IL40285A - Method and apparatus for generating a glow discharge - Google Patents
Method and apparatus for generating a glow dischargeInfo
- Publication number
- IL40285A IL40285A IL40285A IL4028572A IL40285A IL 40285 A IL40285 A IL 40285A IL 40285 A IL40285 A IL 40285A IL 4028572 A IL4028572 A IL 4028572A IL 40285 A IL40285 A IL 40285A
- Authority
- IL
- Israel
- Prior art keywords
- electrodes
- electrode assembly
- flanges
- magnetic field
- pair
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Plasma Technology (AREA)
Claims (107)
1. A method of generating a glow discharge, comprising the steps of: supporting an electrode assembly in a gaseous environment of approximately I0"2 torr and below; applying electrical voltage to said electrode assembly; and forming a magnetic field of approximately 300 gauss and below, which field defines, together with said electrode assembly, at least one trap for containing substantially all electrons emitted by said electrode assembly and having sufficient energy to further Ionize said working gas.
2. The method as claimed in Claim I, for sputtering and the like of material in said gaseous environment, said electrode assembly including at least one electrode comprising the material which Is to be sputtered.
3. The method as claimed in Claim I or 2, wherein said trap is a trap region whose boundaries are defined by said magnetic field and said electrode assembly.
4. The method as claimed in Claim 3, wherein said electrode assembly includes a pair of electrodes in a post type configuration with the glow discharge being generated externally of said electrodes.
5. The method as claimed in Claim 3, wherein said electrode assembly includes a pair of hollow electrodes, and said glow, discharge is generated Internally of said electrodes.
6. The method as claimed in Claim 3, wherein said electrode assembly includes a pair of electrodes and said magnetic field is "formed to define a single trap with both of said electrodes in concert.
7. The method as claimed in Claim 3, wherein said electrode assembly includes a pair of electrodes and said 40283-2 magnetic field is formed to define at least one completely closed trap with each electrode.
8. A method as claimed In Claim 3, wherein said electrode assembly Includes a pair of electrodes and an r.f. voltage is applied to said electrodes.
9. The method as claimed In Claim 3, wherein said electrode assembly Includes a pair of coaxial electrodes.
10. The method as claimed in Claim 8, and further including: electrically shielding said electrodes and gaseous environment against r.f. leakage.
11. The method as claimed in Claim 3, wherein said electrode assembly includes a pair of electrodes, and said electrodes are coplanar.
12. The method as claimed in Claim II, wherein r.f. electrical voltage Is applied between said electrodes.
13. Glow discharge apparatus, comprising: an electrode assembly; mounting means for supporting said electrode assembly in a low pressure working gas environment of approximately I0~2 torr and below; power supply means for supplying an electrical voltage to said electrode assembly; and magnetic field means for forming a magnetic field of approximately 300 gauss and below which defines with said electrode assembly at least one completely closed trap for containing substantially all electrons emitted by said electrode assembly and having sufficient energy to further ionize said working gas.
14. The apparatus as claimed in Claim 13 for sputtering and the like of material in said gas environment, said electrode assembly including at least one electrode comprising the material which is to be sputtered.
15. The apparatus as claimed in Claim 13 or 14, ·' wherein said trap is a trap region whose boundaries are defined by said magnetic field and said electrode assembly.
16. The apparatus as claimed in Claim 15, comprising a housing for said environment and means through which said housing can be evacuated, and wherein said electrode assembly comprises: cathode means adapted to be coupled to said power supply and including a central elongated portion and ends extending radially therefrom forming a trap region for high and low energy electrons between the ends contiguous to said central portion: and anode means adapted to be coupled to said power sup ly, said anode means being outside said trap region of said cathode means.
17. The apparatus as claimed in Claim 16, wherein said magnetic field has magnetic field lines closely contiguous to and substantially parallel with said central portion of said cathode means, whereby said trap region is formed completely by said magnetic field and surfaces at substantially cathode potential .
18. The apparatus as claimed In Claim 16, wherein said central portion of said cathode means is in the form of a substantially cylindrical barrel and said ends are outwardly extending substantially cylindrical flanges on the ends of said barrel, said trap region being formed between the inward faces of said flanges about the outer periphery of said barrel.
19. The apparatus as claimed in Claim 18, wherein said flanges have substantially parallel faces.
20. The apparatus as claimed in Claim 16, wherein said anode means includes an annular anode mounted about the , t 40285-2 periphery and closely spaced from one of said flanges. ^
21. The apparatus as claimed in Claim 20, wherein the other of said flanges is of larger diameter than said one of said flanges.
22. The apparatus as claimed in Claim 20, including insulator means cou led with the outward face of said one of said flanges but in a spaced relationship therefrom defining an annular gap having a central axis substantially parallel with said field lines.
23. The apparatus as claimed in Claim 16, wherein said magnetic field means includes a field winding mounted within said cathode means.
24. The apparatus as claimed in Claim 23, wherein said cathode means and anode means are adapted to be mounted within a vacuum chamber, and said magnetic field means includes a field winding mounted within said central portion of said cathode means and a field winding mounted on a vacuum chamber for providing a resultant field in said trap region
25. The apparatus as claimed in Claim 16, wherein said central portion of said cathode means is in the form of a substantially cylindrical barrel and said ends are substantially cylindrical flanges located on the respective ends of said barrel and extend inwardly, said trap region being formed between the inward faces of said flanges about the inner periphery of said barrel.
26. The apparatus as claimed in Claim 25, wherein said flanges have substantially parallel faces.
27. The apparatus as claimed in Claim 25, wherein said anode means includes first and second anodes adapted to be electrically connected together, each anode being mounted close †o but Insulated from the respective opposite ends of said cathode means.
28. The apparatus as claimed in Claim 27, wherein said anodes have openings therethrough for allowing a substrate to be moved through one of said anodes, said cathode means and the other of said anodes.
29. The apparatus as claimed in Claim 16, wherein said ends of said cathode means comprise flanges and said central portion of said cathode means is movable through said flanges, said flanges and said central portion being electrically connected together, and said anode means Includes an anode encirci-ling a portion of said cathode means.
30. The apparatus as claimed in Claim 29, wherein said anode encircles said central portion of said cathode means.
31. The apparatus as claimed in Claim 18, wherein said central portion of said cathode means includes a cavity for receiving cooling fluid therein.
32. The apparatus as claimed in Claim 31, wherein at least one of said flanges of said cathode means includes first and second separable complementary sections defining a coolant cavity.
33. The apparatus as claimed in Claim 32, wherein said first and second separable sections are of different materials.
34. The apparatus as claimed in Claim 32, wherein at least one of said separable sections is formed of a material for affecting the shape of said magnetic field lines.
35. The apparatus as claimed in Claim 31, including: a spool member-mounted centrally within said cathode means.
36. The apparatus as claimed in Claim 20, wherein said anode means includes an internal cavity for receiving cool- · ing fludld therein.
37. The apparatus as claimed in Claim 16 wherein said magnetic field means includes ferromagnetic end plates for aiding in forming said magnetic field In said trap region.
38. The apparatus as claimed In Claim 20, wherein the width of said anode is at least as wide as said one of said flanges in a direction parallel to the axis of said anode means.
39. The apparatus as claimed In Claim 16, wherein said cathode means Includes a tube for receiving a substrate therein to be coated, and inturned flanges on the ends of said tube.
40. The apparatus as claimed in Claim 15, wherein said electrode assembly includes a pair of electrodes, and said electrodes are coplanar.
41. The apparatus as claimed in Claim 40, wherein said electrical voltage is r.f. voltage.
42. The apparatus as claimed in Claim 40 , wherein one of said electrodes is a disc and the other of said electrodes is a ring concentric with said disc.
43. The apparatus as claimed in Claim 40, wherein each of said electrodes is semi-circular.
44. The apparatus as claimed in Claim 15, wherein said electrode assembly comprises a pair of electrodes, and said electrical voltage is applied across said pair of electrodes and Is an r.f. voltage.
45. The apparatus as claimed in Claim 43, and further including menas for electrically shielding said electrodes and said glow discharge against r.f. leakage.
46. The apparatus as claimed in Claim 15, wherein y said electrode assem ly comprises a pair of electrodes, and each of said electrodes defines a conical surface of revolution.
47. The apparatus as claimed in Claim 15, wherein said electrode assembly includes a pair of electrodes in a post type configuration with the glow discharge being generated externally of said electrodes.
48. The apparatus as claimed in Claim 15, wherein said electrode assembly includes a pair of hollow electrodes, and said glow discharge is generated Internally of said electrodes.
49. The apparatus as claimed In Claim 15, wherein said electrode assem ly includes a pair of electrodes and said magnetic field is formed to define a single trap with both of said electrodes in concert.
