DE60032423D1 - Verfahren und Einrichtung zum Polieren - Google Patents

Verfahren und Einrichtung zum Polieren

Info

Publication number
DE60032423D1
DE60032423D1 DE60032423T DE60032423T DE60032423D1 DE 60032423 D1 DE60032423 D1 DE 60032423D1 DE 60032423 T DE60032423 T DE 60032423T DE 60032423 T DE60032423 T DE 60032423T DE 60032423 D1 DE60032423 D1 DE 60032423D1
Authority
DE
Germany
Prior art keywords
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60032423T
Other languages
English (en)
Other versions
DE60032423T2 (de
Inventor
Yutaka Wada
Hirokuni Hiyama
Kazuto Hirokawa
Hisanori Matsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE60032423D1 publication Critical patent/DE60032423D1/de
Publication of DE60032423T2 publication Critical patent/DE60032423T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
DE60032423T 1999-08-18 2000-08-17 Verfahren und Einrichtung zum Polieren Expired - Fee Related DE60032423T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP23192499 1999-08-18
JP23192499 1999-08-18

Publications (2)

Publication Number Publication Date
DE60032423D1 true DE60032423D1 (de) 2007-02-01
DE60032423T2 DE60032423T2 (de) 2007-10-11

Family

ID=16931206

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60032423T Expired - Fee Related DE60032423T2 (de) 1999-08-18 2000-08-17 Verfahren und Einrichtung zum Polieren

Country Status (6)

Country Link
US (1) US6626739B1 (de)
EP (1) EP1077108B1 (de)
KR (1) KR100694905B1 (de)
DE (1) DE60032423T2 (de)
SG (1) SG97161A1 (de)
TW (1) TW541220B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7086933B2 (en) * 2002-04-22 2006-08-08 Applied Materials, Inc. Flexible polishing fluid delivery system
WO2003071592A1 (fr) * 2002-02-20 2003-08-28 Ebara Corporation Procede et dispositif de polissage
US6767274B2 (en) * 2002-11-07 2004-07-27 Taiwan Semiconductor Manufacturing Company Method to reduce defect/slurry residue for copper CMP
EP1590127A1 (de) 2003-01-10 2005-11-02 3M Innovative Properties Company Unterlagenkonstruktionen für chemisch-mechanische planarisierungsanwendungen
US6908366B2 (en) 2003-01-10 2005-06-21 3M Innovative Properties Company Method of using a soft subpad for chemical mechanical polishing
US6939210B2 (en) * 2003-05-02 2005-09-06 Applied Materials, Inc. Slurry delivery arm
KR101334012B1 (ko) * 2005-07-25 2013-12-02 호야 가부시키가이샤 마스크 블랭크용 기판의 제조방법, 마스크 블랭크의제조방법 및 마스크의 제조방법
JP4808453B2 (ja) * 2005-08-26 2011-11-02 株式会社荏原製作所 研磨方法及び研磨装置
US20070131562A1 (en) * 2005-12-08 2007-06-14 Applied Materials, Inc. Method and apparatus for planarizing a substrate with low fluid consumption
US20120017935A1 (en) * 2010-07-21 2012-01-26 International Business Machines Corporation Magnetic tape head cleaning
US20130115862A1 (en) * 2011-11-09 2013-05-09 Applied Materials, Inc. Chemical mechanical polishing platform architecture
KR101581009B1 (ko) 2014-07-18 2015-12-30 주식회사 영진비앤비 디바이스 웨이퍼용 접착제시트 부착장치
KR101581012B1 (ko) 2014-07-18 2015-12-30 주식회사 영진비앤비 디바이스 웨이퍼 접착제 도포방법

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2048120A1 (en) * 1990-08-06 1992-02-07 William J. Drasler Thrombectomy method and device
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5554064A (en) * 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
JP3278532B2 (ja) 1994-07-08 2002-04-30 株式会社東芝 半導体装置の製造方法
JPH08168953A (ja) * 1994-12-16 1996-07-02 Ebara Corp ドレッシング装置
JP3438383B2 (ja) * 1995-03-03 2003-08-18 ソニー株式会社 研磨方法およびこれに用いる研磨装置
JP3778594B2 (ja) * 1995-07-18 2006-05-24 株式会社荏原製作所 ドレッシング方法
TW334379B (en) * 1995-08-24 1998-06-21 Matsushita Electric Ind Co Ltd Compression mechanism for grinding machine of semiconductor substrate
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
KR100456803B1 (ko) * 1996-02-05 2005-05-09 가부시키 가이샤 에바라 세이사꾸쇼 폴리싱장치
US5989107A (en) * 1996-05-16 1999-11-23 Ebara Corporation Method for polishing workpieces and apparatus therefor
US5879226A (en) * 1996-05-21 1999-03-09 Micron Technology, Inc. Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
US5782675A (en) * 1996-10-21 1998-07-21 Micron Technology, Inc. Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers
US5725417A (en) * 1996-11-05 1998-03-10 Micron Technology, Inc. Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates
US6036582A (en) * 1997-06-06 2000-03-14 Ebara Corporation Polishing apparatus
US5934980A (en) * 1997-06-09 1999-08-10 Micron Technology, Inc. Method of chemical mechanical polishing
DE69806029T2 (de) * 1997-08-15 2003-02-06 Struers As Schleifprodukt und schleifverfahren
KR100524054B1 (ko) * 1997-11-21 2005-10-26 가부시키가이샤 에바라 세이사꾸쇼 폴리싱 장치와 이에 사용되는 대상물 홀더 및 폴리싱 방법 및 웨이퍼제조방법
US6413149B1 (en) 1998-04-28 2002-07-02 Ebara Corporation Abrading plate and polishing method using the same

Also Published As

Publication number Publication date
KR100694905B1 (ko) 2007-03-13
DE60032423T2 (de) 2007-10-11
EP1077108A1 (de) 2001-02-21
SG97161A1 (en) 2003-07-18
US6626739B1 (en) 2003-09-30
TW541220B (en) 2003-07-11
EP1077108B1 (de) 2006-12-20
KR20010021351A (ko) 2001-03-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee