NL189632C - Werkwijze voor het uitlijnen van masker- en wafelorganen. - Google Patents

Werkwijze voor het uitlijnen van masker- en wafelorganen.

Info

Publication number
NL189632C
NL189632C NLAANVRAGE8101776,A NL8101776A NL189632C NL 189632 C NL189632 C NL 189632C NL 8101776 A NL8101776 A NL 8101776A NL 189632 C NL189632 C NL 189632C
Authority
NL
Netherlands
Prior art keywords
organs
wafer
aligning mask
aligning
mask
Prior art date
Application number
NLAANVRAGE8101776,A
Other languages
English (en)
Dutch (nl)
Other versions
NL8101776A (nl
NL189632B (nl
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of NL8101776A publication Critical patent/NL8101776A/nl
Publication of NL189632B publication Critical patent/NL189632B/xx
Application granted granted Critical
Publication of NL189632C publication Critical patent/NL189632C/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/703—Gap setting, e.g. in proximity printer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
NLAANVRAGE8101776,A 1980-04-11 1981-04-10 Werkwijze voor het uitlijnen van masker- en wafelorganen. NL189632C (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/139,544 US4326805A (en) 1980-04-11 1980-04-11 Method and apparatus for aligning mask and wafer members
US13954480 1980-04-11

Publications (3)

Publication Number Publication Date
NL8101776A NL8101776A (nl) 1981-11-02
NL189632B NL189632B (nl) 1993-01-04
NL189632C true NL189632C (nl) 1993-06-01

Family

ID=22487191

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE8101776,A NL189632C (nl) 1980-04-11 1981-04-10 Werkwijze voor het uitlijnen van masker- en wafelorganen.

Country Status (9)

Country Link
US (1) US4326805A (xx)
JP (1) JPS56157033A (xx)
BE (1) BE888344A (xx)
CA (1) CA1154175A (xx)
DE (1) DE3114682A1 (xx)
FR (1) FR2482285A1 (xx)
GB (1) GB2073950B (xx)
IT (1) IT1137326B (xx)
NL (1) NL189632C (xx)