50. The apparatus as claimed In Claim 15, wherein said electrode assem ly includes a pair of electrodes and said magnetic field is formed to define at least one completely closed trap with each electrode.
51. The apparatus as claimed in Claim 15, wherein said trap has axial symmetry about an axis of rotation.
52. A method of generating a glow discharge, comprising the steps of: supporting an electrode assembly within a working gas environment; ap lying electrical voltage to said electrode assembly; and forming a magnetic field which defines, together with said electrode assembly, a plurality of traps for containing substantially all electrons emitted from said electrode assem ly and having sufficient energy to further ionize said working gas.
53. The method as claimed in Claim 52, for sputtering and the like of material in said gaseous envi onment, said electrode assembly including at least one electrode comprising the material which is to be sputtered.
54. The method as claimed in Claim 52 or 53, wherein said traps are trap regions whose boundaries are defined by said magnetic field and said electrode assembly.
55. The method as claimed in Claim 54, wherein said electrode assembly includes a pair of electrodes in a post type configuration with the glow discharge generated externally of said e I ectrodes .
56. The method as claimed in Claim 54, wherein said electrode assembly includes a pair of hollow electrodes, and said glow discharge is generated internally of said electrodes.
57. The method as claimed in Claim 54, wherein said electrode assembly includes a pair of electrodes and said magnetic field is formed to define at least one completely closed trap with each electrode.
58. The method as claimed in Claim 54, wherein said electrode assembly includes a pair of electrodes, and said magnetic field is formed to define a plurality of separate traps with each of said electrodes.
59. The method as claimed in Claim 54, wherein said electrode assembly includes a pair of electrodes and an r.f. voltage is applied to said electrodes.
60. The method as claimed in Claim 57, wherein said magnetic field is formed to define simultaneously at least one separate trap with each electrode while also forming a trap with both of said electrodes in concert.
61. The method as claimed in Claim 54, wherein said electrode assembly includes a pair of coaxial electrodes.
62. The method as claimed in Claim 59, and further including: electrically shielding said electrodes and gaseous environment against r.f. leakage.
63. The method as claimed in Claim 54, wherein said electrode assembly includes a pair of electrodes, and said electrodes are coplanar.
64. The method as claimed in Claim 63, wherein r.f. electrical voltage is applied between said electrodes.
65. Glow discharge apparatus, comprising: an electrode assembly; mounting means for supporting said electrode assembly in a low pressure working gas environment; power supply means for supplying an electrical voltage to said electrode assembly; and magnetic field means for forming a magnetic field which defines with said electrode assembly a plurality of traps for containing substantially all electrons emitted by said electrode assembly and having sufficient energy to further ionize said working gas.
66. The apparatus as claimed in Claim 65 for sputtering and the like of material in said gas environment, said electrode assembly including at least one electrode comprising the material which is to ;be sputtered.
67. The apparatus as claimed in Claim 65 or 66, wherein said traps are trap regions whose boundaries are defined by said magnetic field and said electrode assembly.
68. The apparatus as claimed in Claim 67, comprising a housing for said environment and means through which said housing can be evacuated, and wherein said electrode assembly comprises: cathode means adapted to be coupled to said power supply and including a central elongated portion and ends extending radially therefrom forming trap regions for high and low energy electrons between the ends contiguous to said central 4028-5-2 portion: and anode means adapted to be coupled to said power supply, said anode means being outside said trap regions of said cathode means.
69. The apparatus as claimed in Claim 68, wherein said magnetic field has magnetic field lines closely contiguous to and substantially parallel with said central portion of said cathode means, whereby said trap regions are formed completely by said magnetic field and surfaces at substantial ly cathode potential .
70. The apparatus as claimed in Claim 68, wherein said central portion of said cathode means is in the form of a substantially cylindrical barrel and said ends are outwardly extending substantially cylindrical flanges on the ends of said barrel, said trap regions being formed between the inward faces of said flanges about the outer periphery of said barrel..
71. The apparatus as claimed in Claim 70, wherein said flanges have substantially parallel faces.
72. The apparatus as claimed in Claim 70, wherein said anode means includes an annular anode mounted about the periphery and closely spaced from one of said flanges.
73. The apparatus as claimed in Claim 72, wherein the other of said flanges is of larger diameter than said one of said flanges.
74. The apparatus as claimed in Claim 72, including insulator means coupled with the outward face of said one of said flanges but in a spaced relationship therefrom defining an annular gap having a central axis substantially parallel with said field I ines.
