NL189632C - Werkwijze voor het uitlijnen van masker- en wafelorganen. - Google Patents

Werkwijze voor het uitlijnen van masker- en wafelorganen.

Info

Publication number
NL189632C
NL189632C NLAANVRAGE8101776,A NL8101776A NL189632C NL 189632 C NL189632 C NL 189632C NL 8101776 A NL8101776 A NL 8101776A NL 189632 C NL189632 C NL 189632C
Authority
NL
Netherlands
Prior art keywords
organs
wafer
aligning mask
aligning
mask
Prior art date
Application number
NLAANVRAGE8101776,A
Other languages
English (en)
Dutch (nl)
Other versions
NL189632B (nl
NL8101776A (nl
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of NL8101776A publication Critical patent/NL8101776A/nl
Publication of NL189632B publication Critical patent/NL189632B/xx
Application granted granted Critical
Publication of NL189632C publication Critical patent/NL189632C/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/703—Gap setting, e.g. in proximity printer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
NLAANVRAGE8101776,A 1980-04-11 1981-04-10 Werkwijze voor het uitlijnen van masker- en wafelorganen. NL189632C (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/139,544 US4326805A (en) 1980-04-11 1980-04-11 Method and apparatus for aligning mask and wafer members
US13954480 1980-04-11

Publications (3)

Publication Number Publication Date
NL8101776A NL8101776A (nl) 1981-11-02
NL189632B NL189632B (nl) 1993-01-04
NL189632C true NL189632C (nl) 1993-06-01

Family

ID=22487191

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE8101776,A NL189632C (nl) 1980-04-11 1981-04-10 Werkwijze voor het uitlijnen van masker- en wafelorganen.

Country Status (9)

Country Link
US (1) US4326805A (de)
JP (1) JPS56157033A (de)
BE (1) BE888344A (de)
CA (1) CA1154175A (de)
DE (1) DE3114682A1 (de)
FR (1) FR2482285A1 (de)
GB (1) GB2073950B (de)
IT (1) IT1137326B (de)
NL (1) NL189632C (de)

Families Citing this family (105)

* Cited by examiner, † Cited by third party
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US4405238A (en) * 1981-05-20 1983-09-20 Ibm Corporation Alignment method and apparatus for x-ray or optical lithography
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FR2538923A1 (fr) * 1982-12-30 1984-07-06 Thomson Csf Procede et dispositif d'alignement optique de motifs dans deux plans rapproches dans un appareil d'exposition comprenant une source de rayonnement divergent
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US4614433A (en) * 1984-07-09 1986-09-30 At&T Bell Laboratories Mask-to-wafer alignment utilizing zone plates
US4708484A (en) * 1984-10-24 1987-11-24 Hitachi, Ltd. Projection alignment method and apparatus
JPH0666241B2 (ja) * 1985-10-14 1994-08-24 株式会社日立製作所 位置検出方法
US4798470A (en) * 1985-11-14 1989-01-17 Hitachi, Ltd. Pattern printing method and apparatus
US4755053A (en) * 1986-11-12 1988-07-05 Hewlett-Packard Company Secondary alignment fiducials for automatic alignment using machine vision.
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US5327221A (en) * 1988-02-16 1994-07-05 Canon Kabushiki Kaisha Device for detecting positional relationship between two objects
JP2623757B2 (ja) * 1988-09-05 1997-06-25 キヤノン株式会社 位置合わせ装置
EP0329433A3 (de) * 1988-02-16 1989-10-25 Canon Kabushiki Kaisha Verfahren und Vorrichtung zur Feststellung der Lage
EP0329430B1 (de) * 1988-02-16 1992-07-01 Canon Kabushiki Kaisha Vorrichtung zur Lagefeststellung
US5325176A (en) * 1988-02-16 1994-06-28 Canon Kabushiki Kaisha Position detecting method and apparatus including Fraunhofer diffraction detector
GB8806232D0 (en) * 1988-03-16 1988-04-13 Plessey Co Plc Vernier structure for flip chip bonded devices
WO1989008926A1 (en) * 1988-03-16 1989-09-21 Plessey Overseas Limited Vernier structure for flip chip bonded devices
US5294980A (en) * 1988-03-24 1994-03-15 Canon Kabushiki Kaisha Positioning detecting method and apparatus
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JP2676933B2 (ja) * 1988-09-05 1997-11-17 キヤノン株式会社 位置検出装置
US5235408A (en) * 1988-09-05 1993-08-10 Canon Kabushiki Kaisha Position detecting method and apparatus
EP0358514B1 (de) * 1988-09-09 2000-12-13 Canon Kabushiki Kaisha Vorrichtung und Gerät zur Positionsdetektion
JP2546350B2 (ja) * 1988-09-09 1996-10-23 キヤノン株式会社 位置合わせ装置
JP2626076B2 (ja) * 1988-09-09 1997-07-02 キヤノン株式会社 位置検出装置
US5155370A (en) * 1988-09-09 1992-10-13 Canon Kabushiki Kaisha Device for detecting the relative position of first and second objects
DE68929314T2 (de) * 1988-09-09 2002-05-02 Canon K.K., Tokio/Tokyo Vorrichtung zur Detektion der Positionsrelation zwischen zwei Objekten
JP2704002B2 (ja) * 1989-07-18 1998-01-26 キヤノン株式会社 位置検出方法
JP2704001B2 (ja) * 1989-07-18 1998-01-26 キヤノン株式会社 位置検出装置
EP0411966B1 (de) * 1989-08-04 1994-11-02 Canon Kabushiki Kaisha Verfahren und Vorrichtung zur Positionsbestimmung
US5225892A (en) * 1990-02-05 1993-07-06 Canon Kabushiki Kaisha Positional deviation detecting method
US5200800A (en) * 1990-05-01 1993-04-06 Canon Kabushiki Kaisha Position detecting method and apparatus
EP0455443B1 (de) * 1990-05-01 1997-11-12 Canon Kabushiki Kaisha Verfahren und Apparat zur Detektion von Lageabweichungen
JP2890943B2 (ja) * 1990-11-30 1999-05-17 キヤノン株式会社 位置検出方法及びそれを用いた位置検出装置
US5495336A (en) * 1992-02-04 1996-02-27 Canon Kabushiki Kaisha Position detecting method for detecting a positional relationship between a first object and a second object
JP3008654B2 (ja) * 1992-02-21 2000-02-14 キヤノン株式会社 位置検出装置
US5455679A (en) * 1993-02-22 1995-10-03 Canon Kabushiki Kaisha Position detecting system
US5667918A (en) * 1993-09-27 1997-09-16 Micron Technology, Inc. Method of lithography using reticle pattern blinders
JP3428705B2 (ja) * 1993-10-20 2003-07-22 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
JP3368017B2 (ja) * 1993-10-29 2003-01-20 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
JPH07135168A (ja) * 1993-11-11 1995-05-23 Canon Inc アライメント方法及びそれを用いた位置検出装置
DE69631095T2 (de) 1995-07-06 2004-08-26 Dai Nippon Printing Co., Ltd. Holographisches Farbfilter und sein Herstellungsverfahren
JP3352286B2 (ja) * 1995-07-13 2002-12-03 キヤノン株式会社 位置制御方法及び装置並びにそれを使用した半導体製造装置
JP3292022B2 (ja) * 1996-01-17 2002-06-17 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
JPH1022213A (ja) * 1996-06-28 1998-01-23 Canon Inc 位置検出装置及びそれを用いたデバイスの製造方法
US5700732A (en) 1996-08-02 1997-12-23 Micron Technology, Inc. Semiconductor wafer, wafer alignment patterns and method of forming wafer alignment patterns
US5786116A (en) * 1997-02-14 1998-07-28 Micron Technology, Inc. Atom lithographic mask having diffraction grating aligned with primary mask pattern
US5851701A (en) * 1997-04-01 1998-12-22 Micron Technology, Inc. Atom lithographic mask having diffraction grating and attenuated phase shifters
JPH11241908A (ja) 1997-12-03 1999-09-07 Canon Inc 位置検出装置及びそれを用いたデバイスの製造方法
US6303272B1 (en) * 1998-11-13 2001-10-16 International Business Machines Corporation Process for self-alignment of sub-critical contacts to wiring
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
TWI282909B (en) * 1999-12-23 2007-06-21 Asml Netherlands Bv Lithographic apparatus and a method for manufacturing a device
EP2264524A3 (de) * 2000-07-16 2011-11-30 The Board of Regents of The University of Texas System Hoch auflösende Ausrichtungsverfahren und entsprechende Systeme für die Präge-Lithographie
AU2001277907A1 (en) 2000-07-17 2002-01-30 Board Of Regents, The University Of Texas System Method and system of automatic fluid dispensing for imprint lithography processes
EP1309897A2 (de) * 2000-08-01 2003-05-14 Board Of Regents, The University Of Texas System Methode zur einstellung des abstands und der ausrichtung zwischen einem transparenten original und einem substrat in der imprint-lithographie
US6516244B1 (en) 2000-08-25 2003-02-04 Wafermasters, Inc. Wafer alignment system and method
EP1352295B1 (de) * 2000-10-12 2015-12-23 Board of Regents, The University of Texas System Schablone für die mikro- und nanodrucklithographie für zimmertemperatur und niedrigen druck
US20050274219A1 (en) * 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method and system to control movement of a body for nano-scale manufacturing
US6653639B1 (en) 2000-10-17 2003-11-25 Nikon Corporation Chuck for mounting reticle to a reticle stage
US6563566B2 (en) * 2001-01-29 2003-05-13 International Business Machines Corporation System and method for printing semiconductor patterns using an optimized illumination and reticle
US6591161B2 (en) 2001-01-31 2003-07-08 Wafermasters, Inc. Method for determining robot alignment
US6885429B2 (en) * 2002-06-28 2005-04-26 Asml Holding N.V. System and method for automated focus measuring of a lithography tool
US7077992B2 (en) * 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6916584B2 (en) 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US7027156B2 (en) * 2002-08-01 2006-04-11 Molecular Imprints, Inc. Scatterometry alignment for imprint lithography
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SG152898A1 (en) 2002-09-20 2009-06-29 Asml Netherlands Bv Alignment systems and methods for lithographic systems
US8349241B2 (en) * 2002-10-04 2013-01-08 Molecular Imprints, Inc. Method to arrange features on a substrate to replicate features having minimal dimensional variability
US6929762B2 (en) * 2002-11-13 2005-08-16 Molecular Imprints, Inc. Method of reducing pattern distortions during imprint lithography processes
US6871558B2 (en) * 2002-12-12 2005-03-29 Molecular Imprints, Inc. Method for determining characteristics of substrate employing fluid geometries
WO2004054784A1 (en) * 2002-12-13 2004-07-01 Molecular Imprints, Inc. Magnification corrections employing out-of-plane distortions on a substrate
US7452574B2 (en) * 2003-02-27 2008-11-18 Molecular Imprints, Inc. Method to reduce adhesion between a polymerizable layer and a substrate employing a fluorine-containing layer
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US6888260B2 (en) * 2003-04-17 2005-05-03 Infineon Technologies Aktiengesellschaft Alignment or overlay marks for semiconductor processing
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US20050084804A1 (en) * 2003-10-16 2005-04-21 Molecular Imprints, Inc. Low surface energy templates
US8076386B2 (en) * 2004-02-23 2011-12-13 Molecular Imprints, Inc. Materials for imprint lithography
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JP5198071B2 (ja) * 2004-12-01 2013-05-15 モレキュラー・インプリンツ・インコーポレーテッド インプリントリソグラフィ・プロセスにおける熱管理のための露光方法
US20070228608A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
KR20090003153A (ko) 2006-04-03 2009-01-09 몰레큘러 임프린츠 인코퍼레이티드 다수의 필드와 정렬 마크를 갖는 기판을 동시에 패턴화하는방법
JP5027468B2 (ja) * 2006-09-15 2012-09-19 日本ミクロコーティング株式会社 プローブクリーニング用又はプローブ加工用シート、及びプローブ加工方法
CN103091993B (zh) * 2011-11-02 2015-02-11 上海微电子装备有限公司 用于光刻机透镜热效应测量的测试标记及其测量方法
CN114217370B (zh) * 2021-12-16 2024-09-20 西安工业大学 宽带消色差聚焦与偏振调控的微结构波带片及设计方法

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JPS52109875A (en) * 1976-02-25 1977-09-14 Hitachi Ltd Position matching system for mask and wafer and its unit
US4037969A (en) * 1976-04-02 1977-07-26 Bell Telephone Laboratories, Incorporated Zone plate alignment marks
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FR2436967A1 (fr) * 1978-09-19 1980-04-18 Thomson Csf Procede d'alignement optique de motifs dans deux plans rapproches et dispositif d'alignement mettant en oeuvre un tel procede

Also Published As

Publication number Publication date
FR2482285A1 (fr) 1981-11-13
FR2482285B1 (de) 1985-02-01
JPS56157033A (en) 1981-12-04
IT1137326B (it) 1986-09-10
DE3114682C2 (de) 1987-05-21
GB2073950B (en) 1984-04-18
NL189632B (nl) 1993-01-04
IT8121022A0 (it) 1981-04-09
GB2073950A (en) 1981-10-21
CA1154175A (en) 1983-09-20
JPH0132649B2 (de) 1989-07-10
US4326805A (en) 1982-04-27
NL8101776A (nl) 1981-11-02
BE888344A (fr) 1981-07-31
DE3114682A1 (de) 1981-12-24

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Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
A85 Still pending on 85-01-01
BC A request for examination has been filed
V1 Lapsed because of non-payment of the annual fee

Effective date: 20001101