Families Citing this family (105)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4398824A (en) * 1981-04-15 1983-08-16 Bell Telephone Laboratories, Incorporated Wafer tilt compensation in zone plate alignment system
JPS57172726A (en) * 1981-04-16 1982-10-23 Toshiba Corp Position alignment of mask substrate and wafer
US4405238A (en) * 1981-05-20 1983-09-20 Ibm Corporation Alignment method and apparatus for x-ray or optical lithography
JPS58112330A (ja) * 1981-12-25 1983-07-04 Nippon Kogaku Kk <Nikon> 投影型露光装置
US4549084A (en) * 1982-12-21 1985-10-22 The Perkin-Elmer Corporation Alignment and focusing system for a scanning mask aligner
FR2538923A1 (fr) * 1982-12-30 1984-07-06 Thomson Csf Procede et dispositif d'alignement optique de motifs dans deux plans rapproches dans un appareil d'exposition comprenant une source de rayonnement divergent
US4545683A (en) * 1983-02-28 1985-10-08 The Perkin-Elmer Corporation Wafer alignment device
JPS59182933U (ja) * 1983-05-23 1984-12-06 株式会社　デイスコ ウェーハ装着機
GB2146427B (en) * 1983-08-01 1987-10-21 Canon Kk Semiconductor manufacture
JPS6098623A (ja) * 1983-11-04 1985-06-01 Hitachi Ltd 投影式露光方法及びその装置
GB2151350A (en) * 1983-11-25 1985-07-17 Vs Eng Ltd Sensing arrangement
US4636080A (en) * 1984-05-07 1987-01-13 At&T Bell Laboratories Two-dimensional imaging with line arrays
US4614433A (en) * 1984-07-09 1986-09-30 At&T Bell Laboratories Mask-to-wafer alignment utilizing zone plates
US4708484A (en) * 1984-10-24 1987-11-24 Hitachi, Ltd. Projection alignment method and apparatus
JPH0666241B2 (ja) * 1985-10-14 1994-08-24 株式会社日立製作所 位置検出方法
US4798470A (en) * 1985-11-14 1989-01-17 Hitachi, Ltd. Pattern printing method and apparatus
US4755053A (en) * 1986-11-12 1988-07-05 Hewlett-Packard Company Secondary alignment fiducials for automatic alignment using machine vision.
EP0329433A3 (en) * 1988-02-16 1989-10-25 Canon Kabushiki Kaisha Position detecting method and apparatus
US5319444A (en) * 1988-02-16 1994-06-07 Canon Kabushiki Kaisha Position detecting method and apparatus
US5325176A (en) * 1988-02-16 1994-06-28 Canon Kabushiki Kaisha Position detecting method and apparatus including Fraunhofer diffraction detector
EP0329430B1 (en) * 1988-02-16 1992-07-01 Canon Kabushiki Kaisha Position detecting device
JP2623757B2 (ja) * 1988-09-05 1997-06-25 キヤノン株式会社 位置合わせ装置
US5327221A (en) * 1988-02-16 1994-07-05 Canon Kabushiki Kaisha Device for detecting positional relationship between two objects
JP2660077B2 (ja) * 1988-03-16 1997-10-08 ジーイーシー ― マルコニ リミテッド フリップチップ接着された装置用の副尺構造
GB8806232D0 (en) * 1988-03-16 1988-04-13 Plessey Co Plc Vernier structure for flip chip bonded devices
US5294980A (en) * 1988-03-24 1994-03-15 Canon Kabushiki Kaisha Positioning detecting method and apparatus
JPS6432625A (en) * 1988-05-06 1989-02-02 Hitachi Ltd Exposure method for semiconductor
EP0355496A3 (en) * 1988-08-15 1990-10-10 Sumitomo Heavy Industries Co., Ltd. Position detector employing a sector fresnel zone plate
JP2676933B2 (ja) * 1988-09-05 1997-11-17 キヤノン株式会社 位置検出装置
US5235408A (en) * 1988-09-05 1993-08-10 Canon Kabushiki Kaisha Position detecting method and apparatus
JP2626076B2 (ja) * 1988-09-09 1997-07-02 キヤノン株式会社 位置検出装置
EP0358511B1 (en) * 1988-09-09 2001-07-18 Canon Kabushiki Kaisha Device for detecting positional relationship between two objects
EP0358514B1 (en) * 1988-09-09 2000-12-13 Canon Kabushiki Kaisha Position detecting method and apparatus
JP2546350B2 (ja) * 1988-09-09 1996-10-23 キヤノン株式会社 位置合わせ装置
US5155370A (en) * 1988-09-09 1992-10-13 Canon Kabushiki Kaisha Device for detecting the relative position of first and second objects
JP2704002B2 (ja) * 1989-07-18 1998-01-26 キヤノン株式会社 位置検出方法
JP2704001B2 (ja) * 1989-07-18 1998-01-26 キヤノン株式会社 位置検出装置
DE69013790T2 (de) * 1989-08-04 1995-05-04 Canon K.K., Tokio/Tokyo Verfahren und Vorrichtung zur Positionsbestimmung.
US5225892A (en) * 1990-02-05 1993-07-06 Canon Kabushiki Kaisha Positional deviation detecting method
DE69128164T2 (de) * 1990-05-01 1998-04-02 Canon K.K., Tokio/Tokyo Verfahren und Apparat zur Detektion von Lageabweichungen
US5200800A (en) * 1990-05-01 1993-04-06 Canon Kabushiki Kaisha Position detecting method and apparatus
JP2890943B2 (ja) * 1990-11-30 1999-05-17 キヤノン株式会社 位置検出方法及びそれを用いた位置検出装置
