GB8806232D0 - Vernier structure for flip chip bonded devices - Google Patents
Vernier structure for flip chip bonded devicesInfo
- Publication number
- GB8806232D0 GB8806232D0 GB8806232A GB8806232A GB8806232D0 GB 8806232 D0 GB8806232 D0 GB 8806232D0 GB 8806232 A GB8806232 A GB 8806232A GB 8806232 A GB8806232 A GB 8806232A GB 8806232 D0 GB8806232 D0 GB 8806232D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- flip chip
- chip bonded
- bonded devices
- vernier structure
- vernier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8806232A GB8806232D0 (en) | 1988-03-16 | 1988-03-16 | Vernier structure for flip chip bonded devices |
GB8811529A GB2215912B (en) | 1988-03-16 | 1988-05-16 | Aligning the components of flip chip bonded devices |
PCT/GB1989/000282 WO1989008926A1 (en) | 1988-03-16 | 1989-03-16 | Vernier structure for flip chip bonded devices |
JP1503616A JP2660077B2 (en) | 1988-03-16 | 1989-03-16 | Vernier structure for flip-chip bonded equipment |
US07/435,477 US5022580A (en) | 1988-03-16 | 1989-03-16 | Vernier structure for flip chip bonded devices |
EP89904099A EP0357769A1 (en) | 1988-03-16 | 1989-03-16 | Vernier structure for flip chip bonded devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8806232A GB8806232D0 (en) | 1988-03-16 | 1988-03-16 | Vernier structure for flip chip bonded devices |
Publications (1)
Publication Number | Publication Date |
---|---|
GB8806232D0 true GB8806232D0 (en) | 1988-04-13 |
Family
ID=10633527
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8806232A Pending GB8806232D0 (en) | 1988-03-16 | 1988-03-16 | Vernier structure for flip chip bonded devices |
GB8811529A Expired GB2215912B (en) | 1988-03-16 | 1988-05-16 | Aligning the components of flip chip bonded devices |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8811529A Expired GB2215912B (en) | 1988-03-16 | 1988-05-16 | Aligning the components of flip chip bonded devices |
Country Status (1)
Country | Link |
---|---|
GB (2) | GB8806232D0 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2757276B1 (en) * | 1996-12-13 | 1999-01-08 | Commissariat Energie Atomique | ASSEMBLY OF OPTICALLY ALIGNED OPTICAL COMPONENTS AND METHOD FOR MANUFACTURING THE ASSEMBLY |
DE19839760A1 (en) | 1998-09-01 | 2000-03-02 | Bosch Gmbh Robert | Method for connecting electronic components to a carrier substrate and method for checking such a connection |
US6563905B1 (en) * | 2001-10-30 | 2003-05-13 | Qualcomm, Incorporated | Ball grid array X-ray orientation mark |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3667848A (en) * | 1970-02-02 | 1972-06-06 | Ncr Co | Semiconductor chip bonding method |
US4353087A (en) * | 1979-03-12 | 1982-10-05 | The Perkin-Elmer Corporation | Automatic mask alignment |
US4326805A (en) * | 1980-04-11 | 1982-04-27 | Bell Telephone Laboratories, Incorporated | Method and apparatus for aligning mask and wafer members |
JPS57112021A (en) * | 1980-12-29 | 1982-07-12 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS59224123A (en) * | 1983-05-20 | 1984-12-17 | Oki Electric Ind Co Ltd | Alignment mark for wafer |
-
1988
- 1988-03-16 GB GB8806232A patent/GB8806232D0/en active Pending
- 1988-05-16 GB GB8811529A patent/GB2215912B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2215912A (en) | 1989-09-27 |
GB2215912B (en) | 1992-02-12 |
GB8811529D0 (en) | 1988-06-22 |
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