75. The apparatus as claimed in Claim 68, wherein said magnetic field means includes a field winding mounted within said cathode means.
76. The apparatus as claimed in Claim 75, wherein said cathode means and anode means are adapted to be mounted within a vacuum chamber, and said magnetic field means includes a field winding mounted within said central portion of said cathode means and a field winding mounted on a vacuum chamber for providing a resultant field in said trap region.
77. The apparatus as claimed in Claim 68, wherein said central portion of said cathode means is in the form of a substantially cylindrical barrel and said ends are substantially cylindrical flanges located on the respective ends of said barrel and extend inwardly, said trap region being formed between the inward faces of said flanges about the inner periphery of said barrel.
78. The apparatus as claimed in Claim 77, wherein said flanges have substantially parallel faces.
79. The apparatus as claimed in Claim 77, wherein said anode means includes first and second anodes adapted to be electrically connected together, each anode being mounted close to but insulated from the respective opposite ends of said cathode means.
80. The apparatus as claimed in Claim 79, wherein said anodes have openings therethrough for allowing a substrate to be moved through one of said anodes, said cathode means and the other of said anodes.
81. The apparatus as claimed in Claim 68, wherein said ends of said cathode means comprise flanges and said central portion of said cathode means is movable through said flanges, said flanges and said central portion being electrically connected together, and said anode means includes an anode encircling a portion of said cathode means.
82. The apparatus as claimed in Claim 81, wherein said anode encircles said central portion of said cathode means.
83. The apparatus as claimed in Claim 70, wherein said central portion of said cathode means includes a cavity for receiving cooling fluid therein.
84. The apparatus as claimed in Claim 83, wherein at least one of said flanges of said cathode means includes first and second separable complementary sections defining a coolant cavity.
85. The apparatus as claimed in Claim 84, wherein said first and second separable sections are of different materials.
86. The apparatus as claimed in Claim 84, wherein at least one of said separable sections is formed of a material for affecting the shape of said magnetic field lines.
87. The apparatus as claimed in Claim 83, including: a spool member mounted centrally within said cathode means.
88. The apparatus as claimed in Claim 72, wherein said anode means includes an internal cavity for receiving cooling fluid therein.
89. The apparatus as claimed in Claim 68, wherein said magnetic ield means includes ferromagnetic end plates for aiding in forming said magnetic field in said trap regions.
90. The apparatus as claimed in Claim 72, wherein the width of said anode is at least as wide as said one of said flanges in a direction parallel to the axis of said anode means.
91. The apparatus as claimed in Claim 68, wherein 4028-5-2 said cathode includes a tube for receiving a substrate therein to be coated, and inturned flanges on the ends of said tube.
92. The apparatus as claimed in Claim 67, wherein said electrode assembly includes a pair of electrodes, and said electrodes are coplanar.
93. The apparatus as claimed in Claim 92, wherein said electrical voltage is an r.f. voltage.
94. The apparatus as claimed in Claim 92, wherein one of said electrodes is a disc and the other of said electrodes is a ring concentric with said disc.
95. The apparatus as claimed in Claim 92, wherein each of said electrodes is semi -ci rcul ar.
96. The apparatus as claimed in Claim 67, wherein said electrode assembly comprises a pair of electrodes, and said electrical voltage is applied across said pair of electrodes and is an r.f. voltage.
97. The apparatus as claimed in Claim 96, and further including means for electrically shielding said electrodes and said glow discharge against r.f. leakage.
98. The apparatus as claimed in Claim 67, wherein said electrode assembly comprises a pair of electrodes, and each of said electrodes defines a conical surface of revolution.
99. The apparatus as claimed in Claim 67, wherein said electrode assembly includes a pair of electrodes in a post type configuration with the glow discharge being generated externally of said electrodes.
100. The apparatus -as claimed in Claim 67, wherein said electrode assembly includes a pair of hollow electrodes, and said glow discharge is generated internal ly of said electrodes.
101. The apparatus as claimed in Claim 67, wherein said electrode assembly includes a pair of electrodes and said magnetic field is formed to define at least one completely closed trap with each electrode.
