JP5681201B2 - 樹脂ボンド砥粒 - Google Patents
樹脂ボンド砥粒 Download PDFInfo
- Publication number
- JP5681201B2 JP5681201B2 JP2012537009A JP2012537009A JP5681201B2 JP 5681201 B2 JP5681201 B2 JP 5681201B2 JP 2012537009 A JP2012537009 A JP 2012537009A JP 2012537009 A JP2012537009 A JP 2012537009A JP 5681201 B2 JP5681201 B2 JP 5681201B2
- Authority
- JP
- Japan
- Prior art keywords
- superabrasive
- component
- resin product
- microns
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Description
Claims (15)
- 超砥粒樹脂製品において、
− 超砥粒樹脂製品の少なくとも20体積%の量の超砥粒成分と;
− 超砥粒樹脂製品の0.05〜10体積%の範囲の量でセリウム酸化物を含むランタノイドの酸化物で構成される酸化物成分と;
− ポリマーボンド成分を含み、相互連結された細孔の網状組織を画定する連続相であって、前記細孔が少なくとも2つのモードを伴う多モードサイズ分布を有する連続相と;
を含み、前記超砥粒成分と前記酸化物成分が前記連続相内に分布している、超砥粒樹脂製品。 - 超砥粒樹脂製品において、
− 超砥粒樹脂製品の少なくとも20体積%の量の超砥粒成分と;
− 超砥粒樹脂製品の0.05〜10体積%の範囲の量でセリウム酸化物を含むランタノイドの酸化物で構成される酸化物成分と;
− ボンド成分を含み、相互連結された細孔の網状組織を画定する連続相であって、前記細孔が125〜150ミクロンのサイズを有する大細孔、20〜50ミクロンのサイズを有する小細孔および85ミクロン〜105ミクロンのサイズを有する中間細孔を含む連続相と;
を含み、前記超砥粒成分と前記酸化物成分が前記連続相内に分布している、超砥粒樹脂製品。 - 前記酸化物成分が、超砥粒製品の1.0〜4体積パーセントの範囲内の量で存在する、請求項1または2に記載の超砥粒樹脂製品。
- 前記連続相が熱可塑性ポリマー成分と熱硬化性樹脂成分とをさらに含む、請求項1または2に記載の超砥粒樹脂製品。
- 前記連続相中の熱硬化性樹脂対熱可塑性ポリマー成分の比が、体積比で80:15〜80:10の範囲内にある、請求項4に記載の超砥粒樹脂製品。
- 前記熱可塑性ポリマー成分が、ポリアクリロニトリル、ポリビニルデン、ポリスチレン、ナイロン、ポリエチレン、ポリプロピレンおよびポリメチルメタクリレートからなる群から選択される少なくとも1つの要素を含む、請求項4に記載の超砥粒樹脂製品。
- 前記熱可塑性ポリマー成分がポリアクリロニトリルを含む、請求項6に記載の超砥粒樹脂製品。
- 前記熱可塑性ポリマーがポリビニルデンを含む、請求項6に記載の超砥粒樹脂製品。
- 前記ポリビニルデンがポリ塩化ビニルデンを含む、請求項8に記載の超砥粒樹脂製品。
- 前記熱可塑性ポリマー成分がポリアクリロニトリルおよびポリ塩化ビニルデンを含む、請求項9に記載の超砥粒樹脂製品。
- ポリアクリロニトリル対ポリ塩化ビニルデンの比が、体積比で1:1〜98:2の範囲内である、請求項10に記載の超砥粒樹脂製品。
- 前記連続相対超砥粒成分の比が、体積比で2:1〜1:2の範囲内にある、請求項1または2に記載の超砥粒樹脂製品。
- 超砥粒製品が、30体積%〜80体積%の範囲内の気孔率を有する、請求項1または2に記載の超砥粒樹脂製品。
- 前記連続相が熱硬化性ポリマー成分をさらに含み、前記熱硬化性ポリマー成分が、ポリフェノールホルムアルデヒド、ポリアミド、ポリイミドおよびエポキシ変性フェノールホルムアルデヒドからなる群から選択される少なくとも1つの要素を含む、請求項1または2に記載の超砥粒樹脂製品。
- 超砥粒製品の形成方法において、
a)超砥粒樹脂製品の少なくとも20体積%の量の超砥粒、超砥粒樹脂製品の0.05〜10体積%の範囲の量で酸化物成分、ボンド成分および被包ガスのポリマー発泡剤を組合せるステップであって前記酸化物成分がセリウム酸化物を含むランタノイドの酸化物で構成されているステップと;
b)前記発泡剤内部の被包からガスの少なくとも一部分を放出させる温度までかつそのような時間、前記組合わされた超砥粒、ボンド成分およびポリマー発泡剤を加熱するステップと;
を含む方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25525609P | 2009-10-27 | 2009-10-27 | |
US61/255,256 | 2009-10-27 | ||
PCT/US2010/054329 WO2011056671A2 (en) | 2009-10-27 | 2010-10-27 | Resin bonded abrasive |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013508184A JP2013508184A (ja) | 2013-03-07 |
JP5681201B2 true JP5681201B2 (ja) | 2015-03-04 |
Family
ID=43970687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012537009A Expired - Fee Related JP5681201B2 (ja) | 2009-10-27 | 2010-10-27 | 樹脂ボンド砥粒 |
Country Status (10)
Country | Link |
---|---|
US (2) | US9138866B2 (ja) |
EP (1) | EP2493660A4 (ja) |
JP (1) | JP5681201B2 (ja) |
KR (3) | KR20120085862A (ja) |
CN (1) | CN102648072A (ja) |
AU (1) | AU2010315460B2 (ja) |
BR (1) | BR112012009809A2 (ja) |
CA (1) | CA2779275A1 (ja) |
MX (1) | MX2012004913A (ja) |