US5495336A (en) * 1992-02-04 1996-02-27 Canon Kabushiki Kaisha Position detecting method for detecting a positional relationship between a first object and a second object
JP3008654B2 (ja) * 1992-02-21 2000-02-14 キヤノン株式会社 位置検出装置
US5455679A (en) * 1993-02-22 1995-10-03 Canon Kabushiki Kaisha Position detecting system
US5667918A (en) * 1993-09-27 1997-09-16 Micron Technology, Inc. Method of lithography using reticle pattern blinders
JP3428705B2 (ja) * 1993-10-20 2003-07-22 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
JP3368017B2 (ja) * 1993-10-29 2003-01-20 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
JPH07135168A (ja) * 1993-11-11 1995-05-23 Canon Inc アライメント方法及びそれを用いた位置検出装置
EP1367415B1 (en) * 1995-07-06 2007-09-12 Dai Nippon Printing Co., Ltd. Hologram color filter with alignment mark and alignment method
JP3352286B2 (ja) * 1995-07-13 2002-12-03 キヤノン株式会社 位置制御方法及び装置並びにそれを使用した半導体製造装置
JP3292022B2 (ja) * 1996-01-17 2002-06-17 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
JPH1022213A (ja) * 1996-06-28 1998-01-23 Canon Inc 位置検出装置及びそれを用いたデバイスの製造方法
US5700732A (en) * 1996-08-02 1997-12-23 Micron Technology, Inc. Semiconductor wafer, wafer alignment patterns and method of forming wafer alignment patterns
US5786116A (en) * 1997-02-14 1998-07-28 Micron Technology, Inc. Atom lithographic mask having diffraction grating aligned with primary mask pattern
US5851701A (en) * 1997-04-01 1998-12-22 Micron Technology, Inc. Atom lithographic mask having diffraction grating and attenuated phase shifters
JPH11241908A (ja) 1997-12-03 1999-09-07 Canon Inc 位置検出装置及びそれを用いたデバイスの製造方法
US6303272B1 (en) * 1998-11-13 2001-10-16 International Business Machines Corporation Process for self-alignment of sub-critical contacts to wiring
US6873087B1 (en) * 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
TWI282909B (en) * 1999-12-23 2007-06-21 Asml Netherlands Bv Lithographic apparatus and a method for manufacturing a device
JP4511786B2 (ja) * 2000-07-16 2010-07-28 ボード・オブ・リージエンツ，ザ・ユニバーシテイ・オブ・テキサス・システム 基板とこの基板から離れたテンプレートを整列させる方法
EP1303793B1 (en) 2000-07-17 2015-01-28 Board Of Regents, The University Of Texas System Method and system of automatic fluid dispensing for imprint lithography processes
US6954275B2 (en) * 2000-08-01 2005-10-11 Boards Of Regents, The University Of Texas System Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography
US6516244B1 (en) 2000-08-25 2003-02-04 Wafermasters, Inc. Wafer alignment system and method
JP2004523906A (ja) * 2000-10-12 2004-08-05 ボード・オブ・リージエンツ，ザ・ユニバーシテイ・オブ・テキサス・システム 室温かつ低圧マイクロおよびナノ転写リソグラフィのためのテンプレート
US20050274219A1 (en) * 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method and system to control movement of a body for nano-scale manufacturing
US6653639B1 (en) 2000-10-17 2003-11-25 Nikon Corporation Chuck for mounting reticle to a reticle stage
US6563566B2 (en) * 2001-01-29 2003-05-13 International Business Machines Corporation System and method for printing semiconductor patterns using an optimized illumination and reticle
US6591161B2 (en) 2001-01-31 2003-07-08 Wafermasters, Inc. Method for determining robot alignment
US6885429B2 (en) * 2002-06-28 2005-04-26 Asml Holding N.V. System and method for automated focus measuring of a lithography tool
US7077992B2 (en) * 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6916584B2 (en) 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US7027156B2 (en) * 2002-08-01 2006-04-11 Molecular Imprints, Inc. Scatterometry alignment for imprint lithography
US7070405B2 (en) * 2002-08-01 2006-07-04 Molecular Imprints, Inc. Alignment systems for imprint lithography
TWI227814B (en) 2002-09-20 2005-02-11 Asml Netherlands Bv Alignment system and methods for lithographic systems using at least two wavelengths
US8349241B2 (en) * 2002-10-04 2013-01-08 Molecular Imprints, Inc. Method to arrange features on a substrate to replicate features having minimal dimensional variability
US6929762B2 (en) * 2002-11-13 2005-08-16 Molecular Imprints, Inc. Method of reducing pattern distortions during imprint lithography processes
US6871558B2 (en) * 2002-12-12 2005-03-29 Molecular Imprints, Inc. Method for determining characteristics of substrate employing fluid geometries
MY136129A (en) * 2002-12-13 2008-08-29 Molecular Imprints Inc Magnification correction employing out-of-plane distortion of a substrate
US20040168613A1 (en) * 2003-02-27 2004-09-02 Molecular Imprints, Inc. Composition and method to form a release layer
US7452574B2 (en) * 2003-02-27 2008-11-18 Molecular Imprints, Inc. Method to reduce adhesion between a polymerizable layer and a substrate employing a fluorine-containing layer
US7122079B2 (en) * 2004-02-27 2006-10-17 Molecular Imprints, Inc. Composition for an etching mask comprising a silicon-containing material
US6888260B2 (en) * 2003-04-17 2005-05-03 Infineon Technologies Aktiengesellschaft Alignment or overlay marks for semiconductor processing
US20050160934A1 (en) * 2004-01-23 2005-07-28 Molecular Imprints, Inc. Materials and methods for imprint lithography
US7157036B2 (en) * 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
US7150622B2 (en) * 2003-07-09 2006-12-19 Molecular Imprints, Inc. Systems for magnification and distortion correction for imprint lithography processes
US7136150B2 (en) 2003-09-25 2006-11-14 Molecular Imprints, Inc. Imprint lithography template having opaque alignment marks
US20050084804A1 (en) * 2003-10-16 2005-04-21 Molecular Imprints, Inc. Low surface energy templates
US8076386B2 (en) * 2004-02-23 2011-12-13 Molecular Imprints, Inc. Materials for imprint lithography
US7906180B2 (en) * 2004-02-27 2011-03-15 Molecular Imprints, Inc. Composition for an etching mask comprising a silicon-containing material
US20050275311A1 (en) * 2004-06-01 2005-12-15 Molecular Imprints, Inc. Compliant device for nano-scale manufacturing
US20050276919A1 (en) * 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method for dispensing a fluid on a substrate
CN101379435A (zh) * 2004-06-03 2009-03-04 得克萨斯州大学系统董事会 用于改进显微蚀刻的对齐和覆盖的系统和方法
US7768624B2 (en) * 2004-06-03 2010-08-03 Board Of Regents, The University Of Texas System Method for obtaining force combinations for template deformation using nullspace and methods optimization techniques
US20050270516A1 (en) * 2004-06-03 2005-12-08 Molecular Imprints, Inc. System for magnification and distortion correction during nano-scale manufacturing
US7785526B2 (en) * 2004-07-20 2010-08-31 Molecular Imprints, Inc. Imprint alignment method, system, and template
US7292326B2 (en) * 2004-11-30 2007-11-06 Molecular Imprints, Inc. Interferometric analysis for the manufacture of nano-scale devices
US20070231421A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Enhanced Multi Channel Alignment
US7630067B2 (en) 2004-11-30 2009-12-08 Molecular Imprints, Inc. Interferometric analysis method for the manufacture of nano-scale devices
WO2006060758A2 (en) * 2004-12-01 2006-06-08 Molecular Imprints, Inc. Methods of exposure for the purpose of thermal management for imprint lithography processes
US20070228608A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
JP5306989B2 (ja) 2006-04-03 2013-10-02 モレキュラー・インプリンツ・インコーポレーテッド 複数のフィールド及びアライメント・マークを有する基板を同時にパターニングする方法
JP5027468B2 (ja) * 2006-09-15 2012-09-19 日本ミクロコーティング株式会社 プローブクリーニング用又はプローブ加工用シート、及びプローブ加工方法
CN103091993B (zh) * 2011-11-02 2015-02-11 上海微电子装备有限公司 用于光刻机透镜热效应测量的测试标记及其测量方法
CN114217370A (zh) * 2021-12-16 2022-03-22 西安工业大学 宽带消色差聚焦与偏振调控的微结构波带片及设计方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52109875A (en) * 1976-02-25 1977-09-14 Hitachi Ltd Position matching system for mask and wafer and its unit
US4037969A (en) * 1976-04-02 1977-07-26 Bell Telephone Laboratories, Incorporated Zone plate alignment marks
DE2633297A1 (de) * 1976-07-23 1978-01-26 Siemens Ag Verfahren zur automatischen justierung
DE2722958A1 (de) * 1977-05-20 1978-11-23 Siemens Ag Verfahren zur justierung einer halbleiterscheibe relativ zu einer bestrahlungsmaske bei der roentgenstrahl-fotolithografie
DE2723902C2 (de) * 1977-05-26 1983-12-08 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Parallelausrichtung und Justierung der Lage einer Halbleiterscheibe relativ zu einer Bestrahlungsmaske bei der Röntgenstrahl-Fotolithografie
US4185202A (en) * 1977-12-05 1980-01-22 Bell Telephone Laboratories, Incorporated X-ray lithography
FR2436967A1 (fr) * 1978-09-19 1980-04-18 Thomson Csf Procede d'alignement optique de motifs dans deux plans rapproches et dispositif d'alignement mettant en oeuvre un tel procede

Also Published As

Publication number Publication date
JPH0132649B2 (xx) 1989-07-10
BE888344A (fr) 1981-07-31
JPS56157033A (en) 1981-12-04
FR2482285B1 (xx) 1985-02-01
IT8121022A0 (it) 1981-04-09
GB2073950A (en) 1981-10-21
US4326805A (en) 1982-04-27
GB2073950B (en) 1984-04-18
DE3114682C2 (xx) 1987-05-21
DE3114682A1 (de) 1981-12-24
CA1154175A (en) 1983-09-20
IT1137326B (it) 1986-09-10
FR2482285A1 (fr) 1981-11-13
NL8101776A (nl) 1981-11-02
NL189632B (nl) 1993-01-04

Similar Documents

Publication Publication Date Title
NL189632C (nl) Werkwijze voor het uitlijnen van masker- en wafelorganen.
NL189395C (nl) Legitimatiekaart en werkwijze voor het vervaardigen ervan.
NL193037B (nl) Werkwijze en inrichting voor het bewerken van spraak.
NL191217C (nl) Werkwijze en inrichting voor boorputonderzoek.
NL191631B (nl) Inrichting en werkwijze voor het trekken van halfgeleiderstaven.
NL7710897A (nl) Werkwijze en inrichting voor het oprichten van koepelvormige bouwconstructies.
NL7902589A (nl) Inrichting voor het behandelen van oppervlakken.
NL189453C (nl) Legitimatiekaart en werkwijze voor het vervaardigen daarvan.
NL7904859A (nl) Anti-transpiratiemiddelen en werkwijze ter bereiding daarvan.
NL7701367A (nl) Werkwijze en inrichting voor het etsen.
NL187312C (nl) Werkwijze voor het defosfateren van water.
NL189102C (nl) Transistor en werkwijze voor het vervaardigen daarvan.
NL189806C (nl) Meerlagige legitimatiekaart alsmede werkwijze voor de vervaardiging hiervan.
NL7702530A (nl) Werkwijze en inrichting voor radioimmunobe- palingen.
NL7904393A (nl) Werkwijze voor het behandelen van oppervlakken.
NL186664C (nl) Halfgeleiderinrichting en werkwijze voor het vervaardigen daarvan.
NL7902001A (nl) Pompaggregaat alsmede werkwijze voor het samenstellen daarvan.
NL190797C (nl) Geluidveldsimulatiestelsel en werkwijze voor het ijken daarvan.
NL7902217A (nl) Werkwijze en inrichting voor het uitzetten van tabak.
NL7900892A (nl) Werkwijze voor het bereiden van aminen.
NL7904832A (nl) Absorberende bekleding en werkwijze voor het vervaar- digen ervan.
NL7803184A (nl) Werkwijze en inrichting voor het vervaardigen van vliezen.
NL183790B (nl) Werkwijze voor karaktersegmentatie.
NL189667B (nl) Sulfobetainen en werkwijze voor het bereiden daarvan.
NL187937C (nl) Fotografische filmeenheid en werkwijze voor het vervaardigen daarvan.

Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
A85 Still pending on 85-01-01
BC A request for examination has been filed
V1 Lapsed because of non-payment of the annual fee

Effective date: 20001101