NL1027081C2 - Schuurgereedschappen vervaardigd met een zelfontwijkende schuurkorrelmatrix. - Google Patents
Schuurgereedschappen vervaardigd met een zelfontwijkende schuurkorrelmatrix. Download PDFInfo
- Publication number
- NL1027081C2 NL1027081C2 NL1027081A NL1027081A NL1027081C2 NL 1027081 C2 NL1027081 C2 NL 1027081C2 NL 1027081 A NL1027081 A NL 1027081A NL 1027081 A NL1027081 A NL 1027081A NL 1027081 C2 NL1027081 C2 NL 1027081C2
- Authority
- NL
- Netherlands
- Prior art keywords
- abrasive
- matrix
- abrasive grain
- tool
- group
- Prior art date
Links
- 239000006061 abrasive grain Substances 0.000 title claims description 172
- 239000011159 matrix material Substances 0.000 title claims description 127
- 238000000034 method Methods 0.000 claims description 64
- 239000000463 material Substances 0.000 claims description 63
- 239000000758 substrate Substances 0.000 claims description 52
- 238000004519 manufacturing process Methods 0.000 claims description 22
- 239000003292 glue Substances 0.000 claims description 20
- 230000007717 exclusion Effects 0.000 claims description 17
- 239000010410 layer Substances 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 239000002356 single layer Substances 0.000 claims description 11
- 239000011230 binding agent Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 4
- 238000005246 galvanizing Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000004753 textile Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 238000005304 joining Methods 0.000 claims 5
- 238000005096 rolling process Methods 0.000 claims 3
- 239000010432 diamond Substances 0.000 description 22
- 229910003460 diamond Inorganic materials 0.000 description 19
- 238000009826 distribution Methods 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 230000001788 irregular Effects 0.000 description 7
- 239000011324 bead Substances 0.000 description 6
- 238000005498 polishing Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 239000002699 waste material Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000008187 granular material Substances 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 241001463139 Vitta Species 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- -1 non-woven sheets Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- LFVLUOAHQIVABZ-UHFFFAOYSA-N Iodofenphos Chemical compound COP(=S)(OC)OC1=CC(Cl)=C(I)C=C1Cl LFVLUOAHQIVABZ-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 229910000419 boron suboxide Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000004091 panning Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 239000012855 volatile organic compound Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24372—Particulate matter
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/683,486 US20050076577A1 (en) | 2003-10-10 | 2003-10-10 | Abrasive tools made with a self-avoiding abrasive grain array |
| US68348603 | 2003-10-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NL1027081A1 NL1027081A1 (nl) | 2005-04-12 |
| NL1027081C2 true NL1027081C2 (nl) | 2005-10-11 |
Family
ID=34377597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL1027081A NL1027081C2 (nl) | 2003-10-10 | 2004-09-21 | Schuurgereedschappen vervaardigd met een zelfontwijkende schuurkorrelmatrix. |
Country Status (25)
| Country | Link |
|---|---|
| US (4) | US20050076577A1 (pl) |
| JP (1) | JP4520465B2 (pl) |
| KR (1) | KR100796184B1 (pl) |
| CN (1) | CN1867428B (pl) |
| AT (1) | AT502328B1 (pl) |
| BE (1) | BE1016293A4 (pl) |
| BR (1) | BRPI0415196A (pl) |
| CA (1) | CA2540733C (pl) |
| DE (1) | DE112004001912T5 (pl) |
| ES (1) | ES2306591B1 (pl) |
| FI (1) | FI20060341A (pl) |
| FR (1) | FR2860744B1 (pl) |
| GB (1) | GB2423491B (pl) |
| HK (1) | HK1094176A1 (pl) |
| HU (1) | HUP0600297A2 (pl) |
| IL (1) | IL174805A (pl) |
| IT (1) | ITMI20041858A1 (pl) |
| MX (1) | MXPA06004041A (pl) |
| MY (1) | MY136988A (pl) |
| NL (1) | NL1027081C2 (pl) |
| PL (1) | PL204960B1 (pl) |
| RU (1) | RU2320472C2 (pl) |
| SK (1) | SK50362006A3 (pl) |
| TW (1) | TWI278928B (pl) |
| WO (1) | WO2005039828A1 (pl) |
Families Citing this family (68)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9238207B2 (en) | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
| US9409280B2 (en) | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9199357B2 (en) * | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
| US20060254154A1 (en) * | 2005-05-12 | 2006-11-16 | Wei Huang | Abrasive tool and method of making the same |
| US8393934B2 (en) | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
| US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
| US8678878B2 (en) | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
| US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
| US20070175765A1 (en) * | 2006-02-01 | 2007-08-02 | Kosta George | Method of fabricating monolayer abrasive tools |
| EP2180978B1 (en) * | 2006-03-03 | 2010-11-17 | Giovanni Giuseppe Ferronato Sandro | System for indicating the grade of an abrasive |
| FI121654B (sv) | 2006-07-10 | 2011-02-28 | Kwh Mirka Ab Oy | Förfarande för tillverkning av en flexibel sliprondell och en flexibel sliprondell |
| TWI337915B (en) * | 2006-07-14 | 2011-03-01 | Saint Gobain Abrasives Inc | Backingless abrasive article |
| US20080271384A1 (en) * | 2006-09-22 | 2008-11-06 | Saint-Gobain Ceramics & Plastics, Inc. | Conditioning tools and techniques for chemical mechanical planarization |
| JP5121315B2 (ja) * | 2007-06-07 | 2013-01-16 | 豊田バンモップス株式会社 | 砥粒貼着装置、及び砥粒貼着プログラム |
| FI20075533L (fi) * | 2007-07-10 | 2009-01-11 | Kwh Mirka Ab Oy | Hiomatuote ja menetelmä tämän valmistamiseksi |
| EP2178697B1 (en) * | 2007-08-13 | 2014-03-26 | 3M Innovative Properties Company | Coated abrasive laminate disc and methods of making the same |
| JP2010536183A (ja) * | 2007-08-23 | 2010-11-25 | サンーゴバン アブレイシブズ，インコーポレイティド | 次世代酸化物／金属ｃｍｐ用の最適化されたｃｍｐコンディショナー設計 |
| CN101376234B (zh) * | 2007-08-28 | 2013-05-29 | 侯家祥 | 一种研磨工具磨料颗粒有序排列的方法 |
| JP5121423B2 (ja) * | 2007-12-03 | 2013-01-16 | 豊田バンモップス株式会社 | 超砥粒のセッティング方法 |
| JP5171231B2 (ja) * | 2007-12-03 | 2013-03-27 | 豊田バンモップス株式会社 | 超砥粒のセッティング装置 |
| JP5537437B2 (ja) * | 2007-12-12 | 2014-07-02 | サンーゴバン アブレイシブズ，インコーポレイティド | 混成結合材を有する多機能研磨ツール |
| JP5539339B2 (ja) * | 2008-06-23 | 2014-07-02 | サンーゴバン アブレイシブズ，インコーポレイティド | 高気孔率ビトリファイド超砥粒製品および製造方法 |
| JP5065197B2 (ja) * | 2008-07-31 | 2012-10-31 | 株式会社ノリタケカンパニーリミテド | ビトリファイド砥石 |
| WO2010110834A1 (en) | 2009-03-24 | 2010-09-30 | Saint-Gobain Abrasives, Inc. | Abrasive tool for use as a chemical mechanical planarization pad conditioner |
| SG175071A1 (en) * | 2009-04-17 | 2011-11-28 | 3M Innovative Properties Co | Planar abrasive articles made using transfer articles and method of making the same |
| MY155563A (en) * | 2009-06-02 | 2015-10-30 | Saint Gobain Abrasives Inc | Corrosion-resistant cmp conditioning tools and methods for making and using same |
| US20110097977A1 (en) * | 2009-08-07 | 2011-04-28 | Abrasive Technology, Inc. | Multiple-sided cmp pad conditioning disk |
| RU2516318C2 (ru) | 2009-08-14 | 2014-05-20 | Сэнт-Гобэн Эбрейзивс, Инк. | Абразивное изделие (варианты) и способ резания сапфира с его использованием |
| CN102665988B (zh) | 2009-08-14 | 2015-11-25 | 圣戈班磨料磨具有限公司 | 包括粘结到长形本体上的磨料颗粒的磨料物品及其形成方法 |
| CN102612734A (zh) * | 2009-09-01 | 2012-07-25 | 圣戈班磨料磨具有限公司 | 化学机械抛光修整器 |
| JP5681201B2 (ja) | 2009-10-27 | 2015-03-04 | サンーゴバン アブレイシブズ，インコーポレイティド | 樹脂ボンド砥粒 |
| EP2493659A4 (en) | 2009-10-27 | 2015-09-02 | Saint Gobain Abrasives Inc | VITREOUS BONDED ABRASIVE |
| JP2013514159A (ja) * | 2009-12-29 | 2013-04-25 | サンーゴバン アブレイシブズ，インコーポレイティド | 家庭用品表面の清掃方法 |
| CA2791475C (en) | 2010-03-03 | 2018-05-15 | 3M Innovative Properties Company | Bonded abrasive wheel |
| US20110306275A1 (en) * | 2010-06-13 | 2011-12-15 | Nicolson Matthew D | Component finishing tool |
| DE102010038324B4 (de) * | 2010-07-23 | 2012-03-22 | Hilti Aktiengesellschaft | Vorrichtung zum Positionieren von Schneidpartikeln |
| TWI453089B (zh) * | 2010-08-16 | 2014-09-21 | Saint Gobain Abrasives Inc | 對包含超級磨料材料的工件進行磨削之方法 |
| TWI454342B (zh) | 2010-08-16 | 2014-10-01 | Saint Gobain Abrasives Inc | 用於對超級磨料工件進行磨削之磨料物品 |
| TW201507812A (zh) | 2010-12-30 | 2015-03-01 | Saint Gobain Abrasives Inc | 磨料物品及形成方法 |
| KR101870000B1 (ko) | 2011-02-16 | 2018-06-22 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 회전 정렬된 성형된 세라믹 연마 입자를 갖는 코팅된 연마 용품 및 제조 방법 |
| CN102198641B (zh) * | 2011-05-12 | 2013-05-01 | 沈阳理工大学 | 叶序排布磨料端面超硬磨料砂轮及其生产方法 |
| WO2012162430A2 (en) | 2011-05-23 | 2012-11-29 | Chien-Min Sung | Cmp pad dresser having leveled tips and associated methods |
| TW201300199A (zh) * | 2011-06-30 | 2013-01-01 | Saint Gobain Abrasives Inc | 磨料物品及製造方法 |
| US9375826B2 (en) | 2011-09-16 | 2016-06-28 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
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- 2003-10-10 US US10/683,486 patent/US20050076577A1/en not_active Abandoned
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- 2004-09-07 WO PCT/US2004/028881 patent/WO2005039828A1/en active IP Right Grant
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- 2004-09-07 DE DE112004001912T patent/DE112004001912T5/de not_active Withdrawn
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- 2004-10-07 BE BE2004/0493A patent/BE1016293A4/fr active
- 2004-10-08 FR FR0410640A patent/FR2860744B1/fr not_active Expired - Fee Related
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