WO (1) | WO2011056671A2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US7918293B1 (en) | 2005-03-09 | 2011-04-05 | Us Synthetic Corporation | Method and system for perceiving a boundary between a first region and a second region of a superabrasive volume |
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US8969833B1 (en) * | 2011-12-16 | 2015-03-03 | Us Synthetic Corporation | Method and system for perceiving a boundary between a first region and a second region of a superabrasive volume |
CH710934A1 (de) * | 2015-04-01 | 2016-10-14 | Reishauer Ag | Offenporiges, keramisch gebundenes Schleifwerkzeug, Verfahren zu seiner Herstellung sowie für seine Herstellung verwendete Porenbildnermischungen. |
CN105252431A (zh) * | 2015-10-09 | 2016-01-20 | 芜湖市鸿坤汽车零部件有限公司 | 一种聚苯乙烯粘结树脂砂轮及其制备方法 |
CN106891274A (zh) * | 2017-04-19 | 2017-06-27 | 台山市远鹏研磨科技有限公司 | 一种湿式精抛轮及其制备方法 |
US10518387B2 (en) * | 2017-07-18 | 2019-12-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Grinding element, grinding wheel and manufacturing method of semiconductor package using the same |
KR102497825B1 (ko) * | 2020-09-29 | 2023-02-08 | 에스케이엔펄스 주식회사 | 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법 |
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WO2011072298A2 (en) | 2009-12-11 | 2011-06-16 | Saint-Gobain Abrasives, Inc. | Abrasive article for use with a grinding wheel |
-
2010
- 2010-10-27 MX MX2012004913A patent/MX2012004913A/es not_active Application Discontinuation
- 2010-10-27 US US13/504,917 patent/US9138866B2/en not_active Expired - Fee Related
- 2010-10-27 KR KR20127013457A patent/KR20120085862A/ko active Application Filing
- 2010-10-27 JP JP2012537009A patent/JP5681201B2/ja not_active Expired - Fee Related
- 2010-10-27 AU AU2010315460A patent/AU2010315460B2/en not_active Ceased
- 2010-10-27 KR KR20147019391A patent/KR20140103327A/ko active Application Filing
- 2010-10-27 CN CN2010800553565A patent/CN102648072A/zh active Pending
- 2010-10-27 KR KR1020157021504A patent/KR20150097811A/ko active Search and Examination
- 2010-10-27 EP EP10828906.7A patent/EP2493660A4/en not_active Withdrawn
- 2010-10-27 WO PCT/US2010/054329 patent/WO2011056671A2/en active Application Filing
- 2010-10-27 CA CA 2779275 patent/CA2779275A1/en not_active Abandoned
- 2010-10-27 BR BR112012009809A patent/BR112012009809A2/pt not_active IP Right Cessation
-
2015
- 2015-08-21 US US14/832,703 patent/US20150360346A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR20140103327A (ko) | 2014-08-26 |
US20120279139A1 (en) | 2012-11-08 |
CA2779275A1 (en) | 2011-05-12 |
BR112012009809A2 (pt) | 2016-11-22 |
WO2011056671A3 (en) | 2011-09-22 |
JP2013508184A (ja) | 2013-03-07 |
EP2493660A2 (en) | 2012-09-05 |
EP2493660A4 (en) | 2015-08-26 |
MX2012004913A (es) | 2012-08-15 |
AU2010315460B2 (en) | 2014-11-20 |
KR20120085862A (ko) | 2012-08-01 |
US9138866B2 (en) | 2015-09-22 |
WO2011056671A2 (en) | 2011-05-12 |
CN102648072A (zh) | 2012-08-22 |
AU2010315460A1 (en) | 2012-05-24 |
KR20150097811A (ko) | 2015-08-26 |
US20150360346A1 (en) | 2015-12-17 |
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