DE60037515D1 - Vorrichtung und verfahren zum transferieren eines werkstückes - Google Patents

Vorrichtung und verfahren zum transferieren eines werkstückes

Info

Publication number
DE60037515D1
DE60037515D1 DE60037515T DE60037515T DE60037515D1 DE 60037515 D1 DE60037515 D1 DE 60037515D1 DE 60037515 T DE60037515 T DE 60037515T DE 60037515 T DE60037515 T DE 60037515T DE 60037515 D1 DE60037515 D1 DE 60037515D1
Authority
DE
Germany
Prior art keywords
workpiece
transferring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60037515T
Other languages
English (en)
Other versions
DE60037515T2 (de
Inventor
Thomas J Wagener
John C Patrin
William P Inhofer
Kevin L Siefering
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tel Manufacturing and Engineering of America Inc
Original Assignee
FSI International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FSI International Inc filed Critical FSI International Inc
Application granted granted Critical
Publication of DE60037515D1 publication Critical patent/DE60037515D1/de
Publication of DE60037515T2 publication Critical patent/DE60037515T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
DE60037515T 1999-07-12 2000-07-12 Vorrichtung und verfahren zum transferieren eines werkstückes Expired - Fee Related DE60037515T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US351939 1999-07-12
US09/351,939 US6251195B1 (en) 1999-07-12 1999-07-12 Method for transferring a microelectronic device to and from a processing chamber
PCT/US2000/019027 WO2001004935A1 (en) 1999-07-12 2000-07-12 Apparatus and method for transferring a workpiece

Publications (2)

Publication Number Publication Date
DE60037515D1 true DE60037515D1 (de) 2008-01-31
DE60037515T2 DE60037515T2 (de) 2009-09-10

Family

ID=23383089

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60037515T Expired - Fee Related DE60037515T2 (de) 1999-07-12 2000-07-12 Vorrichtung und verfahren zum transferieren eines werkstückes

Country Status (5)

Country Link
US (1) US6251195B1 (de)
EP (1) EP1196944B8 (de)
JP (1) JP5007869B2 (de)
DE (1) DE60037515T2 (de)
WO (1) WO2001004935A1 (de)

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US7282183B2 (en) * 2001-12-24 2007-10-16 Agilent Technologies, Inc. Atmospheric control in reaction chambers
US6899507B2 (en) 2002-02-08 2005-05-31 Asm Japan K.K. Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections
US20040154641A1 (en) * 2002-05-17 2004-08-12 P.C.T. Systems, Inc. Substrate processing apparatus and method
EP1506570A1 (de) * 2002-05-21 2005-02-16 ASM America, Inc. Reduzierte kreuz-contamination zwischen den kammern eines halbleiterverarbeitungsgerätes
US7257494B2 (en) * 2004-05-12 2007-08-14 Inficon, Inc. Inter-process sensing of wafer outcome
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US20060130767A1 (en) 2004-12-22 2006-06-22 Applied Materials, Inc. Purged vacuum chuck with proximity pins
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US20090038641A1 (en) * 2006-01-10 2009-02-12 Kazuhisa Matsumoto Substrate Cleaning Apparatus, Substrate Cleaning Method, Substrate Processing System, and Storage Medium
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
JP5208948B2 (ja) * 2007-09-03 2013-06-12 東京エレクトロン株式会社 真空処理システム
US7861540B2 (en) * 2008-01-25 2011-01-04 Hamilton Storage Technologies, Inc. Automated storage and retrieval system for storing biological or chemical samples at ultra-low temperatures
US7972961B2 (en) 2008-10-09 2011-07-05 Asm Japan K.K. Purge step-controlled sequence of processing semiconductor wafers
US8216380B2 (en) 2009-01-08 2012-07-10 Asm America, Inc. Gap maintenance for opening to process chamber
US8287648B2 (en) 2009-02-09 2012-10-16 Asm America, Inc. Method and apparatus for minimizing contamination in semiconductor processing chamber
CN102083253A (zh) * 2009-11-27 2011-06-01 富准精密工业(深圳)有限公司 灯具控制系统
US9646817B2 (en) 2011-06-23 2017-05-09 Brooks Automation, Inc. Semiconductor cleaner systems and methods
US9321087B2 (en) * 2013-09-10 2016-04-26 TFL FSI, Inc. Apparatus and method for scanning an object through a fluid spray
CN103639151B (zh) * 2013-11-28 2016-07-06 上海华力微电子有限公司 清洁光掩模板的装置和方法
KR102468565B1 (ko) 2014-10-06 2022-11-17 티이엘 매뉴팩처링 앤드 엔지니어링 오브 아메리카, 인크. 극저온 유체 혼합물로 기판을 처리하는 시스템 및 방법
US10625280B2 (en) 2014-10-06 2020-04-21 Tel Fsi, Inc. Apparatus for spraying cryogenic fluids
US10014191B2 (en) * 2014-10-06 2018-07-03 Tel Fsi, Inc. Systems and methods for treating substrates with cryogenic fluid mixtures
US20180025904A1 (en) * 2014-10-06 2018-01-25 Tel Fsi, Inc. Systems and Methods for Treating Substrates with Cryogenic Fluid Mixtures
US10741428B2 (en) * 2016-04-11 2020-08-11 Applied Materials, Inc. Semiconductor processing chamber
CN110621419B (zh) * 2017-03-17 2022-07-19 东京毅力科创Fsi公司 监测使用流体喷雾例如低温流体喷雾的微电子衬底处理的系统和方法
US10872803B2 (en) 2017-11-03 2020-12-22 Asm Ip Holding B.V. Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination
US10872804B2 (en) 2017-11-03 2020-12-22 Asm Ip Holding B.V. Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination
US11241720B2 (en) 2018-03-22 2022-02-08 Tel Manufacturing And Engineering Of America, Inc. Pressure control strategies to provide uniform treatment streams in the manufacture of microelectronic devices
US11443961B2 (en) 2019-08-30 2022-09-13 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor fabrication apparatus
CN114077164B (zh) * 2020-08-21 2023-03-24 长鑫存储技术有限公司 半导体机台清洗系统及半导体机台清洗方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2644912B2 (ja) 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
JP3008391B2 (ja) * 1991-09-20 2000-02-14 ソニー株式会社 パウダビーム加工機
JPH05251543A (ja) * 1992-03-05 1993-09-28 Nec Kyushu Ltd 半導体処理装置
US5485644A (en) * 1993-03-18 1996-01-23 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus
US5364472A (en) * 1993-07-21 1994-11-15 At&T Bell Laboratories Probemat cleaning system using CO2 pellets
FR2713521B1 (fr) * 1993-12-09 1996-03-22 Lenglen Jean Luc Procédé et machine pour le nettoyage de pièces.
US5516369A (en) * 1994-05-06 1996-05-14 United Microelectronics Corporation Method and apparatus for particle reduction from semiconductor wafers
US5967156A (en) * 1994-11-07 1999-10-19 Krytek Corporation Processing a surface
US5820692A (en) * 1996-01-16 1998-10-13 Fsi Interntional Vacuum compatible water vapor and rinse process module
JP3774277B2 (ja) * 1996-08-29 2006-05-10 東京エレクトロン株式会社 被処理基板の搬送方法及び処理システム
US5810942A (en) * 1996-09-11 1998-09-22 Fsi International, Inc. Aerodynamic aerosol chamber
JPH10144757A (ja) 1996-11-08 1998-05-29 Dainippon Screen Mfg Co Ltd 基板処理システム
US5942037A (en) * 1996-12-23 1999-08-24 Fsi International, Inc. Rotatable and translatable spray nozzle
JP3545569B2 (ja) * 1997-03-04 2004-07-21 大日本スクリーン製造株式会社 基板処理装置
US5961732A (en) * 1997-06-11 1999-10-05 Fsi International, Inc Treating substrates by producing and controlling a cryogenic aerosol
JPH11186363A (ja) * 1997-12-24 1999-07-09 Shin Etsu Handotai Co Ltd 半導体製造装置

Also Published As

Publication number Publication date
EP1196944B8 (de) 2009-01-07
US6251195B1 (en) 2001-06-26
WO2001004935A1 (en) 2001-01-18
JP2003504868A (ja) 2003-02-04
DE60037515T2 (de) 2009-09-10
JP5007869B2 (ja) 2012-08-22
EP1196944A1 (de) 2002-04-17
EP1196944B1 (de) 2007-12-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: FSI INTERNATIONAL, INC., CHASKA, MINN., US

8339 Ceased/non-payment of the annual fee
8339 Ceased/non-payment of the annual fee
8380 Miscellaneous part iii

Free format text: DIE ERTEILUNG WURDE AUF DER 2. WOCHE 2009 WURDE GELOESCHT.