GB2028377B - Magnetically-enhanced sputtering device - Google Patents

Magnetically-enhanced sputtering device

Info

Publication number
GB2028377B
GB2028377B GB7912472A GB7912472A GB2028377B GB 2028377 B GB2028377 B GB 2028377B GB 7912472 A GB7912472 A GB 7912472A GB 7912472 A GB7912472 A GB 7912472A GB 2028377 B GB2028377 B GB 2028377B
Authority
GB
United Kingdom
Prior art keywords
magnetically
sputtering device
enhanced sputtering
enhanced
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7912472A
Other versions
GB2028377A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vac Tec Systems Inc
Original Assignee
Vac Tec Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/935,358 external-priority patent/US4162954A/en
Priority claimed from US05/946,370 external-priority patent/US4180450A/en
Priority claimed from US06/019,284 external-priority patent/US4265729A/en
Application filed by Vac Tec Systems Inc filed Critical Vac Tec Systems Inc
Publication of GB2028377A publication Critical patent/GB2028377A/en
Application granted granted Critical
Publication of GB2028377B publication Critical patent/GB2028377B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3494—Adaptation to extreme pressure conditions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3458—Electromagnets in particular for cathodic sputtering apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Physical Vapour Deposition (AREA)
  • Nozzles (AREA)
GB7912472A 1978-08-21 1979-04-09 Magnetically-enhanced sputtering device Expired GB2028377B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US05/935,358 US4162954A (en) 1978-08-21 1978-08-21 Planar magnetron sputtering device
US05/946,370 US4180450A (en) 1978-08-21 1978-09-27 Planar magnetron sputtering device
US06/019,284 US4265729A (en) 1978-09-27 1979-03-09 Magnetically enhanced sputtering device

Publications (2)

Publication Number Publication Date
GB2028377A GB2028377A (en) 1980-03-05
GB2028377B true GB2028377B (en) 1982-12-08

Family

ID=27361196

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7912472A Expired GB2028377B (en) 1978-08-21 1979-04-09 Magnetically-enhanced sputtering device

Country Status (4)

Country Link
CA (1) CA1141704A (en)
DE (1) DE2920780C2 (en)
FR (1) FR2434479A1 (en)
GB (1) GB2028377B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4461688A (en) * 1980-06-23 1984-07-24 Vac-Tec Systems, Inc. Magnetically enhanced sputtering device having a plurality of magnetic field sources including improved plasma trapping device and method
CH648690A5 (en) * 1980-10-14 1985-03-29 Balzers Hochvakuum CATHODE ARRANGEMENT FOR SPRAYING MATERIAL FROM A TARGET IN A CATHODE SPRAYING SYSTEM.
JPS58189372A (en) * 1982-04-30 1983-11-05 Toshiba Corp Magnetron sputtering device
FR2534276A1 (en) * 1982-10-11 1984-04-13 Commissariat Energie Atomique Process and device for coating an article using cathodic sputtering.
DE3727901A1 (en) * 1987-08-21 1989-03-02 Leybold Ag SPRAYING CATHODE ACCORDING TO THE MAGNETRON PRINCIPLE
DE19819785A1 (en) * 1998-05-04 1999-11-11 Leybold Systems Gmbh Atomizing cathode based on the magnetron principle
DE19836125C2 (en) 1998-08-10 2001-12-06 Leybold Systems Gmbh Atomizing device with a cathode with permanent magnet arrangement
DE10234858A1 (en) * 2002-07-31 2004-02-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Device for producing a magnetron discharge, especially for magnetron sputtering, in the coating of substrates has a unit producing a magnetic field having a fixed position relative to the outer target limit in the region of the outer pole
EP2044237B1 (en) * 2006-07-13 2020-12-16 Teer Coatings Limited Coating method
DE102013112861B4 (en) * 2013-01-15 2018-11-15 VON ARDENNE Asset GmbH & Co. KG Magnetron arrangement and target for a magnetron arrangement
US9328410B2 (en) 2013-10-25 2016-05-03 First Solar, Inc. Physical vapor deposition tile arrangement and physical vapor deposition arrangement

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3884793A (en) * 1971-09-07 1975-05-20 Telic Corp Electrode type glow discharge apparatus
US3956093A (en) * 1974-12-16 1976-05-11 Airco, Inc. Planar magnetron sputtering method and apparatus
US4013532A (en) * 1975-03-03 1977-03-22 Airco, Inc. Method for coating a substrate
US4022947A (en) * 1975-11-06 1977-05-10 Airco, Inc. Transparent panel having high reflectivity for solar radiation and a method for preparing same
DE2707144A1 (en) * 1976-02-19 1977-08-25 Sloan Technology Corp Cathode sputtering device with magnetic equipment - which can be displaced to move the area of sputtering over an extended surface by relative movement
NL7607473A (en) * 1976-07-07 1978-01-10 Philips Nv SPRAYING DEVICE AND METHOD FOR SPRAYING WITH SUCH A DEVICE
DE2655942A1 (en) * 1976-12-10 1978-06-15 Tokuda Seisakusho Kawasaki Kk Metals deposited by cathodic sputtering - in appts. using magnetic field to increase sputtering rate
DE2735525A1 (en) * 1977-08-06 1979-02-22 Leybold Heraeus Gmbh & Co Kg CATODE ARRANGEMENT WITH TARGET FOR SPRAYING SYSTEMS FOR DUSTING UP DIELECTRIC OR AMAGNETIC LAYERS ON SUBSTRATES

Also Published As

Publication number Publication date
FR2434479A1 (en) 1980-03-21
CA1141704A (en) 1983-02-22
DE2920780C2 (en) 1990-06-21
DE2920780A1 (en) 1980-03-06
GB2028377A (en) 1980-03-05
FR2434479B1 (en) 1983-03-18

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19950409