GB1402820A - Cathode-sputtering apparatus - Google Patents
Cathode-sputtering apparatusInfo
- Publication number
- GB1402820A GB1402820A GB4857773A GB4857773A GB1402820A GB 1402820 A GB1402820 A GB 1402820A GB 4857773 A GB4857773 A GB 4857773A GB 4857773 A GB4857773 A GB 4857773A GB 1402820 A GB1402820 A GB 1402820A
- Authority
- GB
- United Kingdom
- Prior art keywords
- chamber
- sputtering
- cathode
- electrodes
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
1402820 Cathode sputtering apparatus SIEMENS AG 18 Oct 1973 [2 Nov 1972] 48577/73 Heading C7F Cathode sputtering apparatus comprises an input airlock 1, a heating chamber 3, a sputtering chamber 5, a cooling chamber 8 and an output airlock 10, chamber 5 comprising two cylindrical tubes 51 of insulating material connected by a metal ring 6 which carries cathode sputtering electrodes and connections 15 for operating voltage, and connections for gas supply 16 and watercooling 14, and having its sputtering electrodes surrounding a plasma space, there being a HF coil 12 around the chamber for plasma production, there being a bellows connection 4 at each end of chamber 5 and a continuous transfer device 7 for conveying pairs of substrates 20 back-to-back in a vertical position through the apparatus. The plasma electrons may be controlled by a low frequency axial magnetic field from coils 13, and pulsed D.C. obtained by single-phase bridge rectification and co-phasal with the magnetic field may be used for the sputtering voltage. Two types of sputtering structure are disclosed (1) comprising four part-cylindrical electrodes 52, two of these being cathodes and subtending an angle of 135 degrees at the substrates or (2) a cylindrical anode structure having between it and the substrates a series of parallel cathode rods subtending a similar angle; electrodes 52 may be water-cooled by pipes 55, and anode 56 and cathode 54 serve to ensure uniform deposition at the ends of the chamber 5; a series of coating chambers may be used.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2253769A DE2253769C3 (en) | 1972-11-02 | 1972-11-02 | Cathode sputtering system with continuous substrate flow |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1402820A true GB1402820A (en) | 1975-08-13 |
Family
ID=5860714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4857773A Expired GB1402820A (en) | 1972-11-02 | 1973-10-18 | Cathode-sputtering apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US3852181A (en) |
JP (1) | JPS4977839A (en) |
CH (1) | CH589725A5 (en) |
DE (1) | DE2253769C3 (en) |
FR (1) | FR2205584B1 (en) |
GB (1) | GB1402820A (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4116806A (en) * | 1977-12-08 | 1978-09-26 | Battelle Development Corporation | Two-sided planar magnetron sputtering apparatus |
US4175030A (en) * | 1977-12-08 | 1979-11-20 | Battelle Development Corporation | Two-sided planar magnetron sputtering apparatus |
US4274936A (en) * | 1979-04-30 | 1981-06-23 | Advanced Coating Technology, Inc. | Vacuum deposition system and method |
DE2950997C2 (en) * | 1979-12-18 | 1986-10-09 | Nihon Shinku Gijutsu K.K., Chigasaki, Kanagawa | Device for coating |
US4423701A (en) * | 1982-03-29 | 1984-01-03 | Energy Conversion Devices, Inc. | Glow discharge deposition apparatus including a non-horizontally disposed cathode |
JPS62230977A (en) * | 1986-04-01 | 1987-10-09 | Seiko Epson Corp | Thin film producing device |
US4812217A (en) * | 1987-04-27 | 1989-03-14 | American Telephone And Telegraph Company, At&T Bell Laboratories | Method and apparatus for feeding and coating articles in a controlled atmosphere |
WO1992017621A1 (en) * | 1991-04-04 | 1992-10-15 | Conner Peripherals, Inc. | Apparatus and method for high throughput sputtering |
US6193853B1 (en) | 1999-02-25 | 2001-02-27 | Cametoid Limited | Magnetron sputtering method and apparatus |
US6290821B1 (en) | 1999-07-15 | 2001-09-18 | Seagate Technology Llc | Sputter deposition utilizing pulsed cathode and substrate bias power |
US6833031B2 (en) | 2000-03-21 | 2004-12-21 | Wavezero, Inc. | Method and device for coating a substrate |
DE10320985B4 (en) * | 2003-05-09 | 2005-03-24 | Interpane Entwicklungs- Und Beratungsgesellschaft Mbh & Co.Kg | Device for coating a substrate with a suction chamber separated from the vacuum chamber |
TWI337517B (en) * | 2008-03-04 | 2011-02-11 | Inventec Corp | Trace carrier |
CZ2015837A3 (en) * | 2015-11-27 | 2017-03-01 | Shm, S. R. O. | A cylindrical cathode for applying layers by the PVD method |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3294670A (en) * | 1963-10-07 | 1966-12-27 | Western Electric Co | Apparatus for processing materials in a controlled atmosphere |
US3521765A (en) * | 1967-10-31 | 1970-07-28 | Western Electric Co | Closed-end machine for processing articles in a controlled atmosphere |
US3616402A (en) * | 1968-05-31 | 1971-10-26 | Western Electric Co | Sputtering method and apparatus |
US3793167A (en) * | 1972-06-01 | 1974-02-19 | Globe Amerada Glass Co | Apparatus for manufacturing metal-coated glass |
-
1972
- 1972-11-02 DE DE2253769A patent/DE2253769C3/en not_active Expired
-
1973
- 1973-10-18 GB GB4857773A patent/GB1402820A/en not_active Expired
- 1973-10-25 CH CH1502773A patent/CH589725A5/xx not_active IP Right Cessation
- 1973-10-29 FR FR7338442A patent/FR2205584B1/fr not_active Expired
- 1973-10-30 US US00411088A patent/US3852181A/en not_active Expired - Lifetime
- 1973-11-02 JP JP48123912A patent/JPS4977839A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US3852181A (en) | 1974-12-03 |
DE2253769B2 (en) | 1978-11-02 |
CH589725A5 (en) | 1977-07-15 |
FR2205584B1 (en) | 1977-03-11 |
FR2205584A1 (en) | 1974-05-31 |
JPS4977839A (en) | 1974-07-26 |
DE2253769C3 (en) | 1979-07-12 |
DE2253769A1 (en) | 1974-05-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |