DE60024559D1 - Verfahren und Gerät zum Polieren eines Werkstückes - Google Patents

Verfahren und Gerät zum Polieren eines Werkstückes

Info

Publication number
DE60024559D1
DE60024559D1 DE60024559T DE60024559T DE60024559D1 DE 60024559 D1 DE60024559 D1 DE 60024559D1 DE 60024559 T DE60024559 T DE 60024559T DE 60024559 T DE60024559 T DE 60024559T DE 60024559 D1 DE60024559 D1 DE 60024559D1
Authority
DE
Germany
Prior art keywords
polishing
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60024559T
Other languages
English (en)
Other versions
DE60024559T2 (de
Inventor
Seiji Katsuoka
Hozumi Yasuda
Tadakazu Sone
Shunichiro Kojima
Manabu Tsujimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE60024559D1 publication Critical patent/DE60024559D1/de
Application granted granted Critical
Publication of DE60024559T2 publication Critical patent/DE60024559T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
DE60024559T 1999-10-15 2000-08-30 Verfahren und Gerät zum Polieren eines Werkstückes Expired - Fee Related DE60024559T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29450399 1999-10-15
JP29450399 1999-10-15

Publications (2)

Publication Number Publication Date
DE60024559D1 true DE60024559D1 (de) 2006-01-12
DE60024559T2 DE60024559T2 (de) 2006-08-24

Family

ID=17808628

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60024559T Expired - Fee Related DE60024559T2 (de) 1999-10-15 2000-08-30 Verfahren und Gerät zum Polieren eines Werkstückes

Country Status (5)

Country Link
US (1) US6435949B1 (de)
EP (1) EP1092504B1 (de)
KR (1) KR100694904B1 (de)
DE (1) DE60024559T2 (de)
SG (1) SG90746A1 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6808443B2 (en) * 2000-07-01 2004-10-26 Lam Research Corporation Projected gimbal point drive
JP2002187060A (ja) 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
US6776695B2 (en) * 2000-12-21 2004-08-17 Lam Research Corporation Platen design for improving edge performance in CMP applications
TWI261009B (en) * 2001-05-02 2006-09-01 Hitoshi Suwabe Polishing machine
KR100470227B1 (ko) * 2001-06-07 2005-02-05 두산디앤디 주식회사 화학기계적 연마장치의 캐리어 헤드
JP3664676B2 (ja) * 2001-10-30 2005-06-29 信越半導体株式会社 ウェーハの研磨方法及びウェーハ研磨用研磨パッド
US6796887B2 (en) * 2002-11-13 2004-09-28 Speedfam-Ipec Corporation Wear ring assembly
US6869348B1 (en) * 2003-10-07 2005-03-22 Strasbaugh Retaining ring for wafer carriers
US7063604B2 (en) * 2004-03-05 2006-06-20 Strasbaugh Independent edge control for CMP carriers
TWI368555B (en) 2004-11-01 2012-07-21 Ebara Corp Polishing apparatus
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
US7727055B2 (en) 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
US7699688B2 (en) 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
US7575504B2 (en) 2006-11-22 2009-08-18 Applied Materials, Inc. Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly
KR20100094466A (ko) * 2007-11-20 2010-08-26 신에쯔 한도타이 가부시키가이샤 연마 헤드 및 연마 장치
JP5199691B2 (ja) * 2008-02-13 2013-05-15 株式会社荏原製作所 研磨装置
JP2009194134A (ja) * 2008-02-14 2009-08-27 Ebara Corp 研磨方法及び研磨装置
JP5396616B2 (ja) * 2008-10-29 2014-01-22 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 シーズニングプレート、半導体研磨装置、研磨パッドのシーズニング方法
JP5236515B2 (ja) * 2009-01-28 2013-07-17 株式会社荏原製作所 ドレッシング装置、化学的機械的研磨装置及び方法
DE102009030298B4 (de) * 2009-06-24 2012-07-12 Siltronic Ag Verfahren zur lokalen Politur einer Halbleiterscheibe
DE102012201516A1 (de) 2012-02-02 2013-08-08 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
JP5976522B2 (ja) * 2012-05-31 2016-08-23 株式会社荏原製作所 研磨装置および研磨方法
US10702972B2 (en) * 2012-05-31 2020-07-07 Ebara Corporation Polishing apparatus
KR102191916B1 (ko) * 2013-06-26 2020-12-16 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드
JP5538601B1 (ja) * 2013-08-22 2014-07-02 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
JP6266493B2 (ja) * 2014-03-20 2018-01-24 株式会社荏原製作所 研磨装置及び研磨方法
KR102173323B1 (ko) 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
JP6259366B2 (ja) * 2014-07-09 2018-01-10 株式会社荏原製作所 研磨装置
JP6401082B2 (ja) * 2015-03-10 2018-10-03 日本碍子株式会社 セラミック構造体の製法
US10510563B2 (en) * 2016-04-15 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. Wafer carrier assembly
WO2020139605A1 (en) 2018-12-26 2020-07-02 Applied Materials, Inc. Polishing system with platen for substrate edge control
KR20210061273A (ko) * 2019-11-19 2021-05-27 가부시키가이샤 에바라 세이사꾸쇼 기판을 보유 지지하기 위한 톱링 및 기판 처리 장치
US11919120B2 (en) 2021-02-25 2024-03-05 Applied Materials, Inc. Polishing system with contactless platen edge control
US20230201994A1 (en) * 2021-12-23 2023-06-29 Globalwafers Co., Ltd. Polishing head assembly having recess and cap
CN114952583A (zh) * 2022-07-21 2022-08-30 淮安市成翔精密制造有限公司 一种新能源汽车充电枪端子多角度处理用的抛光机床
CN115106871A (zh) * 2022-08-29 2022-09-27 成都中科卓尔智能科技集团有限公司 一种半导体材料表面缺陷柔性高精度修复装置及工艺

