FR2860744B1 - Outils abrasifs presentant une disposition de grains abrasifs auto-evitante et leur procede de fabrication - Google Patents

Outils abrasifs presentant une disposition de grains abrasifs auto-evitante et leur procede de fabrication

Info

Publication number
FR2860744B1
FR2860744B1 FR0410640A FR0410640A FR2860744B1 FR 2860744 B1 FR2860744 B1 FR 2860744B1 FR 0410640 A FR0410640 A FR 0410640A FR 0410640 A FR0410640 A FR 0410640A FR 2860744 B1 FR2860744 B1 FR 2860744B1
Authority
FR
France
Prior art keywords
abrasive
switching
self
manufacturing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0410640A
Other languages
English (en)
Other versions
FR2860744A1 (fr
Inventor
Richard W Hall
Jens M Molter
Charles A Bateman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Abrasives Inc
Original Assignee
Saint Gobain Abrasives Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Abrasives Inc filed Critical Saint Gobain Abrasives Inc
Publication of FR2860744A1 publication Critical patent/FR2860744A1/fr
Application granted granted Critical
Publication of FR2860744B1 publication Critical patent/FR2860744B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28Resins or natural or synthetic macromolecular compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372Particulate matter

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
FR0410640A 2003-10-10 2004-10-08 Outils abrasifs presentant une disposition de grains abrasifs auto-evitante et leur procede de fabrication Expired - Fee Related FR2860744B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/683,486 US20050076577A1 (en) 2003-10-10 2003-10-10 Abrasive tools made with a self-avoiding abrasive grain array

Publications (2)

Publication Number Publication Date
FR2860744A1 FR2860744A1 (fr) 2005-04-15
FR2860744B1 true FR2860744B1 (fr) 2006-01-13

Family

ID=34377597

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0410640A Expired - Fee Related FR2860744B1 (fr) 2003-10-10 2004-10-08 Outils abrasifs presentant une disposition de grains abrasifs auto-evitante et leur procede de fabrication

Country Status (25)

Country Link
US (4) US20050076577A1 (fr)
JP (1) JP4520465B2 (fr)
KR (1) KR100796184B1 (fr)
CN (1) CN1867428B (fr)
AT (1) AT502328B1 (fr)
BE (1) BE1016293A4 (fr)
BR (1) BRPI0415196A (fr)
CA (1) CA2540733C (fr)
DE (1) DE112004001912T5 (fr)
ES (1) ES2306591B1 (fr)
FI (1) FI20060341A (fr)
FR (1) FR2860744B1 (fr)
GB (1) GB2423491B (fr)
HK (1) HK1094176A1 (fr)
HU (1) HUP0600297A2 (fr)
IL (1) IL174805A (fr)
IT (1) ITMI20041858A1 (fr)
MX (1) MXPA06004041A (fr)
MY (1) MY136988A (fr)
NL (1) NL1027081C2 (fr)
PL (1) PL204960B1 (fr)
RU (1) RU2320472C2 (fr)
SK (1) SK50362006A3 (fr)
TW (1) TWI278928B (fr)
WO (1) WO2005039828A1 (fr)

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US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9199357B2 (en) * 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US20060254154A1 (en) * 2005-05-12 2006-11-16 Wei Huang Abrasive tool and method of making the same
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US20070175765A1 (en) * 2006-02-01 2007-08-02 Kosta George Method of fabricating monolayer abrasive tools
EP2180978B1 (fr) * 2006-03-03 2010-11-17 Giovanni Giuseppe Ferronato Sandro Système servant à indiquer la grosseur de grain d'un abrasif
FI121654B (sv) 2006-07-10 2011-02-28 Kwh Mirka Ab Oy Förfarande för tillverkning av en flexibel sliprondell och en flexibel sliprondell
PL2079559T3 (pl) * 2006-07-14 2013-03-29 Saint Gobain Abrasives Inc Artykuł ścierny bez podłoża
US20080271384A1 (en) * 2006-09-22 2008-11-06 Saint-Gobain Ceramics & Plastics, Inc. Conditioning tools and techniques for chemical mechanical planarization
JP5121315B2 (ja) * 2007-06-07 2013-01-16 豊田バンモップス株式会社 砥粒貼着装置、及び砥粒貼着プログラム
FI20075533L (fi) * 2007-07-10 2009-01-11 Kwh Mirka Ab Oy Hiomatuote ja menetelmä tämän valmistamiseksi
WO2009023499A1 (fr) * 2007-08-13 2009-02-19 3M Innovative Properties Company Disque en stratifié abrasif revêtu et procédé de fabrication de celui-ci
US8657652B2 (en) 2007-08-23 2014-02-25 Saint-Gobain Abrasives, Inc. Optimized CMP conditioner design for next generation oxide/metal CMP
CN101376234B (zh) * 2007-08-28 2013-05-29 侯家祥 一种研磨工具磨料颗粒有序排列的方法
JP5171231B2 (ja) * 2007-12-03 2013-03-27 豊田バンモップス株式会社 超砥粒のセッティング装置
JP5121423B2 (ja) * 2007-12-03 2013-01-16 豊田バンモップス株式会社 超砥粒のセッティング方法
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JP5065197B2 (ja) * 2008-07-31 2012-10-31 株式会社ノリタケカンパニーリミテド ビトリファイド砥石
US8342910B2 (en) 2009-03-24 2013-01-01 Saint-Gobain Abrasives, Inc. Abrasive tool for use as a chemical mechanical planarization pad conditioner
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JP5869680B2 (ja) 2011-09-29 2016-02-24 サンーゴバン アブレイシブズ,インコーポレイティド バリア層を有する細長い基板本体に結合した研磨粒子を含む研磨物品及びその形成方法
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US9242342B2 (en) * 2012-03-14 2016-01-26 Taiwan Semiconductor Manufacturing Company, Ltd. Manufacture and method of making the same
CA2773197A1 (fr) * 2012-03-27 2013-09-27 Yundong Li Outils electroplaques comportant des particules abrasives liees chimiquement et deliberement placees et leurs methodes de fabrication
CN102717325B (zh) * 2012-06-08 2014-06-11 浙江工业大学 一种基于非牛顿流体剪切增稠效应的超精密曲面抛光方法
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Also Published As

Publication number Publication date
US20090202781A1 (en) 2009-08-13
GB0609169D0 (en) 2006-06-21
FR2860744A1 (fr) 2005-04-15
US20050076577A1 (en) 2005-04-14
US7507267B2 (en) 2009-03-24
TW200522188A (en) 2005-07-01
AT502328B1 (de) 2010-03-15
BRPI0415196A (pt) 2006-12-05
JP4520465B2 (ja) 2010-08-04
PL379550A1 (pl) 2006-10-16
ES2306591A1 (es) 2008-11-01
MY136988A (en) 2008-12-31
CA2540733A1 (fr) 2005-05-06
TWI278928B (en) 2007-04-11
RU2006111358A (ru) 2007-11-27
ITMI20041858A1 (it) 2004-12-29
HK1094176A1 (en) 2007-03-23
NL1027081C2 (nl) 2005-10-11
US20110252710A1 (en) 2011-10-20
US20060010780A1 (en) 2006-01-19
MXPA06004041A (es) 2006-06-28
WO2005039828A8 (fr) 2006-05-11
JP2007508153A (ja) 2007-04-05
FI20060341A (fi) 2006-04-07
ES2306591B1 (es) 2009-10-02
CN1867428A (zh) 2006-11-22
GB2423491B (en) 2008-04-16
US7993419B2 (en) 2011-08-09
KR20060085656A (ko) 2006-07-27
CN1867428B (zh) 2012-01-11
KR100796184B1 (ko) 2008-01-21
IE20040623A1 (en) 2005-04-20
HUP0600297A2 (en) 2007-07-30
AT502328A5 (de) 2009-12-15
AT502328A2 (de) 2007-03-15
GB2423491A (en) 2006-08-30
RU2320472C2 (ru) 2008-03-27
PL204960B1 (pl) 2010-02-26
NL1027081A1 (nl) 2005-04-12
BE1016293A4 (fr) 2006-07-04
IL174805A (en) 2009-09-01
SK50362006A3 (sk) 2006-09-07
DE112004001912T5 (de) 2006-08-24
WO2005039828A1 (fr) 2005-05-06
IL174805A0 (en) 2006-08-20
CA2540733C (fr) 2013-12-17

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