102. The apparatus as claimed in Claim 67, wherein said trap has axial symmetry about an axis of rotation.
103. A cathode structure for use in electrode glow discharge apparatus comprising cathode means including a central elongated portion having flanges at the ends thereof, and means coupling together said central portion and said flanges, said flanges and central portion having a cavity therein,, and spool means mounted within said cathode means, said spool means having a central elongated portion mounted within the central portion of said cathode means and having wing portions mounted within the respective flanges of said cathode means;
104. The apparatus as claimed in Claim 103, wherein said central portion of said cathode means is in the form of a substantially cylindrical barrel and said ends are outwardly extending substantially cyl indrical flanges on the ends of said barrel .
105. The apparatus as claimed in Claim 103, wherein said cathode means is adapted to be mounted within a vacuum chamber, and includes magnetic field means having a field winding mounted within said central portion of said cathode means.
106. The apparatus as claimed in Claim 103, wherein said cathode means is hollow and said ends extend inwardly.
107. The apparatus as claimed in Claim 103, wherein said central portion of said cathode means includes a cavity for receiving cooling fluid therein. For the Applicants DR. RE1NH0LD C0HN AND PARTNERS B
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US178240A US3884793A (en) | 1971-09-07 | 1971-09-07 | Electrode type glow discharge apparatus |
| US25450472A | 1972-05-18 | 1972-05-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL40285A0 IL40285A0 (en) | 1972-11-28 |
| IL40285A true IL40285A (en) | 1976-01-30 |
Family
ID=26874127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL40285A IL40285A (en) | 1971-09-07 | 1972-09-04 | Method and apparatus for generating a glow discharge |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3884793A (en) |
| CA (1) | CA1006116A (en) |
| CH (1) | CH589940A5 (en) |
| DE (3) | DE2243708A1 (en) |
| FR (2) | FR2152633B1 (en) |
| GB (2) | GB1420062A (en) |
| IL (1) | IL40285A (en) |
| NL (1) | NL7211911A (en) |
Families Citing this family (80)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4166018A (en) * | 1974-01-31 | 1979-08-28 | Airco, Inc. | Sputtering process and apparatus |
| US3956093A (en) * | 1974-12-16 | 1976-05-11 | Airco, Inc. | Planar magnetron sputtering method and apparatus |
| JPS51117933A (en) * | 1975-04-10 | 1976-10-16 | Tokuda Seisakusho | Spattering apparatus |
| FR2324755A1 (en) * | 1975-09-19 | 1977-04-15 | Anvar | HIGH SPEED OF DEPOSIT CATHODIC SPRAY DEVICE |
| US4046660A (en) * | 1975-12-29 | 1977-09-06 | Bell Telephone Laboratories, Incorporated | Sputter coating with charged particle flux control |
| NL7607473A (en) * | 1976-07-07 | 1978-01-10 | Philips Nv | SPRAYING DEVICE AND METHOD FOR SPRAYING WITH SUCH A DEVICE |
| US4179351A (en) * | 1976-09-09 | 1979-12-18 | Hewlett-Packard Company | Cylindrical magnetron sputtering source |
| DE2655942A1 (en) * | 1976-12-10 | 1978-06-15 | Tokuda Seisakusho Kawasaki Kk | Metals deposited by cathodic sputtering - in appts. using magnetic field to increase sputtering rate |
| US4126530A (en) * | 1977-08-04 | 1978-11-21 | Telic Corporation | Method and apparatus for sputter cleaning and bias sputtering |
| NL7902846A (en) * | 1978-04-12 | 1979-10-16 | Battelle Memorial Institute | PROCESS FOR THE MANUFACTURE OF FUEL CELL ELECTRODES, DEVICE FOR APPLYING THIS PROCEDURE, AND ELECTRODES ARISING FROM THIS PROCESS. |
| CA1141704A (en) * | 1978-08-21 | 1983-02-22 | Charles F. Morrison, Jr. | Magnetically enhanced sputtering device |
| DE3070700D1 (en) * | 1980-08-08 | 1985-07-04 | Battelle Development Corp | Cylindrical magnetron sputtering cathode |
| ATE10512T1 (en) * | 1980-08-08 | 1984-12-15 | Battelle Development Corporation | DEVICE FOR COATING SUBSTRATES USING HIGH POWER CATHODE SPRAYING AND SPRAYING CATHODE FOR THIS DEVICE. |
| US4290877A (en) * | 1980-09-08 | 1981-09-22 | The United States Of America As Represented By The Secretary Of The Interior | Sputtering apparatus for coating elongated tubes and strips |
| DE3107914A1 (en) * | 1981-03-02 | 1982-09-16 | Leybold-Heraeus GmbH, 5000 Köln | METHOD AND DEVICE FOR COATING MOLDED PARTS BY CATODENSIONING |
| CH649578A5 (en) * | 1981-03-27 | 1985-05-31 | Ulvac Corp | HIGH-SPEED CATHODE SPRAYING DEVICE. |
| US4525264A (en) * | 1981-12-07 | 1985-06-25 | Ford Motor Company | Cylindrical post magnetron sputtering system |
| US4525262A (en) * | 1982-01-26 | 1985-06-25 | Materials Research Corporation | Magnetron reactive bias sputtering method and apparatus |
| US4422896A (en) * | 1982-01-26 | 1983-12-27 | Materials Research Corporation | Magnetically enhanced plasma process and apparatus |
| US4376025A (en) * | 1982-06-14 | 1983-03-08 | Battelle Development Corporation | Cylindrical cathode for magnetically-enhanced sputtering |
| US4581118A (en) * | 1983-01-26 | 1986-04-08 | Materials Research Corporation | Shaped field magnetron electrode |
| JPS60221563A (en) * | 1984-04-17 | 1985-11-06 | Ulvac Corp | Bias sputtering device |
| US4865712A (en) * | 1984-05-17 | 1989-09-12 | Varian Associates, Inc. | Apparatus for manufacturing planarized aluminum films |
| DE3427587A1 (en) * | 1984-07-26 | 1986-02-06 | Leybold-Heraeus GmbH, 5000 Köln | SPRAYING DEVICE FOR CATODE SPRAYING SYSTEMS |
| DE3442208C3 (en) * | 1984-11-19 | 1998-06-10 | Leybold Ag | Method and device for producing hard carbon layers |
| US4711767A (en) * | 1985-02-05 | 1987-12-08 | Psi Star | Plasma reactor with voltage transformer |
| US4600563A (en) * | 1985-02-05 | 1986-07-15 | Psi Star Incorporated | Plasma reactor with voltage transformer |
| DE3527626A1 (en) * | 1985-08-01 | 1987-02-05 | Leybold Heraeus Gmbh & Co Kg | SPRAYING CATODE ACCORDING TO THE MAGNETRON PRINCIPLE |
| US4668338A (en) * | 1985-12-30 | 1987-05-26 | Applied Materials, Inc. | Magnetron-enhanced plasma etching process |
| DE3636524A1 (en) * | 1986-10-27 | 1988-04-28 | Vtu Angel Kancev | Apparatus for applying coatings in a vacuum by magnetron atomisation |
| DE3727901A1 (en) * | 1987-08-21 | 1989-03-02 | Leybold Ag | SPRAYING CATHODE ACCORDING TO THE MAGNETRON PRINCIPLE |
| BE1001027A3 (en) * | 1987-10-21 | 1989-06-13 | Bekaert Sa Nv | METHOD AND DEVICE FOR CLEANING an elongated metal substrate such as a wire, A BAND, A CORD, ETC., AND ACCORDING TO THAT METHOD AND CLEANED SUBSTRATES WITH SUCH substrates ENHANCED OBJECTS OF POLYMER MATERIAL. |
| JP2673807B2 (en) * | 1987-10-30 | 1997-11-05 | パイオニア株式会社 | Method for manufacturing magneto-optical recording medium |
| US4842703A (en) * | 1988-02-23 | 1989-06-27 | Eaton Corporation | Magnetron cathode and method for sputter coating |
| US4810347A (en) * | 1988-03-21 | 1989-03-07 | Eaton Corporation | Penning type cathode for sputter coating |
| DE3844064A1 (en) * | 1988-12-28 | 1990-07-05 | Leybold Ag | MAGNETRON PRINCIPLE CATALOG SPRAYING DEVICE WITH A HOLLOW CATODE AND A CYLINDRICAL TARGET |
| US4927515A (en) * | 1989-01-09 | 1990-05-22 | The Board Of Trustees Of The Leland Stanford Junior University | Circular magnetron sputtering device |
| DE3908252C2 (en) * | 1989-03-14 | 1996-06-20 | Leybold Ag | Atomizing cathode based on the magnetron principle |
| US4957605A (en) * | 1989-04-17 | 1990-09-18 | Materials Research Corporation | Method and apparatus for sputter coating stepped wafers |
| US5178743A (en) * | 1989-06-15 | 1993-01-12 | Microelectronics And Computer Technology Corporation | Cylindrical magnetron sputtering system |
| DE4018914C1 (en) * | 1990-06-13 | 1991-06-06 | Leybold Ag, 6450 Hanau, De | |
| US5073245A (en) * | 1990-07-10 | 1991-12-17 | Hedgcoth Virgle L | Slotted cylindrical hollow cathode/magnetron sputtering device |
| US5437778A (en) * | 1990-07-10 | 1995-08-01 | Telic Technologies Corporation | Slotted cylindrical hollow cathode/magnetron sputtering device |
| DE4100291C1 (en) * | 1991-01-08 | 1991-10-02 | Leybold Ag, 6450 Hanau, De | |
| JPH06508001A (en) * | 1991-04-19 | 1994-09-08 | サーフィス ソリューションズ インコーポレーテッド | Linear magnetron sputtering method and apparatus |
| GB2256085A (en) * | 1991-05-13 | 1992-11-25 | Integrated Plasma Ltd | Plasma deposition and etching of substrates. |
| US5228963A (en) * | 1991-07-01 | 1993-07-20 | Himont Incorporated | Hollow-cathode magnetron and method of making thin films |
| DE4135939A1 (en) * | 1991-10-31 | 1993-05-06 | Leybold Ag, 6450 Hanau, De | SPRAYING CATHODE |
| DE4138793C2 (en) * | 1991-11-26 | 2001-03-01 | Leybold Ag | Method and device for coating a substrate, in particular with electrically non-conductive layers |
| US5415757A (en) * | 1991-11-26 | 1995-05-16 | Leybold Aktiengesellschaft | Apparatus for coating a substrate with electrically nonconductive coatings |
| US5685961A (en) * | 1992-03-27 | 1997-11-11 | P & D Medical Coatings, Inc. | Method for fabrication of metallized medical devices |
| DE4333825C1 (en) * | 1993-09-28 | 1995-02-23 | Mat Gmbh | Apparatus for coating elongated flexible products |
| US6217716B1 (en) | 1998-05-06 | 2001-04-17 | Novellus Systems, Inc. | Apparatus and method for improving target erosion in hollow cathode magnetron sputter source |
| US6432286B1 (en) | 1998-06-10 | 2002-08-13 | David A. Glocker | Conical sputtering target |
| US6235170B1 (en) | 1998-06-10 | 2001-05-22 | David A. Glocker | Conical sputtering target |
| US6066242A (en) * | 1998-06-10 | 2000-05-23 | David A. Glocker | Conical sputtering target |
| US6440220B1 (en) * | 1998-10-23 | 2002-08-27 | Goodrich Corporation | Method and apparatus for inhibiting infiltration of a reactive gas into porous refractory insulation |
| US6352430B1 (en) | 1998-10-23 | 2002-03-05 | Goodrich Corporation | Method and apparatus for cooling a CVI/CVD furnace |
| US6162298A (en) * | 1998-10-28 | 2000-12-19 | The B. F. Goodrich Company | Sealed reactant gas inlet for a CVI/CVD furnace |
| US6193853B1 (en) | 1999-02-25 | 2001-02-27 | Cametoid Limited | Magnetron sputtering method and apparatus |
| EP1063319B1 (en) | 1999-06-04 | 2005-12-07 | Goodrich Corporation | Method and apparatus for cooling a CVI/CVD furnace |
| EP1063318B1 (en) | 1999-06-04 | 2004-08-25 | Goodrich Corporation | Combination CVI/CVD and heat treat susceptor lid |
| DE60005888T2 (en) | 1999-06-04 | 2004-07-29 | Goodrich Corp. | Method and device for pressure measurement in a CVD / CVI chamber |
| TW584905B (en) | 2000-02-25 | 2004-04-21 | Tokyo Electron Ltd | Method and apparatus for depositing films |
| US6497803B2 (en) | 2000-05-31 | 2002-12-24 | Isoflux, Inc. | Unbalanced plasma generating apparatus having cylindrical symmetry |
| US6551477B2 (en) | 2000-09-25 | 2003-04-22 | Isoflux, Inc. | Interlocking cylindrical magnetron cathodes and targets |
| US6887356B2 (en) * | 2000-11-27 | 2005-05-03 | Cabot Corporation | Hollow cathode target and methods of making same |
| US6759807B2 (en) | 2002-04-04 | 2004-07-06 | Veeco Instruments, Inc. | Multi-grid ion beam source for generating a highly collimated ion beam |
| AT414215B (en) * | 2003-02-12 | 2006-10-15 | Peter Ziger | ANNEX TO PLASMA PROCESSING |
| US20050288773A1 (en) * | 2004-01-22 | 2005-12-29 | Glocker David A | Radiopaque coating for biomedical devices |
| JP2008504104A (en) * | 2004-06-28 | 2008-02-14 | イソフラックス・インコーポレイテッド | Porous coating for biomedical implants |
| US7938943B2 (en) * | 2006-10-17 | 2011-05-10 | Von Ardenne Anlagentechnic GmbH | Supply end block for rotary magnetron |
| DE102007049735B4 (en) * | 2006-10-17 | 2012-03-29 | Von Ardenne Anlagentechnik Gmbh | Supply end block for a tubular magnetron |
| JP5467735B2 (en) * | 2007-07-02 | 2014-04-09 | 東ソー株式会社 | Cylindrical sputtering target |
| DE102008052217B3 (en) * | 2008-10-17 | 2011-03-10 | Johann Wolfgang Goethe-Universität | Electrostatic ion compressor |
| US20140061039A1 (en) * | 2012-09-05 | 2014-03-06 | Applied Materials, Inc. | Target cooling for physical vapor deposition (pvd) processing systems |
| KR102188988B1 (en) * | 2013-11-22 | 2020-12-09 | 도레이 카부시키가이샤 | Plasma electrode, plasma processing electrode, cvd electrode, plasma cvd device, and method for manufacturing substrate with thin film |
| CA3063389C (en) | 2019-12-02 | 2021-03-30 | 2S Water Incorporated | Solution electrode glow discharge apparatus |
| CA3068769A1 (en) | 2020-01-20 | 2021-07-20 | 2S Water Incorporated | Liquid electrode tip |
| KR20220139382A (en) * | 2020-09-16 | 2022-10-14 | 가부시키가이샤 알박 | Drive block for rotary cathode unit |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3282815A (en) * | 1963-07-01 | 1966-11-01 | Ibm | Magnetic control of film deposition |
| US3282816A (en) * | 1963-09-16 | 1966-11-01 | Ibm | Process of cathode sputtering from a cylindrical cathode |
| US3369991A (en) * | 1965-01-28 | 1968-02-20 | Ibm | Apparatus for cathode sputtering including a shielded rf electrode |
| US3507774A (en) * | 1967-06-02 | 1970-04-21 | Nat Res Corp | Low energy sputtering apparatus for operation below one micron pressure |
-
1971
- 1971-09-07 US US178240A patent/US3884793A/en not_active Expired - Lifetime
-
1972
- 1972-09-01 NL NL7211911A patent/NL7211911A/xx active Search and Examination
- 1972-09-04 IL IL40285A patent/IL40285A/en unknown
- 1972-09-04 GB GB1014075A patent/GB1420062A/en not_active Expired
- 1972-09-04 GB GB4086372A patent/GB1420061A/en not_active Expired
- 1972-09-05 CA CA150,903A patent/CA1006116A/en not_active Expired
- 1972-09-05 FR FR7231413A patent/FR2152633B1/fr not_active Expired
- 1972-09-06 DE DE2243708A patent/DE2243708A1/en not_active Withdrawn
- 1972-09-06 DE DE2264437*A patent/DE2264437A1/en not_active Withdrawn
- 1972-09-06 DE DE2264436*A patent/DE2264436A1/en not_active Withdrawn
- 1972-09-07 CH CH1313272A patent/CH589940A5/xx not_active IP Right Cessation
-
1973
- 1973-04-03 FR FR7311995A patent/FR2168124B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2152633B1 (en) | 1978-06-02 |
| DE2264436A1 (en) | 1973-12-20 |
| US3884793A (en) | 1975-05-20 |
| GB1420062A (en) | 1976-01-07 |
| CH589940A5 (en) | 1977-07-29 |
| IL40285A0 (en) | 1972-11-28 |
| FR2168124A1 (en) | 1973-08-24 |
| NL7211911A (en) | 1973-03-09 |
| DE2264437A1 (en) | 1973-10-31 |
| DE2243708A1 (en) | 1973-04-26 |
| FR2152633A1 (en) | 1973-04-27 |
| FR2168124B1 (en) | 1976-12-03 |
| GB1420061A (en) | 1976-01-07 |
| CA1006116A (en) | 1977-03-01 |
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