SG90746A1 - Apparatus and method for polishing workpiece - Google Patents
Apparatus and method for polishing workpieceInfo
- Publication number
- SG90746A1 SG90746A1 SG200004968A SG200004968A SG90746A1 SG 90746 A1 SG90746 A1 SG 90746A1 SG 200004968 A SG200004968 A SG 200004968A SG 200004968 A SG200004968 A SG 200004968A SG 90746 A1 SG90746 A1 SG 90746A1
- Authority
- SG
- Singapore
- Prior art keywords
- workpiece
- polishing
- holding
- top ring
- polishing workpiece
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 7
- 238000000034 method Methods 0.000 title 1
- 239000012530 fluid Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29450399 | 1999-10-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG90746A1 true SG90746A1 (en) | 2002-08-20 |
Family
ID=17808628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200004968A SG90746A1 (en) | 1999-10-15 | 2000-08-30 | Apparatus and method for polishing workpiece |
Country Status (5)
Country | Link |
---|---|
US (1) | US6435949B1 (de) |
EP (1) | EP1092504B1 (de) |
KR (1) | KR100694904B1 (de) |
DE (1) | DE60024559T2 (de) |
SG (1) | SG90746A1 (de) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6808443B2 (en) * | 2000-07-01 | 2004-10-26 | Lam Research Corporation | Projected gimbal point drive |
JP2002187060A (ja) | 2000-10-11 | 2002-07-02 | Ebara Corp | 基板保持装置、ポリッシング装置、及び研磨方法 |
US6776695B2 (en) * | 2000-12-21 | 2004-08-17 | Lam Research Corporation | Platen design for improving edge performance in CMP applications |
TWI261009B (en) * | 2001-05-02 | 2006-09-01 | Hitoshi Suwabe | Polishing machine |
KR100470227B1 (ko) * | 2001-06-07 | 2005-02-05 | 두산디앤디 주식회사 | 화학기계적 연마장치의 캐리어 헤드 |
JP3664676B2 (ja) * | 2001-10-30 | 2005-06-29 | 信越半導体株式会社 | ウェーハの研磨方法及びウェーハ研磨用研磨パッド |
US6796887B2 (en) * | 2002-11-13 | 2004-09-28 | Speedfam-Ipec Corporation | Wear ring assembly |
US6869348B1 (en) * | 2003-10-07 | 2005-03-22 | Strasbaugh | Retaining ring for wafer carriers |
US7063604B2 (en) * | 2004-03-05 | 2006-06-20 | Strasbaugh | Independent edge control for CMP carriers |
TWI368555B (en) | 2004-11-01 | 2012-07-21 | Ebara Corp | Polishing apparatus |
US7575504B2 (en) * | 2006-11-22 | 2009-08-18 | Applied Materials, Inc. | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
US7727055B2 (en) * | 2006-11-22 | 2010-06-01 | Applied Materials, Inc. | Flexible membrane for carrier head |
US7654888B2 (en) * | 2006-11-22 | 2010-02-02 | Applied Materials, Inc. | Carrier head with retaining ring and carrier ring |
US7699688B2 (en) | 2006-11-22 | 2010-04-20 | Applied Materials, Inc. | Carrier ring for carrier head |
CN101827685A (zh) * | 2007-11-20 | 2010-09-08 | 信越半导体股份有限公司 | 研磨头及研磨装置 |
JP5199691B2 (ja) * | 2008-02-13 | 2013-05-15 | 株式会社荏原製作所 | 研磨装置 |
JP2009194134A (ja) * | 2008-02-14 | 2009-08-27 | Ebara Corp | 研磨方法及び研磨装置 |
JP5396616B2 (ja) * | 2008-10-29 | 2014-01-22 | Sumco Techxiv株式会社 | シーズニングプレート、半導体研磨装置、研磨パッドのシーズニング方法 |
JP5236515B2 (ja) * | 2009-01-28 | 2013-07-17 | 株式会社荏原製作所 | ドレッシング装置、化学的機械的研磨装置及び方法 |
DE102009030298B4 (de) * | 2009-06-24 | 2012-07-12 | Siltronic Ag | Verfahren zur lokalen Politur einer Halbleiterscheibe |
DE102012201516A1 (de) | 2012-02-02 | 2013-08-08 | Siltronic Ag | Verfahren zum Polieren einer Halbleiterscheibe |
US10702972B2 (en) * | 2012-05-31 | 2020-07-07 | Ebara Corporation | Polishing apparatus |
JP5976522B2 (ja) * | 2012-05-31 | 2016-08-23 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
KR102191916B1 (ko) * | 2013-06-26 | 2020-12-16 | 주식회사 케이씨텍 | 화학 기계적 연마 장치의 캐리어 헤드 |
JP5538601B1 (ja) * | 2013-08-22 | 2014-07-02 | ミクロ技研株式会社 | 研磨ヘッド及び研磨処理装置 |
JP6266493B2 (ja) * | 2014-03-20 | 2018-01-24 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
KR102173323B1 (ko) | 2014-06-23 | 2020-11-04 | 삼성전자주식회사 | 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법 |
JP6259366B2 (ja) * | 2014-07-09 | 2018-01-10 | 株式会社荏原製作所 | 研磨装置 |
JP6401082B2 (ja) * | 2015-03-10 | 2018-10-03 | 日本碍子株式会社 | セラミック構造体の製法 |
US10510563B2 (en) * | 2016-04-15 | 2019-12-17 | Taiwan Semiconductor Manufacturing Company Ltd. | Wafer carrier assembly |
US11890717B2 (en) | 2018-12-26 | 2024-02-06 | Applied Materials, Inc. | Polishing system with platen for substrate edge control |
CN109848850B (zh) * | 2019-03-30 | 2024-06-25 | 浙江联宜电机有限公司 | 一种与流转板配合使用的夹持吸附装置 |
KR20210061273A (ko) * | 2019-11-19 | 2021-05-27 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판을 보유 지지하기 위한 톱링 및 기판 처리 장치 |
US11919120B2 (en) | 2021-02-25 | 2024-03-05 | Applied Materials, Inc. | Polishing system with contactless platen edge control |
US20230201994A1 (en) * | 2021-12-23 | 2023-06-29 | Globalwafers Co., Ltd. | Polishing head assembly having recess and cap |
CN114952583A (zh) * | 2022-07-21 | 2022-08-30 | 淮安市成翔精密制造有限公司 | 一种新能源汽车充电枪端子多角度处理用的抛光机床 |
CN115106871A (zh) * | 2022-08-29 | 2022-09-27 | 成都中科卓尔智能科技集团有限公司 | 一种半导体材料表面缺陷柔性高精度修复装置及工艺 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0881039A2 (de) * | 1997-05-28 | 1998-12-02 | Tokyo Seimitsu Co.,Ltd. | Halbleiterscheibe Poliervorrichtung mit Halterring |
US5938884A (en) * | 1995-05-18 | 1999-08-17 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5820448A (en) * | 1993-12-27 | 1998-10-13 | Applied Materials, Inc. | Carrier head with a layer of conformable material for a chemical mechanical polishing system |
JP3158934B2 (ja) * | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
US6024630A (en) * | 1995-06-09 | 2000-02-15 | Applied Materials, Inc. | Fluid-pressure regulated wafer polishing head |
JP3106418B2 (ja) * | 1996-07-30 | 2000-11-06 | 株式会社東京精密 | 研磨装置 |
US5851140A (en) * | 1997-02-13 | 1998-12-22 | Integrated Process Equipment Corp. | Semiconductor wafer polishing apparatus with a flexible carrier plate |
EP1327498B1 (de) * | 1997-04-08 | 2013-06-12 | Ebara Corporation | Poliervorrichtung |
US5964653A (en) | 1997-07-11 | 1999-10-12 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US6050882A (en) * | 1999-06-10 | 2000-04-18 | Applied Materials, Inc. | Carrier head to apply pressure to and retain a substrate |
US6290584B1 (en) * | 1999-08-13 | 2001-09-18 | Speedfam-Ipec Corporation | Workpiece carrier with segmented and floating retaining elements |
-
2000
- 2000-08-30 SG SG200004968A patent/SG90746A1/en unknown
- 2000-08-30 EP EP00118180A patent/EP1092504B1/de not_active Expired - Lifetime
- 2000-08-30 DE DE60024559T patent/DE60024559T2/de not_active Expired - Fee Related
- 2000-08-31 US US09/652,148 patent/US6435949B1/en not_active Expired - Fee Related
- 2000-08-31 KR KR1020000051259A patent/KR100694904B1/ko not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5938884A (en) * | 1995-05-18 | 1999-08-17 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
EP0881039A2 (de) * | 1997-05-28 | 1998-12-02 | Tokyo Seimitsu Co.,Ltd. | Halbleiterscheibe Poliervorrichtung mit Halterring |
Also Published As
Publication number | Publication date |
---|---|
EP1092504B1 (de) | 2005-12-07 |
EP1092504A1 (de) | 2001-04-18 |
US6435949B1 (en) | 2002-08-20 |
KR100694904B1 (ko) | 2007-03-13 |
KR20010039858A (ko) | 2001-05-15 |
DE60024559T2 (de) | 2006-08-24 |
DE60024559D1 (de) | 2006-01-12 |
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