PL379550A1 - Sposób wytwarzania narzędzia ściernego z samo wykluczającym się rozkładem ziarna ściernego i narzędzie ścierne z samo wykluczającym się rozkładem ziarna ściernego - Google Patents

Sposób wytwarzania narzędzia ściernego z samo wykluczającym się rozkładem ziarna ściernego i narzędzie ścierne z samo wykluczającym się rozkładem ziarna ściernego

Info

Publication number
PL379550A1
PL379550A1 PL379550A PL37955004A PL379550A1 PL 379550 A1 PL379550 A1 PL 379550A1 PL 379550 A PL379550 A PL 379550A PL 37955004 A PL37955004 A PL 37955004A PL 379550 A1 PL379550 A1 PL 379550A1
Authority
PL
Poland
Prior art keywords
abrasive
self
avoiding
tools made
grain array
Prior art date
Application number
PL379550A
Other languages
English (en)
Other versions
PL204960B1 (pl
Inventor
Richard W. J. Hall
Jens M. Molter
Charles A. Bateman
Original Assignee
Saint-Gobain Abrasives, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint-Gobain Abrasives, Inc. filed Critical Saint-Gobain Abrasives, Inc.
Publication of PL379550A1 publication Critical patent/PL379550A1/pl
Publication of PL204960B1 publication Critical patent/PL204960B1/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
PL379550A 2003-10-10 2004-09-07 Sposób wytwarzania narzędzia ściernego z samo wykluczającym się rozkładem ziarna ściernego i narzędzie ścierne z samo wykluczającym się rozkładem ziarna ściernego PL204960B1 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/683,486 US20050076577A1 (en) 2003-10-10 2003-10-10 Abrasive tools made with a self-avoiding abrasive grain array

Publications (2)

Publication Number Publication Date
PL379550A1 true PL379550A1 (pl) 2006-10-16
PL204960B1 PL204960B1 (pl) 2010-02-26

Family

ID=34377597

Family Applications (1)

Application Number Title Priority Date Filing Date
PL379550A PL204960B1 (pl) 2003-10-10 2004-09-07 Sposób wytwarzania narzędzia ściernego z samo wykluczającym się rozkładem ziarna ściernego i narzędzie ścierne z samo wykluczającym się rozkładem ziarna ściernego

Country Status (25)

Country Link
US (4) US20050076577A1 (pl)
JP (1) JP4520465B2 (pl)
KR (1) KR100796184B1 (pl)
CN (1) CN1867428B (pl)
AT (1) AT502328B1 (pl)
BE (1) BE1016293A4 (pl)
BR (1) BRPI0415196A (pl)
CA (1) CA2540733C (pl)
DE (1) DE112004001912T5 (pl)
ES (1) ES2306591B1 (pl)
FI (1) FI20060341A (pl)
FR (1) FR2860744B1 (pl)
GB (1) GB2423491B (pl)
HK (1) HK1094176A1 (pl)
HU (1) HUP0600297A2 (pl)
IL (1) IL174805A (pl)
IT (1) ITMI20041858A1 (pl)
MX (1) MXPA06004041A (pl)
MY (1) MY136988A (pl)
NL (1) NL1027081C2 (pl)
PL (1) PL204960B1 (pl)
RU (1) RU2320472C2 (pl)
SK (1) SK50362006A3 (pl)
TW (1) TWI278928B (pl)
WO (1) WO2005039828A1 (pl)

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JP5121315B2 (ja) * 2007-06-07 2013-01-16 豊田バンモップス株式会社 砥粒貼着装置、及び砥粒貼着プログラム
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CN101778718B (zh) * 2007-08-13 2013-07-31 3M创新有限公司 涂覆层压磨盘及其制备方法
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Also Published As

Publication number Publication date
US20090202781A1 (en) 2009-08-13
ES2306591B1 (es) 2009-10-02
IL174805A0 (en) 2006-08-20
HK1094176A1 (en) 2007-03-23
WO2005039828A8 (en) 2006-05-11
CN1867428B (zh) 2012-01-11
HUP0600297A2 (en) 2007-07-30
FR2860744A1 (fr) 2005-04-15
IE20040623A1 (en) 2005-04-20
JP2007508153A (ja) 2007-04-05
ITMI20041858A1 (it) 2004-12-29
GB0609169D0 (en) 2006-06-21
AT502328A2 (de) 2007-03-15
JP4520465B2 (ja) 2010-08-04
GB2423491B (en) 2008-04-16
KR20060085656A (ko) 2006-07-27
SK50362006A3 (sk) 2006-09-07
ES2306591A1 (es) 2008-11-01
BRPI0415196A (pt) 2006-12-05
GB2423491A (en) 2006-08-30
CN1867428A (zh) 2006-11-22
AT502328A5 (de) 2009-12-15
KR100796184B1 (ko) 2008-01-21
US7507267B2 (en) 2009-03-24
US20110252710A1 (en) 2011-10-20
NL1027081C2 (nl) 2005-10-11
TWI278928B (en) 2007-04-11
NL1027081A1 (nl) 2005-04-12
CA2540733C (en) 2013-12-17
DE112004001912T5 (de) 2006-08-24
MXPA06004041A (es) 2006-06-28
US7993419B2 (en) 2011-08-09
TW200522188A (en) 2005-07-01
US20060010780A1 (en) 2006-01-19
BE1016293A4 (fr) 2006-07-04
US20050076577A1 (en) 2005-04-14
FR2860744B1 (fr) 2006-01-13
RU2320472C2 (ru) 2008-03-27
WO2005039828A1 (en) 2005-05-06
PL204960B1 (pl) 2010-02-26
IL174805A (en) 2009-09-01
CA2540733A1 (en) 2005-05-06
RU2006111358A (ru) 2007-11-27
MY136988A (en) 2008-12-31
FI20060341A (fi) 2006-04-07
AT502328B1 (de) 2010-03-15

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