DE60036829D1 - Wafer-Poliervorrichtung und -verfahren - Google Patents

Wafer-Poliervorrichtung und -verfahren

Info

Publication number
DE60036829D1
DE60036829D1 DE60036829T DE60036829T DE60036829D1 DE 60036829 D1 DE60036829 D1 DE 60036829D1 DE 60036829 T DE60036829 T DE 60036829T DE 60036829 T DE60036829 T DE 60036829T DE 60036829 D1 DE60036829 D1 DE 60036829D1
Authority
DE
Germany
Prior art keywords
polishing apparatus
wafer polishing
wafer
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60036829T
Other languages
English (en)
Other versions
DE60036829T2 (de
Inventor
Tatsunori Kobayashi
Hiroshi Tanaka
Jiro Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6933699A external-priority patent/JP2000263433A/ja
Priority claimed from JP6933899A external-priority patent/JP2000263419A/ja
Priority claimed from JP6933799A external-priority patent/JP2000263424A/ja
Priority claimed from JP13501999A external-priority patent/JP2000326218A/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE60036829D1 publication Critical patent/DE60036829D1/de
Application granted granted Critical
Publication of DE60036829T2 publication Critical patent/DE60036829T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
DE60036829T 1999-03-15 2000-03-15 Wafer-Poliervorrichtung und -verfahren Expired - Lifetime DE60036829T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP6933699 1999-03-15
JP6933899 1999-03-15
JP6933699A JP2000263433A (ja) 1999-03-15 1999-03-15 ウェーハ搬送装置、ウェーハ研磨装置及びウェーハ製造方法
JP6933799 1999-03-15
JP6933899A JP2000263419A (ja) 1999-03-15 1999-03-15 ウェーハ研磨装置及びウェーハ製造方法
JP6933799A JP2000263424A (ja) 1999-03-15 1999-03-15 ウェーハ研磨装置及びウェーハ製造方法
JP13501999 1999-05-14
JP13501999A JP2000326218A (ja) 1999-05-14 1999-05-14 ウェーハ研磨装置及びウェーハ製造方法

Publications (2)

Publication Number Publication Date
DE60036829D1 true DE60036829D1 (de) 2007-12-06
DE60036829T2 DE60036829T2 (de) 2008-08-07

Family

ID=27465114

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60036825T Expired - Lifetime DE60036825T2 (de) 1999-03-15 2000-03-15 Waferpoliervorrichtung und -verfahren
DE60036829T Expired - Lifetime DE60036829T2 (de) 1999-03-15 2000-03-15 Wafer-Poliervorrichtung und -verfahren

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60036825T Expired - Lifetime DE60036825T2 (de) 1999-03-15 2000-03-15 Waferpoliervorrichtung und -verfahren

Country Status (5)

Country Link
US (1) US6398906B1 (de)
EP (2) EP1495838B1 (de)
KR (2) KR100638290B1 (de)
DE (2) DE60036825T2 (de)
TW (1) TW467795B (de)

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EP2085181A1 (de) * 2000-07-31 2009-08-05 Ebara Corporation Substrathaltevorrichtung und Substratpoliervorrichtung
JP2002100593A (ja) * 2000-09-21 2002-04-05 Nikon Corp 研磨装置、これを用いた半導体デバイスの製造方法及びこの製造方法により製造された半導体デバイス
US6769959B2 (en) * 2002-01-15 2004-08-03 Taiwan Semiconductor Manufacturing Co., Ltd Method and system for slurry usage reduction in chemical mechanical polishing
KR100481553B1 (ko) * 2002-06-25 2005-04-07 동부아남반도체 주식회사 평탄화 장치
JP4756884B2 (ja) * 2005-03-14 2011-08-24 信越半導体株式会社 半導体ウエーハ用の研磨ヘッド及び研磨装置並びに研磨方法
JP4814677B2 (ja) * 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置
JP2008277635A (ja) * 2007-05-01 2008-11-13 Tokyo Seimitsu Co Ltd ウェハ研磨装置、ウェハ研磨システム及びウェハ研磨方法
US8602842B2 (en) * 2010-03-12 2013-12-10 Wayne O. Duescher Three-point fixed-spindle floating-platen abrasive system
US8647170B2 (en) 2011-10-06 2014-02-11 Wayne O. Duescher Laser alignment apparatus for rotary spindles
US8647171B2 (en) * 2010-03-12 2014-02-11 Wayne O. Duescher Fixed-spindle floating-platen workpiece loader apparatus
US8758088B2 (en) 2011-10-06 2014-06-24 Wayne O. Duescher Floating abrading platen configuration
US8696405B2 (en) 2010-03-12 2014-04-15 Wayne O. Duescher Pivot-balanced floating platen lapping machine
US8500515B2 (en) * 2010-03-12 2013-08-06 Wayne O. Duescher Fixed-spindle and floating-platen abrasive system using spherical mounts
US8647172B2 (en) 2010-03-12 2014-02-11 Wayne O. Duescher Wafer pads for fixed-spindle floating-platen lapping
US8641476B2 (en) 2011-10-06 2014-02-04 Wayne O. Duescher Coplanar alignment apparatus for rotary spindles
US8740668B2 (en) * 2010-03-12 2014-06-03 Wayne O. Duescher Three-point spindle-supported floating abrasive platen
EP3406402B1 (de) * 2010-08-06 2021-06-30 Applied Materials, Inc. Substratkantenbearbeitung mit einem haltering
US8337280B2 (en) 2010-09-14 2012-12-25 Duescher Wayne O High speed platen abrading wire-driven rotary workholder
US8430717B2 (en) 2010-10-12 2013-04-30 Wayne O. Duescher Dynamic action abrasive lapping workholder
JP2015500151A (ja) * 2011-12-16 2015-01-05 エルジー シルトロン インコーポレイテッド ウェハーの研磨装置及びウェハーの研磨方法
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
TWI466755B (zh) * 2013-01-24 2015-01-01 邁鈞機械工業股份有限公司 Automatic lens grinding device
US9604340B2 (en) * 2013-12-13 2017-03-28 Taiwan Semiconductor Manufacturing Co., Ltd. Carrier head having abrasive structure on retainer ring
KR102173323B1 (ko) 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
US10265829B2 (en) * 2015-10-30 2019-04-23 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing system
US10312128B2 (en) * 2015-12-31 2019-06-04 Taiwan Semiconductor Manufacturing Company Ltd. Chemical-mechanical polish (CMP) devices, tools, and methods
US10463205B2 (en) 2016-07-01 2019-11-05 Mercer International Inc. Process for making tissue or towel products comprising nanofilaments
US10570261B2 (en) 2016-07-01 2020-02-25 Mercer International Inc. Process for making tissue or towel products comprising nanofilaments
US10724173B2 (en) 2016-07-01 2020-07-28 Mercer International, Inc. Multi-density tissue towel products comprising high-aspect-ratio cellulose filaments
WO2018053458A1 (en) 2016-09-19 2018-03-22 Mercer International Inc. Absorbent paper products having unique physical strength properties
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
CN107685284B (zh) * 2017-09-30 2020-05-01 德清晶生光电科技有限公司 一种光学器件均匀打磨的方法
CN107553315A (zh) * 2017-09-30 2018-01-09 德清晶生光电科技有限公司 一种光学器件均匀打磨的方法
KR102185913B1 (ko) * 2018-01-29 2020-12-03 (주)미래컴퍼니 연마 장치
JP7273058B2 (ja) 2018-04-12 2023-05-12 マーサー インターナショナル インコーポレイテッド 高アスペクト比セルロースフィラメントブレンドを改良する方法
KR20200070825A (ko) * 2018-12-10 2020-06-18 삼성전자주식회사 연마 균일도를 제어할 수 있는 화학 기계적 연마 장치
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
CN113103144B (zh) * 2021-04-16 2023-01-24 长鑫存储技术有限公司 定位机构及研磨设备

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Also Published As

Publication number Publication date
EP1495838A1 (de) 2005-01-12
EP1037262A2 (de) 2000-09-20
EP1495838B1 (de) 2007-10-17
DE60036829T2 (de) 2008-08-07
US6398906B1 (en) 2002-06-04
DE60036825D1 (de) 2007-11-29
DE60036825T2 (de) 2008-07-17
TW467795B (en) 2001-12-11
KR100712584B1 (ko) 2007-05-02
EP1037262B1 (de) 2007-10-24
EP1037262A3 (de) 2003-10-22
KR20060065624A (ko) 2006-06-14
KR100638290B1 (ko) 2006-10-27
KR20000062858A (ko) 2000-10-25

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