DE60001448D1 - Verfahren und gerät für waferrotation - Google Patents

Verfahren und gerät für waferrotation

Info

Publication number
DE60001448D1
DE60001448D1 DE60001448T DE60001448T DE60001448D1 DE 60001448 D1 DE60001448 D1 DE 60001448D1 DE 60001448 T DE60001448 T DE 60001448T DE 60001448 T DE60001448 T DE 60001448T DE 60001448 D1 DE60001448 D1 DE 60001448D1
Authority
DE
Germany
Prior art keywords
wafer rotation
wafer
rotation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60001448T
Other languages
English (en)
Other versions
DE60001448T2 (de
Inventor
Ivanovich Kuznetsov
Sijbrand Radelaar
Der Sanden Cornelis Van
Anjes Ruijl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM International NV
Koninklijke Philips NV
Original Assignee
ASM International NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM International NV, Koninklijke Philips Electronics NV filed Critical ASM International NV
Publication of DE60001448D1 publication Critical patent/DE60001448D1/de
Application granted granted Critical
Publication of DE60001448T2 publication Critical patent/DE60001448T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE60001448T 1999-03-08 2000-03-08 Verfahren und gerät für waferrotation Expired - Fee Related DE60001448T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1011487A NL1011487C2 (nl) 1999-03-08 1999-03-08 Werkwijze en inrichting voor het roteren van een wafer.
PCT/NL2000/000154 WO2000054310A1 (en) 1999-03-08 2000-03-08 Method and device for rotating a wafer

Publications (2)

Publication Number Publication Date
DE60001448D1 true DE60001448D1 (de) 2003-03-27
DE60001448T2 DE60001448T2 (de) 2004-01-15

Family

ID=19768793

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60001448T Expired - Fee Related DE60001448T2 (de) 1999-03-08 2000-03-08 Verfahren und gerät für waferrotation

Country Status (9)

Country Link
US (2) US6824619B1 (de)
EP (1) EP1159755B1 (de)
JP (1) JP2003530681A (de)
KR (1) KR100704572B1 (de)
AU (1) AU3198400A (de)
DE (1) DE60001448T2 (de)
NL (1) NL1011487C2 (de)
TW (1) TW525210B (de)
WO (1) WO2000054310A1 (de)

Families Citing this family (12)

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DE102005055252A1 (de) * 2005-11-19 2007-05-24 Aixtron Ag CVD-Reaktor mit gleitgelagerten Suszeptorhalter
JP4755498B2 (ja) * 2006-01-06 2011-08-24 東京エレクトロン株式会社 加熱装置及び加熱方法
US8551290B2 (en) * 2006-01-31 2013-10-08 Perfect Dynasty Taiwan Ltd. Apparatus for substrate processing with fluid
US20080025835A1 (en) * 2006-07-31 2008-01-31 Juha Paul Liljeroos Bernoulli wand
US8057601B2 (en) * 2007-05-09 2011-11-15 Applied Materials, Inc. Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
US20090291209A1 (en) * 2008-05-20 2009-11-26 Asm International N.V. Apparatus and method for high-throughput atomic layer deposition
US9238867B2 (en) 2008-05-20 2016-01-19 Asm International N.V. Apparatus and method for high-throughput atomic layer deposition
KR102580988B1 (ko) * 2016-05-02 2023-09-21 엘지이노텍 주식회사 인쇄회로기판 및 이를 포함하는 전자부품패키지
CN114086156B (zh) * 2022-01-19 2022-04-15 北京中科重仪半导体科技有限公司 薄膜沉积设备
CN114622277A (zh) * 2022-02-24 2022-06-14 季华实验室 一种用于反应腔的气浮系统及方法

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JPS6074626A (ja) 1983-09-30 1985-04-26 Fujitsu Ltd ウエハー処理方法及び装置
US4566726A (en) * 1984-06-13 1986-01-28 At&T Technologies, Inc. Method and apparatus for handling semiconductor wafers
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US4874273A (en) * 1987-03-16 1989-10-17 Hitachi, Ltd. Apparatus for holding and/or conveying articles by fluid
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US4828224A (en) * 1987-10-15 1989-05-09 Epsilon Technology, Inc. Chemical vapor deposition system
ES2163388T3 (es) * 1988-05-24 2002-02-01 Unaxis Balzers Ag Instalacion de vacio.
JPH0253997A (ja) 1988-08-11 1990-02-22 Nippon Kasei Kk 脱臭紙
US5094013A (en) * 1989-01-30 1992-03-10 The Charles Stark Draper Laboratory, Inc. Ultra-fast quenching device
DE69007733T2 (de) 1989-05-08 1994-09-29 Philips Nv Vorrichtung und verfahren zur behandlung eines flachen, scheibenförmigen substrates unter niedrigem druck.
US4987856A (en) * 1989-05-22 1991-01-29 Advanced Semiconductor Materials America, Inc. High throughput multi station processor for multiple single wafers
DE3923405A1 (de) * 1989-07-14 1991-01-24 Wacker Chemitronic Vorrichtung zum transportieren und positionieren von scheibenfoermigen werkstuecken, insbesondere halbleiterscheiben, und verfahren zur nasschemischen oberflaechenbehandlung derselben
JPH0326464U (de) * 1989-07-20 1991-03-18
JPH03125453A (ja) * 1989-10-09 1991-05-28 Toshiba Corp 半導体ウエハ移送装置
FR2661117B1 (fr) * 1990-04-24 1994-09-30 Commissariat Energie Atomique Procede de protection de surfaces contre la contamination particulaire ambiante a l'aide d'elements soufflants.
US5135349A (en) * 1990-05-17 1992-08-04 Cybeq Systems, Inc. Robotic handling system
KR0153250B1 (ko) * 1990-06-28 1998-12-01 카자마 겐쥬 종형 열처리 장치
KR0165898B1 (ko) * 1990-07-02 1999-02-01 미다 가쓰시게 진공처리방법 및 장치
NL9200446A (nl) * 1992-03-10 1993-10-01 Tempress B V Inrichting voor het behandelen van microschakeling-schijven (wafers).
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JPH06158361A (ja) * 1992-11-20 1994-06-07 Hitachi Ltd プラズマ処理装置
JP3258748B2 (ja) * 1993-02-08 2002-02-18 東京エレクトロン株式会社 熱処理装置
JP2934565B2 (ja) * 1993-05-21 1999-08-16 三菱電機株式会社 半導体製造装置及び半導体製造方法
US6068088A (en) * 1995-08-21 2000-05-30 International Business Machines Corporation Releasable semiconductor wafer lifter basket
WO1997009737A1 (en) * 1995-09-01 1997-03-13 Advanced Semiconductor Materials America, Inc. Wafer support system
WO1997031389A1 (fr) * 1996-02-23 1997-08-28 Tokyo Electron Limited Dispositif de traitement thermique
US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
US5855465A (en) * 1996-04-16 1999-01-05 Gasonics International Semiconductor wafer processing carousel
US6183565B1 (en) * 1997-07-08 2001-02-06 Asm International N.V Method and apparatus for supporting a semiconductor wafer during processing
NL1003538C2 (nl) 1996-07-08 1998-01-12 Advanced Semiconductor Mat Werkwijze en inrichting voor het contactloos behandelen van een schijfvormig halfgeleidersubstraat.
DE19630932A1 (de) * 1996-07-31 1998-02-05 Wacker Siltronic Halbleitermat Träger für eine Halbleiterscheibe und Verwendung des Trägers
JPH1074818A (ja) * 1996-09-02 1998-03-17 Tokyo Electron Ltd 処理装置
US6602348B1 (en) 1996-09-17 2003-08-05 Applied Materials, Inc. Substrate cooldown chamber
US5855681A (en) * 1996-11-18 1999-01-05 Applied Materials, Inc. Ultra high throughput wafer vacuum processing system
US6183183B1 (en) * 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
US6280790B1 (en) * 1997-06-30 2001-08-28 Applied Materials, Inc. Reducing the deposition rate of volatile contaminants onto an optical component of a substrate processing system
US6073366A (en) * 1997-07-11 2000-06-13 Asm America, Inc. Substrate cooling system and method
JP3453069B2 (ja) * 1998-08-20 2003-10-06 東京エレクトロン株式会社 基板温調装置
US6108937A (en) * 1998-09-10 2000-08-29 Asm America, Inc. Method of cooling wafers
JP4354039B2 (ja) * 1999-04-02 2009-10-28 東京エレクトロン株式会社 駆動装置
JP2000334397A (ja) * 1999-05-31 2000-12-05 Kokusai Electric Co Ltd 板状試料の流体処理装置及び板状試料の流体処理方法
US6242718B1 (en) * 1999-11-04 2001-06-05 Asm America, Inc. Wafer holder
NL1013938C2 (nl) 1999-12-23 2001-06-26 Asm Int Inrichting voor het behandelen van een wafer.
US6992014B2 (en) * 2002-11-13 2006-01-31 International Business Machines Corporation Method and apparatus for etch rate uniformity control

Also Published As

Publication number Publication date
KR20010102517A (ko) 2001-11-15
WO2000054310A1 (en) 2000-09-14
JP2003530681A (ja) 2003-10-14
KR100704572B1 (ko) 2007-04-09
TW525210B (en) 2003-03-21
AU3198400A (en) 2000-09-28
US6824619B1 (en) 2004-11-30
US7351293B2 (en) 2008-04-01
EP1159755A1 (de) 2001-12-05
DE60001448T2 (de) 2004-01-15
NL1011487C2 (nl) 2000-09-18
EP1159755B1 (de) 2003-02-19
US20050051101A1 (en) 2005-03-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee