SG97161A1 - Polishing method and polishing apparatus - Google Patents

Polishing method and polishing apparatus

Info

Publication number
SG97161A1
SG97161A1 SG200004634A SG200004634A SG97161A1 SG 97161 A1 SG97161 A1 SG 97161A1 SG 200004634 A SG200004634 A SG 200004634A SG 200004634 A SG200004634 A SG 200004634A SG 97161 A1 SG97161 A1 SG 97161A1
Authority
SG
Singapore
Prior art keywords
polishing
device wafer
abrading plate
restricted
abrading
Prior art date
Application number
SG200004634A
Other languages
English (en)
Inventor
Hiyama Hirokuni
Hirokawa Kazuto
Matsuo Hisanori
Yutaka Wada
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG97161A1 publication Critical patent/SG97161A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
SG200004634A 1999-08-18 2000-08-18 Polishing method and polishing apparatus SG97161A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23192499 1999-08-18

Publications (1)

Publication Number Publication Date
SG97161A1 true SG97161A1 (en) 2003-07-18

Family

ID=16931206

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200004634A SG97161A1 (en) 1999-08-18 2000-08-18 Polishing method and polishing apparatus

Country Status (6)

Country Link
US (1) US6626739B1 (de)
EP (1) EP1077108B1 (de)
KR (1) KR100694905B1 (de)
DE (1) DE60032423T2 (de)
SG (1) SG97161A1 (de)
TW (1) TW541220B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7086933B2 (en) * 2002-04-22 2006-08-08 Applied Materials, Inc. Flexible polishing fluid delivery system
JPWO2003071592A1 (ja) 2002-02-20 2005-06-16 株式会社荏原製作所 ポリッシング方法および装置
US6767274B2 (en) * 2002-11-07 2004-07-27 Taiwan Semiconductor Manufacturing Company Method to reduce defect/slurry residue for copper CMP
US6908366B2 (en) 2003-01-10 2005-06-21 3M Innovative Properties Company Method of using a soft subpad for chemical mechanical polishing
JP2006513573A (ja) 2003-01-10 2006-04-20 スリーエム イノベイティブ プロパティズ カンパニー 化学的機械的平坦化用途向けのパッド構成体
US6939210B2 (en) * 2003-05-02 2005-09-06 Applied Materials, Inc. Slurry delivery arm
KR101334012B1 (ko) * 2005-07-25 2013-12-02 호야 가부시키가이샤 마스크 블랭크용 기판의 제조방법, 마스크 블랭크의제조방법 및 마스크의 제조방법
JP4808453B2 (ja) * 2005-08-26 2011-11-02 株式会社荏原製作所 研磨方法及び研磨装置
US20070131562A1 (en) * 2005-12-08 2007-06-14 Applied Materials, Inc. Method and apparatus for planarizing a substrate with low fluid consumption
US20120017935A1 (en) * 2010-07-21 2012-01-26 International Business Machines Corporation Magnetic tape head cleaning
US20130115862A1 (en) * 2011-11-09 2013-05-09 Applied Materials, Inc. Chemical mechanical polishing platform architecture
KR101581012B1 (ko) 2014-07-18 2015-12-30 주식회사 영진비앤비 디바이스 웨이퍼 접착제 도포방법
KR101581009B1 (ko) 2014-07-18 2015-12-30 주식회사 영진비앤비 디바이스 웨이퍼용 접착제시트 부착장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5725417A (en) * 1996-11-05 1998-03-10 Micron Technology, Inc. Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates
US5785675A (en) * 1990-08-06 1998-07-28 Possis Medical, Inc. Thrombectomy device
WO1999026763A2 (en) * 1997-11-21 1999-06-03 Ebara Corporation Polishing apparatus

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5554064A (en) * 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
JP3278532B2 (ja) 1994-07-08 2002-04-30 株式会社東芝 半導体装置の製造方法
JPH08168953A (ja) * 1994-12-16 1996-07-02 Ebara Corp ドレッシング装置
JP3438383B2 (ja) * 1995-03-03 2003-08-18 ソニー株式会社 研磨方法およびこれに用いる研磨装置
JP3778594B2 (ja) * 1995-07-18 2006-05-24 株式会社荏原製作所 ドレッシング方法
TW344695B (en) * 1995-08-24 1998-11-11 Matsushita Electric Ind Co Ltd Method for polishing semiconductor substrate
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5839947A (en) * 1996-02-05 1998-11-24 Ebara Corporation Polishing apparatus
EP0807492B1 (de) * 1996-05-16 2003-03-19 Ebara Corporation Verfahren und Vorrichtung zum Polieren von Werkstücken
US5879226A (en) * 1996-05-21 1999-03-09 Micron Technology, Inc. Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
US5782675A (en) * 1996-10-21 1998-07-21 Micron Technology, Inc. Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers
US6036582A (en) * 1997-06-06 2000-03-14 Ebara Corporation Polishing apparatus
US5934980A (en) * 1997-06-09 1999-08-10 Micron Technology, Inc. Method of chemical mechanical polishing
US6435958B1 (en) * 1997-08-15 2002-08-20 Struers A/S Abrasive means and a grinding process
EP0999013B1 (de) 1998-04-28 2007-09-26 Ebara Corporation Polierschleifscheibe und substrat polierverfahren mit hilfe dieser schleifscheibe

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785675A (en) * 1990-08-06 1998-07-28 Possis Medical, Inc. Thrombectomy device
US5725417A (en) * 1996-11-05 1998-03-10 Micron Technology, Inc. Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates
WO1999026763A2 (en) * 1997-11-21 1999-06-03 Ebara Corporation Polishing apparatus

Also Published As

Publication number Publication date
DE60032423D1 (de) 2007-02-01
TW541220B (en) 2003-07-11
KR20010021351A (ko) 2001-03-15
EP1077108B1 (de) 2006-12-20
DE60032423T2 (de) 2007-10-11
EP1077108A1 (de) 2001-02-21
KR100694905B1 (ko) 2007-03-13
US6626739B1 (en) 2003-09-30

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