GB8806232D0 - Vernier structure for flip chip bonded devices - Google Patents

Vernier structure for flip chip bonded devices

Info

Publication number
GB8806232D0
GB8806232D0 GB8806232A GB8806232A GB8806232D0 GB 8806232 D0 GB8806232 D0 GB 8806232D0 GB 8806232 A GB8806232 A GB 8806232A GB 8806232 A GB8806232 A GB 8806232A GB 8806232 D0 GB8806232 D0 GB 8806232D0
Authority
GB
United Kingdom
Prior art keywords
flip chip
chip bonded
bonded devices
vernier structure
vernier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB8806232A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Co Ltd
Original Assignee
Plessey Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Co Ltd filed Critical Plessey Co Ltd
Priority to GB8806232A priority Critical patent/GB8806232D0/en
Publication of GB8806232D0 publication Critical patent/GB8806232D0/en
Priority to GB8811529A priority patent/GB2215912B/en
Priority to PCT/GB1989/000282 priority patent/WO1989008926A1/en
Priority to JP1503616A priority patent/JP2660077B2/en
Priority to US07/435,477 priority patent/US5022580A/en
Priority to EP89904099A priority patent/EP0357769A1/en
Pending legal-status Critical Current

Links

GB8806232A 1988-03-16 1988-03-16 Vernier structure for flip chip bonded devices Pending GB8806232D0 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GB8806232A GB8806232D0 (en) 1988-03-16 1988-03-16 Vernier structure for flip chip bonded devices
GB8811529A GB2215912B (en) 1988-03-16 1988-05-16 Aligning the components of flip chip bonded devices
PCT/GB1989/000282 WO1989008926A1 (en) 1988-03-16 1989-03-16 Vernier structure for flip chip bonded devices
JP1503616A JP2660077B2 (en) 1988-03-16 1989-03-16 Vernier structure for flip-chip bonded equipment
US07/435,477 US5022580A (en) 1988-03-16 1989-03-16 Vernier structure for flip chip bonded devices
EP89904099A EP0357769A1 (en) 1988-03-16 1989-03-16 Vernier structure for flip chip bonded devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8806232A GB8806232D0 (en) 1988-03-16 1988-03-16 Vernier structure for flip chip bonded devices

Publications (1)

Publication Number Publication Date
GB8806232D0 true GB8806232D0 (en) 1988-04-13

Family

ID=10633527

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8806232A Pending GB8806232D0 (en) 1988-03-16 1988-03-16 Vernier structure for flip chip bonded devices
GB8811529A Expired GB2215912B (en) 1988-03-16 1988-05-16 Aligning the components of flip chip bonded devices

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB8811529A Expired GB2215912B (en) 1988-03-16 1988-05-16 Aligning the components of flip chip bonded devices

Country Status (1)

Country Link
GB (2) GB8806232D0 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2757276B1 (en) * 1996-12-13 1999-01-08 Commissariat Energie Atomique ASSEMBLY OF OPTICALLY ALIGNED OPTICAL COMPONENTS AND METHOD FOR MANUFACTURING THE ASSEMBLY
DE19839760A1 (en) 1998-09-01 2000-03-02 Bosch Gmbh Robert Method for connecting electronic components to a carrier substrate and method for checking such a connection
US6563905B1 (en) * 2001-10-30 2003-05-13 Qualcomm, Incorporated Ball grid array X-ray orientation mark

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3667848A (en) * 1970-02-02 1972-06-06 Ncr Co Semiconductor chip bonding method
US4353087A (en) * 1979-03-12 1982-10-05 The Perkin-Elmer Corporation Automatic mask alignment
US4326805A (en) * 1980-04-11 1982-04-27 Bell Telephone Laboratories, Incorporated Method and apparatus for aligning mask and wafer members
JPS57112021A (en) * 1980-12-29 1982-07-12 Fujitsu Ltd Manufacture of semiconductor device
JPS59224123A (en) * 1983-05-20 1984-12-17 Oki Electric Ind Co Ltd Alignment mark for wafer

Also Published As

Publication number Publication date
GB2215912A (en) 1989-09-27
GB2215912B (en) 1992-02-12
GB8811529D0 (en) 1988-06-22

Similar Documents

Publication Publication Date Title
EP0180776A3 (en) Chip-on-chip semiconductor device
EP0185941A3 (en) Molecule-based microelectronic devices
GB2195496B (en) A semiconductor integrated circuit device
EP0333418A3 (en) Semiconductor laser device
EP0249378A3 (en) Package for integrated circuit
IL89158A0 (en) Hermetic package for integrated circuit chips
GB2137809B (en) A ceramic package for semiconductor devices
GB8803924D0 (en) Semiconductor devices
HK40090A (en) A semiconductor integrated circuit device
EP0358227A3 (en) Semiconductor laser device
EP0339154A3 (en) Ic package
GB8820997D0 (en) Semiconductor devices
GB8426633D0 (en) Packages for semi-conductor devices
GB2215125B (en) Semiconductor device
KR960008357B1 (en) Chip type electronic component
GB8806232D0 (en) Vernier structure for flip chip bonded devices
EP0333206A3 (en) Semiconductor integrated circuit
GB8819949D0 (en) Semiconductor devices
EP0334759A3 (en) Semiconductor device
EP0346120A3 (en) Semiconductor device
KR910009358B1 (en) Semiconductor devices
EP0387416A3 (en) Integrated light-receiving semiconductor device
KR930001219B1 (en) Semiconductor device
GB8913412D0 (en) Bonding devices
GB2194386B (en) Solder bonded integrated circuit devices