Tec Syst |
Magnetically-enhanced sputtering device
|
|
EP0045822B1
(en)
*
|
1980-08-08 |
1985-05-29 |
Battelle Development Corporation |
Cylindrical magnetron sputtering cathode
|
|
EP0046154B1
(en)
*
|
1980-08-08 |
1984-11-28 |
Battelle Development Corporation |
Apparatus for coating substrates by high-rate cathodic sputtering, as well as sputtering cathode for such apparatus
|
|
US4290877A
(en)
*
|
1980-09-08 |
1981-09-22 |
The United States Of America As Represented By The Secretary Of The Interior |
Sputtering apparatus for coating elongated tubes and strips
|
|
DE3107914A1
(de)
*
|
1981-03-02 |
1982-09-16 |
Leybold-Heraeus GmbH, 5000 Köln |
Verfahren und vorrichtung zum beschichten von formteilen durch katodenzerstaeubung
|
|
CH649578A5
(de)
*
|
1981-03-27 |
1985-05-31 |
Ulvac Corp |
Hochgeschwindigkeits-kathoden-zerstaeubungsvorrichtung.
|
|
US4525264A
(en)
*
|
1981-12-07 |
1985-06-25 |
Ford Motor Company |
Cylindrical post magnetron sputtering system
|
|
US4422896A
(en)
*
|
1982-01-26 |
1983-12-27 |
Materials Research Corporation |
Magnetically enhanced plasma process and apparatus
|
|
US4525262A
(en)
*
|
1982-01-26 |
1985-06-25 |
Materials Research Corporation |
Magnetron reactive bias sputtering method and apparatus
|
|
US4376025A
(en)
*
|
1982-06-14 |
1983-03-08 |
Battelle Development Corporation |
Cylindrical cathode for magnetically-enhanced sputtering
|
|
US4581118A
(en)
*
|
1983-01-26 |
1986-04-08 |
Materials Research Corporation |
Shaped field magnetron electrode
|
|
JPS60221563A
(ja)
*
|
1984-04-17 |
1985-11-06 |
Ulvac Corp |
バイアススパッタ方法
|
|
US4865712A
(en)
*
|
1984-05-17 |
1989-09-12 |
Varian Associates, Inc. |
Apparatus for manufacturing planarized aluminum films
|
|
DE3427587A1
(de)
*
|
1984-07-26 |
1986-02-06 |
Leybold-Heraeus GmbH, 5000 Köln |
Zerstaeubungseinrichtung fuer katodenzerstaeubungsanlagen
|
|
DE3442208C3
(de)
*
|
1984-11-19 |
1998-06-10 |
Leybold Ag |
Verfahren und Vorrichtung zum Herstellen harter Kohlenstoffschichten
|
|
US4600563A
(en)
*
|
1985-02-05 |
1986-07-15 |
Psi Star Incorporated |
Plasma reactor with voltage transformer
|
|
US4711767A
(en)
*
|
1985-02-05 |
1987-12-08 |
Psi Star |
Plasma reactor with voltage transformer
|
|
DE3527626A1
(de)
*
|
1985-08-01 |
1987-02-05 |
Leybold Heraeus Gmbh & Co Kg |
Zerstaeubungskatode nach dem magnetronprinzip
|
|
US4668338A
(en)
*
|
1985-12-30 |
1987-05-26 |
Applied Materials, Inc. |
Magnetron-enhanced plasma etching process
|
|
DE3636524A1
(de)
*
|
1986-10-27 |
1988-04-28 |
Vtu Angel Kancev |
Einrichtung zum auftragen von ueberzuegen im vakuum durch magnetronzerstaeubung
|
|
DE3727901A1
(de)
*
|
1987-08-21 |
1989-03-02 |
Leybold Ag |
Zerstaeubungskathode nach dem magnetronprinzip
|
|
BE1001027A3
(nl)
*
|
1987-10-21 |
1989-06-13 |
Bekaert Sa Nv |
Werkwijze en inrichting voor het reinigen van een langwerpig metalen substraat, zoals een draad, een band, een koord, enz., alsmede volgens die werkwijze gereinigde substraten en met dergelijke substraten versterkte voorwerpen uit polymeermateriaal.
|
|
JP2673807B2
(ja)
*
|
1987-10-30 |
1997-11-05 |
パイオニア株式会社 |
光磁気記録媒体の製造方法
|
|
US4842703A
(en)
*
|
1988-02-23 |
1989-06-27 |
Eaton Corporation |
Magnetron cathode and method for sputter coating
|
|
US4810347A
(en)
*
|
1988-03-21 |
1989-03-07 |
Eaton Corporation |
Penning type cathode for sputter coating
|
|
DE3844064A1
(de)
*
|
1988-12-28 |
1990-07-05 |
Leybold Ag |
Katodenzerstaeubungsvorrichtung nach dem magnetron-prinzip mit einer hohlkatode und einem zylindrischen target
|
|
US4927515A
(en)
*
|
1989-01-09 |
1990-05-22 |
The Board Of Trustees Of The Leland Stanford Junior University |
Circular magnetron sputtering device
|
|
DE3908252C2
(de)
*
|
1989-03-14 |
1996-06-20 |
Leybold Ag |
Zerstäubungskathode nach dem Magnetron-Prinzip
|
|
US4957605A
(en)
*
|
1989-04-17 |
1990-09-18 |
Materials Research Corporation |
Method and apparatus for sputter coating stepped wafers
|
|
US5178743A
(en)
*
|
1989-06-15 |
1993-01-12 |
Microelectronics And Computer Technology Corporation |
Cylindrical magnetron sputtering system
|
|
DE4018914C1
(pt)
*
|
1990-06-13 |
1991-06-06 |
Leybold Ag, 6450 Hanau, De |
|
|
US5437778A
(en)
*
|
1990-07-10 |
1995-08-01 |
Telic Technologies Corporation |
Slotted cylindrical hollow cathode/magnetron sputtering device
|
|
US5073245A
(en)
*
|
1990-07-10 |
1991-12-17 |
Hedgcoth Virgle L |
Slotted cylindrical hollow cathode/magnetron sputtering device
|
|
DE4100291C1
(pt)
*
|
1991-01-08 |
1991-10-02 |
Leybold Ag, 6450 Hanau, De |
|
|
BR9205911A
(pt)
*
|
1991-04-19 |
1994-12-27 |
Surface Solutions Inc |
Aparelho de sublimação catódica, e processo para depositar película delgada sobre superfície de objeto dentro de um aparelho de sublimação catódica
|
|
GB2256085A
(en)
*
|
1991-05-13 |
1992-11-25 |
Integrated Plasma Ltd |
Plasma deposition and etching of substrates.
|
|
US5228963A
(en)
*
|
1991-07-01 |
1993-07-20 |
Himont Incorporated |
Hollow-cathode magnetron and method of making thin films
|
|
DE4135939A1
(de)
*
|
1991-10-31 |
1993-05-06 |
Leybold Ag, 6450 Hanau, De |
Zerstaeubungskathode
|
|
DE4138793C2
(de)
*
|
1991-11-26 |
2001-03-01 |
Leybold Ag |
Verfahren und Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten
|
|
US5415757A
(en)
*
|
1991-11-26 |
1995-05-16 |
Leybold Aktiengesellschaft |
Apparatus for coating a substrate with electrically nonconductive coatings
|
|
US5685961A
(en)
*
|
1992-03-27 |
1997-11-11 |
P & D Medical Coatings, Inc. |
Method for fabrication of metallized medical devices
|
|
DE4333825C1
(de)
*
|
1993-09-28 |
1995-02-23 |
Mat Gmbh |
Vorrichtung zum Beschichten von langgestreckten biegsamen Erzeugnissen
|
|
US6217716B1
(en)
|
1998-05-06 |
2001-04-17 |
Novellus Systems, Inc. |
Apparatus and method for improving target erosion in hollow cathode magnetron sputter source
|
|
US6066242A
(en)
*
|
1998-06-10 |
2000-05-23 |
David A. Glocker |
Conical sputtering target
|
|
US6432286B1
(en)
|
1998-06-10 |
2002-08-13 |
David A. Glocker |
Conical sputtering target
|
|
US6235170B1
(en)
|
1998-06-10 |
2001-05-22 |
David A. Glocker |
Conical sputtering target
|
|
US6352430B1
(en)
|
1998-10-23 |
2002-03-05 |
Goodrich Corporation |
Method and apparatus for cooling a CVI/CVD furnace
|
|
US6440220B1
(en)
*
|
1998-10-23 |
2002-08-27 |
Goodrich Corporation |
Method and apparatus for inhibiting infiltration of a reactive gas into porous refractory insulation
|
|
US6162298A
(en)
*
|
1998-10-28 |
2000-12-19 |
The B. F. Goodrich Company |
Sealed reactant gas inlet for a CVI/CVD furnace
|
|
US6193853B1
(en)
|
1999-02-25 |
2001-02-27 |
Cametoid Limited |
Magnetron sputtering method and apparatus
|
|
EP1063318B1
(en)
|
1999-06-04 |
2004-08-25 |
Goodrich Corporation |
Combination CVI/CVD and heat treat susceptor lid
|
|
US6639196B1
(en)
|
1999-06-04 |
2003-10-28 |
Goodrich Corporation |
Method and apparatus for cooling a CVI/CVD furnace
|
|
DE60005888T2
(de)
|
1999-06-04 |
2004-07-29 |
Goodrich Corp. |
Verfahren und Vorrichtung zur Druckmessung in einer CVD/CVI-Kammer
|
|
TW584905B
(en)
|
2000-02-25 |
2004-04-21 |
Tokyo Electron Ltd |
Method and apparatus for depositing films
|
|
US6497803B2
(en)
|
2000-05-31 |
2002-12-24 |
Isoflux, Inc. |
Unbalanced plasma generating apparatus having cylindrical symmetry
|
|
US6551477B2
(en)
|
2000-09-25 |
2003-04-22 |
Isoflux, Inc. |
Interlocking cylindrical magnetron cathodes and targets
|
|
US6887356B2
(en)
*
|
2000-11-27 |
2005-05-03 |
Cabot Corporation |
Hollow cathode target and methods of making same
|
|
US6759807B2
(en)
*
|
2002-04-04 |
2004-07-06 |
Veeco Instruments, Inc. |
Multi-grid ion beam source for generating a highly collimated ion beam
|
|
AT414215B
(de)
*
|
2003-02-12 |
2006-10-15 |
Peter Ziger |
Anlage zur plasmaprozessierung
|
|
US20050288773A1
(en)
*
|
2004-01-22 |
2005-12-29 |
Glocker David A |
Radiopaque coating for biomedical devices
|
|
JP2008504104A
(ja)
*
|
2004-06-28 |
2008-02-14 |
イソフラックス・インコーポレイテッド |
生物医学的インプラント用多孔性コーティング
|
|
US7938943B2
(en)
*
|
2006-10-17 |
2011-05-10 |
Von Ardenne Anlagentechnic GmbH |
Supply end block for rotary magnetron
|
|
DE102007049735B4
(de)
*
|
2006-10-17 |
2012-03-29 |
Von Ardenne Anlagentechnik Gmbh |
Versorgungsendblock für ein Rohrmagnetron
|
|
JP5467735B2
(ja)
*
|
2007-07-02 |
2014-04-09 |
東ソー株式会社 |
円筒形スパッタリングターゲット
|
|
DE102008052217B3
(de)
*
|
2008-10-17 |
2011-03-10 |
Johann Wolfgang Goethe-Universität |
Elektrostatischer Ionenkompressor
|
|
US20140061039A1
(en)
*
|
2012-09-05 |
2014-03-06 |
Applied Materials, Inc. |
Target cooling for physical vapor deposition (pvd) processing systems
|
|
CN105659708B
(zh)
*
|
2013-11-22 |
2018-05-01 |
东丽株式会社 |
等离子体电极、等离子体处理电极、cvd电极、等离子体cvd装置及带薄膜的基材的制造方法
|
|
CA3063389C
(en)
|
2019-12-02 |
2021-03-30 |
2S Water Incorporated |
Solution electrode glow discharge apparatus
|
|
CA3068769A1
(en)
|
2020-01-20 |
2021-07-20 |
2S Water Incorporated |
Liquid electrode tip
|
|
WO2022059278A1
(ja)
*
|
2020-09-16 |
2022-03-24 |
株式会社アルバック |
回転式カソードユニット用の駆動ブロック
|