FR2205584B1 - - Google Patents

Info

Publication number
FR2205584B1
FR2205584B1 FR7338442A FR7338442A FR2205584B1 FR 2205584 B1 FR2205584 B1 FR 2205584B1 FR 7338442 A FR7338442 A FR 7338442A FR 7338442 A FR7338442 A FR 7338442A FR 2205584 B1 FR2205584 B1 FR 2205584B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7338442A
Other languages
French (fr)
Other versions
FR2205584A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2205584A1 publication Critical patent/FR2205584A1/fr
Application granted granted Critical
Publication of FR2205584B1 publication Critical patent/FR2205584B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
FR7338442A 1972-11-02 1973-10-29 Expired FR2205584B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2253769A DE2253769C3 (en) 1972-11-02 1972-11-02 Cathode sputtering system with continuous substrate flow

Publications (2)

Publication Number Publication Date
FR2205584A1 FR2205584A1 (en) 1974-05-31
FR2205584B1 true FR2205584B1 (en) 1977-03-11

Family

ID=5860714

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7338442A Expired FR2205584B1 (en) 1972-11-02 1973-10-29

Country Status (6)

Country Link
US (1) US3852181A (en)
JP (1) JPS4977839A (en)
CH (1) CH589725A5 (en)
DE (1) DE2253769C3 (en)
FR (1) FR2205584B1 (en)
GB (1) GB1402820A (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4116806A (en) * 1977-12-08 1978-09-26 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4175030A (en) * 1977-12-08 1979-11-20 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4274936A (en) * 1979-04-30 1981-06-23 Advanced Coating Technology, Inc. Vacuum deposition system and method
DE2950997C2 (en) * 1979-12-18 1986-10-09 Nihon Shinku Gijutsu K.K., Chigasaki, Kanagawa Device for coating
US4423701A (en) * 1982-03-29 1984-01-03 Energy Conversion Devices, Inc. Glow discharge deposition apparatus including a non-horizontally disposed cathode
JPS62230977A (en) * 1986-04-01 1987-10-09 Seiko Epson Corp Thin film producing device
US4812217A (en) * 1987-04-27 1989-03-14 American Telephone And Telegraph Company, At&T Bell Laboratories Method and apparatus for feeding and coating articles in a controlled atmosphere
WO1992017621A1 (en) * 1991-04-04 1992-10-15 Conner Peripherals, Inc. Apparatus and method for high throughput sputtering
US6193853B1 (en) 1999-02-25 2001-02-27 Cametoid Limited Magnetron sputtering method and apparatus
US6290821B1 (en) 1999-07-15 2001-09-18 Seagate Technology Llc Sputter deposition utilizing pulsed cathode and substrate bias power
US6833031B2 (en) 2000-03-21 2004-12-21 Wavezero, Inc. Method and device for coating a substrate
DE10320985B4 (en) * 2003-05-09 2005-03-24 Interpane Entwicklungs- Und Beratungsgesellschaft Mbh & Co.Kg Device for coating a substrate with a suction chamber separated from the vacuum chamber
TWI337517B (en) * 2008-03-04 2011-02-11 Inventec Corp Trace carrier
CZ2015837A3 (en) * 2015-11-27 2017-03-01 Shm, S. R. O. A cylindrical cathode for applying layers by the PVD method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294670A (en) * 1963-10-07 1966-12-27 Western Electric Co Apparatus for processing materials in a controlled atmosphere
US3521765A (en) * 1967-10-31 1970-07-28 Western Electric Co Closed-end machine for processing articles in a controlled atmosphere
US3616402A (en) * 1968-05-31 1971-10-26 Western Electric Co Sputtering method and apparatus
US3793167A (en) * 1972-06-01 1974-02-19 Globe Amerada Glass Co Apparatus for manufacturing metal-coated glass

Also Published As

Publication number Publication date
US3852181A (en) 1974-12-03
DE2253769B2 (en) 1978-11-02
CH589725A5 (en) 1977-07-15
FR2205584A1 (en) 1974-05-31
JPS4977839A (en) 1974-07-26
DE2253769C3 (en) 1979-07-12
DE2253769A1 (en) 1974-05-09
GB1402820A (en) 1975-08-13

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Legal Events

Date Code Title Description
ST Notification of lapse