GB1402820A - Cathode-sputtering apparatus - Google Patents

Cathode-sputtering apparatus

Info

Publication number
GB1402820A
GB1402820A GB4857773A GB4857773A GB1402820A GB 1402820 A GB1402820 A GB 1402820A GB 4857773 A GB4857773 A GB 4857773A GB 4857773 A GB4857773 A GB 4857773A GB 1402820 A GB1402820 A GB 1402820A
Authority
GB
United Kingdom
Prior art keywords
chamber
sputtering
cathode
electrodes
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4857773A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1402820A publication Critical patent/GB1402820A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

1402820 Cathode sputtering apparatus SIEMENS AG 18 Oct 1973 [2 Nov 1972] 48577/73 Heading C7F Cathode sputtering apparatus comprises an input airlock 1, a heating chamber 3, a sputtering chamber 5, a cooling chamber 8 and an output airlock 10, chamber 5 comprising two cylindrical tubes 51 of insulating material connected by a metal ring 6 which carries cathode sputtering electrodes and connections 15 for operating voltage, and connections for gas supply 16 and watercooling 14, and having its sputtering electrodes surrounding a plasma space, there being a HF coil 12 around the chamber for plasma production, there being a bellows connection 4 at each end of chamber 5 and a continuous transfer device 7 for conveying pairs of substrates 20 back-to-back in a vertical position through the apparatus. The plasma electrons may be controlled by a low frequency axial magnetic field from coils 13, and pulsed D.C. obtained by single-phase bridge rectification and co-phasal with the magnetic field may be used for the sputtering voltage. Two types of sputtering structure are disclosed (1) comprising four part-cylindrical electrodes 52, two of these being cathodes and subtending an angle of 135 degrees at the substrates or (2) a cylindrical anode structure having between it and the substrates a series of parallel cathode rods subtending a similar angle; electrodes 52 may be water-cooled by pipes 55, and anode 56 and cathode 54 serve to ensure uniform deposition at the ends of the chamber 5; a series of coating chambers may be used.
GB4857773A 1972-11-02 1973-10-18 Cathode-sputtering apparatus Expired GB1402820A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2253769A DE2253769C3 (en) 1972-11-02 1972-11-02 Cathode sputtering system with continuous substrate flow

Publications (1)

Publication Number Publication Date
GB1402820A true GB1402820A (en) 1975-08-13

Family

ID=5860714

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4857773A Expired GB1402820A (en) 1972-11-02 1973-10-18 Cathode-sputtering apparatus

Country Status (6)

Country Link
US (1) US3852181A (en)
JP (1) JPS4977839A (en)
CH (1) CH589725A5 (en)
DE (1) DE2253769C3 (en)
FR (1) FR2205584B1 (en)
GB (1) GB1402820A (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4116806A (en) * 1977-12-08 1978-09-26 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4175030A (en) * 1977-12-08 1979-11-20 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4274936A (en) * 1979-04-30 1981-06-23 Advanced Coating Technology, Inc. Vacuum deposition system and method
DE2950997C2 (en) * 1979-12-18 1986-10-09 Nihon Shinku Gijutsu K.K., Chigasaki, Kanagawa Device for coating
US4423701A (en) * 1982-03-29 1984-01-03 Energy Conversion Devices, Inc. Glow discharge deposition apparatus including a non-horizontally disposed cathode
JPS62230977A (en) * 1986-04-01 1987-10-09 Seiko Epson Corp Thin film producing device
US4812217A (en) * 1987-04-27 1989-03-14 American Telephone And Telegraph Company, At&T Bell Laboratories Method and apparatus for feeding and coating articles in a controlled atmosphere
WO1992017621A1 (en) * 1991-04-04 1992-10-15 Conner Peripherals, Inc. Apparatus and method for high throughput sputtering
US6193853B1 (en) 1999-02-25 2001-02-27 Cametoid Limited Magnetron sputtering method and apparatus
US6290821B1 (en) 1999-07-15 2001-09-18 Seagate Technology Llc Sputter deposition utilizing pulsed cathode and substrate bias power
US6833031B2 (en) 2000-03-21 2004-12-21 Wavezero, Inc. Method and device for coating a substrate
DE10320985B4 (en) * 2003-05-09 2005-03-24 Interpane Entwicklungs- Und Beratungsgesellschaft Mbh & Co.Kg Device for coating a substrate with a suction chamber separated from the vacuum chamber
TWI337517B (en) * 2008-03-04 2011-02-11 Inventec Corp Trace carrier
CZ2015837A3 (en) * 2015-11-27 2017-03-01 Shm, S. R. O. A cylindrical cathode for applying layers by the PVD method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294670A (en) * 1963-10-07 1966-12-27 Western Electric Co Apparatus for processing materials in a controlled atmosphere
US3521765A (en) * 1967-10-31 1970-07-28 Western Electric Co Closed-end machine for processing articles in a controlled atmosphere
US3616402A (en) * 1968-05-31 1971-10-26 Western Electric Co Sputtering method and apparatus
US3793167A (en) * 1972-06-01 1974-02-19 Globe Amerada Glass Co Apparatus for manufacturing metal-coated glass

Also Published As

Publication number Publication date
US3852181A (en) 1974-12-03
DE2253769B2 (en) 1978-11-02
CH589725A5 (en) 1977-07-15
FR2205584B1 (en) 1977-03-11
FR2205584A1 (en) 1974-05-31
JPS4977839A (en) 1974-07-26
DE2253769C3 (en) 1979-07-12
DE2253769A1 (en) 1974-05-09

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee