NL1011487C2 - Werkwijze en inrichting voor het roteren van een wafer. - Google Patents

Werkwijze en inrichting voor het roteren van een wafer. Download PDF

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Publication number
NL1011487C2
NL1011487C2 NL1011487A NL1011487A NL1011487C2 NL 1011487 C2 NL1011487 C2 NL 1011487C2 NL 1011487 A NL1011487 A NL 1011487A NL 1011487 A NL1011487 A NL 1011487A NL 1011487 C2 NL1011487 C2 NL 1011487C2
Authority
NL
Netherlands
Prior art keywords
wafer
gas
groove pattern
gas flow
reactor
Prior art date
Application number
NL1011487A
Other languages
English (en)
Dutch (nl)
Inventor
Vladimir Ivanovich Kuznetsov
Sijbrand Radelaar
Jacobus Cornelis Gerard Sanden
Theo Anjes Maria Ruijl
Original Assignee
Koninkl Philips Electronics Nv
Asm Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Asm Int filed Critical Koninkl Philips Electronics Nv
Priority to NL1011487A priority Critical patent/NL1011487C2/nl
Priority to TW088107104A priority patent/TW525210B/zh
Priority to EP00909799A priority patent/EP1159755B1/fr
Priority to US09/936,257 priority patent/US6824619B1/en
Priority to DE60001448T priority patent/DE60001448T2/de
Priority to JP2000604440A priority patent/JP2003530681A/ja
Priority to AU31984/00A priority patent/AU3198400A/en
Priority to KR1020017011333A priority patent/KR100704572B1/ko
Priority to PCT/NL2000/000154 priority patent/WO2000054310A1/fr
Application granted granted Critical
Publication of NL1011487C2 publication Critical patent/NL1011487C2/nl
Priority to US10/969,256 priority patent/US7351293B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
NL1011487A 1999-03-08 1999-03-08 Werkwijze en inrichting voor het roteren van een wafer. NL1011487C2 (nl)

Priority Applications (10)

Application Number Priority Date Filing Date Title
NL1011487A NL1011487C2 (nl) 1999-03-08 1999-03-08 Werkwijze en inrichting voor het roteren van een wafer.
TW088107104A TW525210B (en) 1999-03-08 1999-04-30 Method and device for rotating a wafer
US09/936,257 US6824619B1 (en) 1999-03-08 2000-03-08 Method and device for rotating a wafer
DE60001448T DE60001448T2 (de) 1999-03-08 2000-03-08 Verfahren und gerät für waferrotation
EP00909799A EP1159755B1 (fr) 1999-03-08 2000-03-08 Procede et appareil utilises pour la rotation d'une tranche
JP2000604440A JP2003530681A (ja) 1999-03-08 2000-03-08 ウェーハを回転するための装置及び方法
AU31984/00A AU3198400A (en) 1999-03-08 2000-03-08 Method and device for rotating a wafer
KR1020017011333A KR100704572B1 (ko) 1999-03-08 2000-03-08 웨이퍼를 회전시키는 장치 및 방법
PCT/NL2000/000154 WO2000054310A1 (fr) 1999-03-08 2000-03-08 Procede et appareil utilises pour la rotation d'une tranche
US10/969,256 US7351293B2 (en) 1999-03-08 2004-10-19 Method and device for rotating a wafer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1011487A NL1011487C2 (nl) 1999-03-08 1999-03-08 Werkwijze en inrichting voor het roteren van een wafer.
NL1011487 1999-03-08

Publications (1)

Publication Number Publication Date
NL1011487C2 true NL1011487C2 (nl) 2000-09-18

Family

ID=19768793

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1011487A NL1011487C2 (nl) 1999-03-08 1999-03-08 Werkwijze en inrichting voor het roteren van een wafer.

Country Status (9)

Country Link
US (2) US6824619B1 (fr)
EP (1) EP1159755B1 (fr)
JP (1) JP2003530681A (fr)
KR (1) KR100704572B1 (fr)
AU (1) AU3198400A (fr)
DE (1) DE60001448T2 (fr)
NL (1) NL1011487C2 (fr)
TW (1) TW525210B (fr)
WO (1) WO2000054310A1 (fr)

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NL1012004C2 (nl) * 1999-05-07 2000-11-13 Asm Int Werkwijze voor het verplaatsen van wafers alsmede ring.
US6997989B2 (en) * 2003-12-08 2006-02-14 Boston Scientific Scimed, Inc. Medical implant processing chamber
DE102005055252A1 (de) * 2005-11-19 2007-05-24 Aixtron Ag CVD-Reaktor mit gleitgelagerten Suszeptorhalter
JP4755498B2 (ja) * 2006-01-06 2011-08-24 東京エレクトロン株式会社 加熱装置及び加熱方法
US8551290B2 (en) * 2006-01-31 2013-10-08 Perfect Dynasty Taiwan Ltd. Apparatus for substrate processing with fluid
US20080025835A1 (en) * 2006-07-31 2008-01-31 Juha Paul Liljeroos Bernoulli wand
US8057601B2 (en) * 2007-05-09 2011-11-15 Applied Materials, Inc. Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
US9238867B2 (en) 2008-05-20 2016-01-19 Asm International N.V. Apparatus and method for high-throughput atomic layer deposition
US20090291209A1 (en) 2008-05-20 2009-11-26 Asm International N.V. Apparatus and method for high-throughput atomic layer deposition
KR102580988B1 (ko) * 2016-05-02 2023-09-21 엘지이노텍 주식회사 인쇄회로기판 및 이를 포함하는 전자부품패키지
TWI757810B (zh) * 2020-07-31 2022-03-11 大陸商蘇州雨竹機電有限公司 氣相沉積晶圓承載裝置
CN114086156B (zh) * 2022-01-19 2022-04-15 北京中科重仪半导体科技有限公司 薄膜沉积设备
CN114622277A (zh) * 2022-02-24 2022-06-14 季华实验室 一种用于反应腔的气浮系统及方法

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US3706475A (en) * 1971-03-29 1972-12-19 Ibm Air slides
US4874273A (en) * 1987-03-16 1989-10-17 Hitachi, Ltd. Apparatus for holding and/or conveying articles by fluid
US5108513A (en) * 1989-07-14 1992-04-28 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Device for transporting and positioning semiconductor wafer-type workpieces
US5788425A (en) * 1992-07-15 1998-08-04 Imation Corp. Flexible system for handling articles

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US4148575A (en) 1977-07-22 1979-04-10 Rca Corporation Thermal processor
US5024747A (en) 1979-12-21 1991-06-18 Varian Associates, Inc. Wafer coating system
US4622918A (en) 1983-01-31 1986-11-18 Integrated Automation Limited Module for high vacuum processing
JPS6074626A (ja) 1983-09-30 1985-04-26 Fujitsu Ltd ウエハー処理方法及び装置
US4566726A (en) 1984-06-13 1986-01-28 At&T Technologies, Inc. Method and apparatus for handling semiconductor wafers
DE3608783A1 (de) 1986-03-15 1987-09-17 Telefunken Electronic Gmbh Gasphasen-epitaxieverfahren und vorrichtung zu seiner durchfuehrung
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JPS63136532A (ja) 1986-11-27 1988-06-08 Nec Kyushu Ltd 半導体基板熱処理装置
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JPH03125453A (ja) 1989-10-09 1991-05-28 Toshiba Corp 半導体ウエハ移送装置
FR2661117B1 (fr) 1990-04-24 1994-09-30 Commissariat Energie Atomique Procede de protection de surfaces contre la contamination particulaire ambiante a l'aide d'elements soufflants.
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NL9200446A (nl) 1992-03-10 1993-10-01 Tempress B V Inrichting voor het behandelen van microschakeling-schijven (wafers).
JPH06158361A (ja) 1992-11-20 1994-06-07 Hitachi Ltd プラズマ処理装置
JP3258748B2 (ja) 1993-02-08 2002-02-18 東京エレクトロン株式会社 熱処理装置
JP2934565B2 (ja) 1993-05-21 1999-08-16 三菱電機株式会社 半導体製造装置及び半導体製造方法
US6068088A (en) 1995-08-21 2000-05-30 International Business Machines Corporation Releasable semiconductor wafer lifter basket
US6053982A (en) 1995-09-01 2000-04-25 Asm America, Inc. Wafer support system
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US5855465A (en) 1996-04-16 1999-01-05 Gasonics International Semiconductor wafer processing carousel
US5863170A (en) 1996-04-16 1999-01-26 Gasonics International Modular process system
US6183565B1 (en) * 1997-07-08 2001-02-06 Asm International N.V Method and apparatus for supporting a semiconductor wafer during processing
NL1003538C2 (nl) 1996-07-08 1998-01-12 Advanced Semiconductor Mat Werkwijze en inrichting voor het contactloos behandelen van een schijfvormig halfgeleidersubstraat.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3706475A (en) * 1971-03-29 1972-12-19 Ibm Air slides
US4874273A (en) * 1987-03-16 1989-10-17 Hitachi, Ltd. Apparatus for holding and/or conveying articles by fluid
US5108513A (en) * 1989-07-14 1992-04-28 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Device for transporting and positioning semiconductor wafer-type workpieces
US5788425A (en) * 1992-07-15 1998-08-04 Imation Corp. Flexible system for handling articles

Also Published As

Publication number Publication date
EP1159755B1 (fr) 2003-02-19
TW525210B (en) 2003-03-21
EP1159755A1 (fr) 2001-12-05
WO2000054310A1 (fr) 2000-09-14
DE60001448D1 (de) 2003-03-27
JP2003530681A (ja) 2003-10-14
DE60001448T2 (de) 2004-01-15
US20050051101A1 (en) 2005-03-10
KR100704572B1 (ko) 2007-04-09
US7351293B2 (en) 2008-04-01
US6824619B1 (en) 2004-11-30
KR20010102517A (ko) 2001-11-15
AU3198400A (en) 2000-09-28

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Legal Events

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PD2B A search report has been drawn up
V1 Lapsed because of non-payment of the annual fee

Effective date: 20101001