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5820448A (en) * 1993-12-27 1998-10-13 Applied Materials, Inc. Carrier head with a layer of conformable material for a chemical mechanical polishing system
JP3158934B2 (ja) * 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
JP3106418B2 (ja) * 1996-07-30 2000-11-06 株式会社東京精密 研磨装置
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US6077385A (en) * 1997-04-08 2000-06-20 Ebara Corporation Polishing apparatus
EP0881039B1 (de) * 1997-05-28 2003-04-16 Tokyo Seimitsu Co.,Ltd. Halbleiterscheibe Poliervorrichtung mit Halterring
US5964653A (en) 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6050882A (en) * 1999-06-10 2000-04-18 Applied Materials, Inc. Carrier head to apply pressure to and retain a substrate
US6290584B1 (en) * 1999-08-13 2001-09-18 Speedfam-Ipec Corporation Workpiece carrier with segmented and floating retaining elements

Also Published As

Publication number Publication date
SG90746A1 (en) 2002-08-20
EP1092504A1 (de) 2001-04-18
KR100694904B1 (ko) 2007-03-13
KR20010039858A (ko) 2001-05-15
EP1092504B1 (de) 2005-12-07
DE60024559T2 (de) 2006-08-24
US6435949B1 (en) 2002-08-20

Similar Documents

Publication Publication Date Title
DE60024559D1 (de) Verfahren und Gerät zum Polieren eines Werkstückes
DE60037515D1 (de) Vorrichtung und verfahren zum transferieren eines werkstückes
DE60004391D1 (de) Werkstückhalter und verfahren zum halten eines werkstückes
DE50015868D1 (de) Verfahren und einrichtung zum stabilisieren eines fahrzeugs
DE69518202D1 (de) Verfahren und Vorrichtung zum Oberflächenschleifen eines Werkstücks
DE19983657T1 (de) Verfahren und Vorrichtung zum Steuern eines Synchronmotors
DE60040723D1 (de) Verfahren und Gerät zum Steuern eines Halbleiterelements
DE69906403D1 (de) Verfahren und Gerät zum Detektieren eines gesichtsähnlichen Gebiets
DE69316849D1 (de) Verfahren und Gerät zum Polieren eines Werkstückes
DE69924931D1 (de) Verfahren und Vorrichtung zum Kühlen eines Werkstücks
DE60002904D1 (de) Verfahren und vorrichtung zum überwachen eines raumes
DE50312659D1 (de) Verfahren und Vorrichtung zum Bearbeiten eines Werkstücks
DE50303495D1 (de) Verfahren und vorrichtung zum schleifen eines rotationssymmetrischen maschinenbauteils
DE60012640D1 (de) Verfahren und Vorrichtung zum Bearbeiten eines Werkstücks mit mehreren Werkzeugköpfen
DE69818134D1 (de) Verfahren und Vorrichtung zum Schweissen eines Werkstücks
DE50015915D1 (de) Verfahren und Vorrichtung zum Steuern eines Roboters
DE69715798T2 (de) Oberflächen-Schleifvorrichtung und Verfahren zum oberflächlichen Schleifen eines dünn-flächigen Werkstückes
DE69925844D1 (de) Verfahren und vorichtung zum falten eines gassacks
DE60021149D1 (de) Verfahren und Vorrichtung zum Polieren
DE69942794D1 (de) Vorrichtung und Verfahren zum Positionieren und Manipulieren eines Gerätes
DE60011643D1 (de) Vorrichtung und verfahren zum schneiden oder schweissen eines werkstückes
DE60027889D1 (de) Verfahren und Biegevorrichtung zum Biegen eines gebogenen Werkstückes
DE50211901D1 (de) Verfahren zum Profilieren eines Vlieses und Profilbildungseinrichtung
DE69812822T2 (de) Me fühlervorrichtung und Verfahren zum Polieren eines Me fühlers
DE60008512D1 (de) System und verfahren zum nachprüfen der position eines werkzeuges einer werkzeugmaschine

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee