US4166018A
(en)
*
|
1974-01-31 |
1979-08-28 |
Airco, Inc. |
Sputtering process and apparatus
|
US3956093A
(en)
*
|
1974-12-16 |
1976-05-11 |
Airco, Inc. |
Planar magnetron sputtering method and apparatus
|
JPS51117933A
(en)
*
|
1975-04-10 |
1976-10-16 |
Tokuda Seisakusho |
Spattering apparatus
|
FR2324755A1
(en)
*
|
1975-09-19 |
1977-04-15 |
Anvar |
HIGH SPEED OF DEPOSIT CATHODIC SPRAY DEVICE
|
US4046660A
(en)
*
|
1975-12-29 |
1977-09-06 |
Bell Telephone Laboratories, Incorporated |
Sputter coating with charged particle flux control
|
NL7607473A
(en)
*
|
1976-07-07 |
1978-01-10 |
Philips Nv |
SPRAYING DEVICE AND METHOD FOR SPRAYING WITH SUCH A DEVICE
|
US4179351A
(en)
*
|
1976-09-09 |
1979-12-18 |
Hewlett-Packard Company |
Cylindrical magnetron sputtering source
|
DE2655942A1
(en)
*
|
1976-12-10 |
1978-06-15 |
Tokuda Seisakusho Kawasaki Kk |
Metals deposited by cathodic sputtering - in appts. using magnetic field to increase sputtering rate
|
US4126530A
(en)
*
|
1977-08-04 |
1978-11-21 |
Telic Corporation |
Method and apparatus for sputter cleaning and bias sputtering
|
US4275126A
(en)
*
|
1978-04-12 |
1981-06-23 |
Battelle Memorial Institute |
Fuel cell electrode on solid electrolyte substrate
|
GB2028377B
(en)
*
|
1978-08-21 |
1982-12-08 |
Vac Tec Syst |
Magnetically-enhanced sputtering device
|
ATE10512T1
(en)
*
|
1980-08-08 |
1984-12-15 |
Battelle Development Corporation |
DEVICE FOR COATING SUBSTRATES USING HIGH POWER CATHODE SPRAYING AND SPRAYING CATHODE FOR THIS DEVICE.
|
ATE13561T1
(en)
*
|
1980-08-08 |
1985-06-15 |
Battelle Development Corp |
CYLINDRICAL MAGNETRON ATOMIZER CATHODE.
|
US4290877A
(en)
*
|
1980-09-08 |
1981-09-22 |
The United States Of America As Represented By The Secretary Of The Interior |
Sputtering apparatus for coating elongated tubes and strips
|
DE3107914A1
(en)
*
|
1981-03-02 |
1982-09-16 |
Leybold-Heraeus GmbH, 5000 Köln |
METHOD AND DEVICE FOR COATING MOLDED PARTS BY CATODENSIONING
|
CH649578A5
(en)
*
|
1981-03-27 |
1985-05-31 |
Ulvac Corp |
HIGH-SPEED CATHODE SPRAYING DEVICE.
|
US4525264A
(en)
*
|
1981-12-07 |
1985-06-25 |
Ford Motor Company |
Cylindrical post magnetron sputtering system
|
US4422896A
(en)
*
|
1982-01-26 |
1983-12-27 |
Materials Research Corporation |
Magnetically enhanced plasma process and apparatus
|
US4525262A
(en)
*
|
1982-01-26 |
1985-06-25 |
Materials Research Corporation |
Magnetron reactive bias sputtering method and apparatus
|
US4376025A
(en)
*
|
1982-06-14 |
1983-03-08 |
Battelle Development Corporation |
Cylindrical cathode for magnetically-enhanced sputtering
|
US4581118A
(en)
*
|
1983-01-26 |
1986-04-08 |
Materials Research Corporation |
Shaped field magnetron electrode
|
JPS60221563A
(en)
*
|
1984-04-17 |
1985-11-06 |
Ulvac Corp |
Bias sputtering device
|
US4865712A
(en)
*
|
1984-05-17 |
1989-09-12 |
Varian Associates, Inc. |
Apparatus for manufacturing planarized aluminum films
|
DE3427587A1
(en)
*
|
1984-07-26 |
1986-02-06 |
Leybold-Heraeus GmbH, 5000 Köln |
SPRAYING DEVICE FOR CATODE SPRAYING SYSTEMS
|
DE3442208C3
(en)
*
|
1984-11-19 |
1998-06-10 |
Leybold Ag |
Method and device for producing hard carbon layers
|
US4711767A
(en)
*
|
1985-02-05 |
1987-12-08 |
Psi Star |
Plasma reactor with voltage transformer
|
US4600563A
(en)
*
|
1985-02-05 |
1986-07-15 |
Psi Star Incorporated |
Plasma reactor with voltage transformer
|
DE3527626A1
(en)
*
|
1985-08-01 |
1987-02-05 |
Leybold Heraeus Gmbh & Co Kg |
SPRAYING CATODE ACCORDING TO THE MAGNETRON PRINCIPLE
|
US4668338A
(en)
*
|
1985-12-30 |
1987-05-26 |
Applied Materials, Inc. |
Magnetron-enhanced plasma etching process
|
DE3636524A1
(en)
*
|
1986-10-27 |
1988-04-28 |
Vtu Angel Kancev |
Apparatus for applying coatings in a vacuum by magnetron atomisation
|
DE3727901A1
(en)
*
|
1987-08-21 |
1989-03-02 |
Leybold Ag |
SPRAYING CATHODE ACCORDING TO THE MAGNETRON PRINCIPLE
|
BE1001027A3
(en)
*
|
1987-10-21 |
1989-06-13 |
Bekaert Sa Nv |
METHOD AND DEVICE FOR CLEANING an elongated metal substrate such as a wire, A BAND, A CORD, ETC., AND ACCORDING TO THAT METHOD AND CLEANED SUBSTRATES WITH SUCH substrates ENHANCED OBJECTS OF POLYMER MATERIAL.
|
JP2673807B2
(en)
*
|
1987-10-30 |
1997-11-05 |
パイオニア株式会社 |
Method for manufacturing magneto-optical recording medium
|
US4842703A
(en)
*
|
1988-02-23 |
1989-06-27 |
Eaton Corporation |
Magnetron cathode and method for sputter coating
|
US4810347A
(en)
*
|
1988-03-21 |
1989-03-07 |
Eaton Corporation |
Penning type cathode for sputter coating
|
DE3844064A1
(en)
*
|
1988-12-28 |
1990-07-05 |
Leybold Ag |
MAGNETRON PRINCIPLE CATALOG SPRAYING DEVICE WITH A HOLLOW CATODE AND A CYLINDRICAL TARGET
|
US4927515A
(en)
*
|
1989-01-09 |
1990-05-22 |
The Board Of Trustees Of The Leland Stanford Junior University |
Circular magnetron sputtering device
|
DE3908252C2
(en)
*
|
1989-03-14 |
1996-06-20 |
Leybold Ag |
Atomizing cathode based on the magnetron principle
|
US4957605A
(en)
*
|
1989-04-17 |
1990-09-18 |
Materials Research Corporation |
Method and apparatus for sputter coating stepped wafers
|
US5178743A
(en)
*
|
1989-06-15 |
1993-01-12 |
Microelectronics And Computer Technology Corporation |
Cylindrical magnetron sputtering system
|
DE4018914C1
(en)
*
|
1990-06-13 |
1991-06-06 |
Leybold Ag, 6450 Hanau, De |
|
US5073245A
(en)
*
|
1990-07-10 |
1991-12-17 |
Hedgcoth Virgle L |
Slotted cylindrical hollow cathode/magnetron sputtering device
|
US5437778A
(en)
*
|
1990-07-10 |
1995-08-01 |
Telic Technologies Corporation |
Slotted cylindrical hollow cathode/magnetron sputtering device
|
DE4100291C1
(en)
*
|
1991-01-08 |
1991-10-02 |
Leybold Ag, 6450 Hanau, De |
|
AU664995B2
(en)
*
|
1991-04-19 |
1995-12-14 |
Surface Solutions, Incorporated |
Method and apparatus for linear magnetron sputtering
|
GB2256085A
(en)
*
|
1991-05-13 |
1992-11-25 |
Integrated Plasma Ltd |
Plasma deposition and etching of substrates.
|
US5228963A
(en)
*
|
1991-07-01 |
1993-07-20 |
Himont Incorporated |
Hollow-cathode magnetron and method of making thin films
|
DE4135939A1
(en)
*
|
1991-10-31 |
1993-05-06 |
Leybold Ag, 6450 Hanau, De |
SPRAYING CATHODE
|
DE4138793C2
(en)
*
|
1991-11-26 |
2001-03-01 |
Leybold Ag |
Method and device for coating a substrate, in particular with electrically non-conductive layers
|
US5415757A
(en)
*
|
1991-11-26 |
1995-05-16 |
Leybold Aktiengesellschaft |
Apparatus for coating a substrate with electrically nonconductive coatings
|
US5685961A
(en)
*
|
1992-03-27 |
1997-11-11 |
P & D Medical Coatings, Inc. |
Method for fabrication of metallized medical devices
|
DE4333825C1
(en)
*
|
1993-09-28 |
1995-02-23 |
Mat Gmbh |
Apparatus for coating elongated flexible products
|
US6217716B1
(en)
|
1998-05-06 |
2001-04-17 |
Novellus Systems, Inc. |
Apparatus and method for improving target erosion in hollow cathode magnetron sputter source
|
US6432286B1
(en)
|
1998-06-10 |
2002-08-13 |
David A. Glocker |
Conical sputtering target
|
US6235170B1
(en)
|
1998-06-10 |
2001-05-22 |
David A. Glocker |
Conical sputtering target
|
US6066242A
(en)
*
|
1998-06-10 |
2000-05-23 |
David A. Glocker |
Conical sputtering target
|
US6352430B1
(en)
|
1998-10-23 |
2002-03-05 |
Goodrich Corporation |
Method and apparatus for cooling a CVI/CVD furnace
|
US6440220B1
(en)
*
|
1998-10-23 |
2002-08-27 |
Goodrich Corporation |
Method and apparatus for inhibiting infiltration of a reactive gas into porous refractory insulation
|
US6162298A
(en)
*
|
1998-10-28 |
2000-12-19 |
The B. F. Goodrich Company |
Sealed reactant gas inlet for a CVI/CVD furnace
|
US6193853B1
(en)
|
1999-02-25 |
2001-02-27 |
Cametoid Limited |
Magnetron sputtering method and apparatus
|
EP1063319B1
(en)
|
1999-06-04 |
2005-12-07 |
Goodrich Corporation |
Method and apparatus for cooling a CVI/CVD furnace
|
EP1065294B1
(en)
|
1999-06-04 |
2003-10-15 |
Goodrich Corporation |
Method and apparatus for pressure measurement in a CVI/CVD furnace
|
DE60013208T2
(en)
|
1999-06-04 |
2005-08-11 |
Goodrich Corp. |
Suzeptordeckel both for gas phase infiltration or coating and heat treatment
|
TW584905B
(en)
|
2000-02-25 |
2004-04-21 |
Tokyo Electron Ltd |
Method and apparatus for depositing films
|
US6497803B2
(en)
|
2000-05-31 |
2002-12-24 |
Isoflux, Inc. |
Unbalanced plasma generating apparatus having cylindrical symmetry
|
US6551477B2
(en)
|
2000-09-25 |
2003-04-22 |
Isoflux, Inc. |
Interlocking cylindrical magnetron cathodes and targets
|
US6887356B2
(en)
*
|
2000-11-27 |
2005-05-03 |
Cabot Corporation |
Hollow cathode target and methods of making same
|
US6759807B2
(en)
|
2002-04-04 |
2004-07-06 |
Veeco Instruments, Inc. |
Multi-grid ion beam source for generating a highly collimated ion beam
|
AT414215B
(en)
*
|
2003-02-12 |
2006-10-15 |
Peter Ziger |
ANNEX TO PLASMA PROCESSING
|
US20050288773A1
(en)
*
|
2004-01-22 |
2005-12-29 |
Glocker David A |
Radiopaque coating for biomedical devices
|
JP2008504104A
(en)
*
|
2004-06-28 |
2008-02-14 |
イソフラックス・インコーポレイテッド |
Porous coating for biomedical implants
|
DE102007049735B4
(en)
*
|
2006-10-17 |
2012-03-29 |
Von Ardenne Anlagentechnik Gmbh |
Supply end block for a tubular magnetron
|
US7938943B2
(en)
*
|
2006-10-17 |
2011-05-10 |
Von Ardenne Anlagentechnic GmbH |
Supply end block for rotary magnetron
|
JP5467735B2
(en)
*
|
2007-07-02 |
2014-04-09 |
東ソー株式会社 |
Cylindrical sputtering target
|
DE102008052217B3
(en)
*
|
2008-10-17 |
2011-03-10 |
Johann Wolfgang Goethe-Universität |
Electrostatic ion compressor
|
US20140061039A1
(en)
*
|
2012-09-05 |
2014-03-06 |
Applied Materials, Inc. |
Target cooling for physical vapor deposition (pvd) processing systems
|
CN105659708B
(en)
*
|
2013-11-22 |
2018-05-01 |
东丽株式会社 |
Plasma electrode, corona treatment electrode, CVD electrodes, the manufacture method of plasma CVD equipment and membrane base material
|
CA3063389C
(en)
|
2019-12-02 |
2021-03-30 |
2S Water Incorporated |
Solution electrode glow discharge apparatus
|
CA3068769A1
(en)
|
2020-01-20 |
2021-07-20 |
2S Water Incorporated |
Liquid electrode tip
|
CN116057200B
(en)
*
|
2020-09-16 |
2024-09-10 |
株式会社爱发科 |
Driving block for rotary cathode unit
|