DE60027318D1 - Bauteilbestückungsvorrichtung und verfahren - Google Patents
Bauteilbestückungsvorrichtung und verfahrenInfo
- Publication number
- DE60027318D1 DE60027318D1 DE60027318T DE60027318T DE60027318D1 DE 60027318 D1 DE60027318 D1 DE 60027318D1 DE 60027318 T DE60027318 T DE 60027318T DE 60027318 T DE60027318 T DE 60027318T DE 60027318 D1 DE60027318 D1 DE 60027318D1
- Authority
- DE
- Germany
- Prior art keywords
- assembly device
- component assembly
- component
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
- Y10T29/49778—Method of mechanical manufacture with testing or indicating with aligning, guiding, or instruction
- Y10T29/4978—Assisting assembly or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31515999A JP2001135995A (ja) | 1999-11-05 | 1999-11-05 | 部品実装装置及び方法 |
JP31515999 | 1999-11-05 | ||
PCT/JP2000/007522 WO2001035706A1 (fr) | 1999-11-05 | 2000-10-27 | Dispositif et procede pour parties d'assemblage |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60027318D1 true DE60027318D1 (de) | 2006-05-24 |
DE60027318T2 DE60027318T2 (de) | 2007-01-04 |
Family
ID=18062141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60027318T Expired - Lifetime DE60027318T2 (de) | 1999-11-05 | 2000-10-27 | Bauteilbestückungsvorrichtung und verfahren |
Country Status (6)
Country | Link |
---|---|
US (1) | US6681468B1 (de) |
EP (1) | EP1231828B1 (de) |
JP (1) | JP2001135995A (de) |
CN (1) | CN1191749C (de) |
DE (1) | DE60027318T2 (de) |
WO (1) | WO2001035706A1 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001035707A1 (fr) * | 1999-11-05 | 2001-05-17 | Matsushita Electric Industrial Co., Ltd. | Machine et technique pour montage de composants |
JP4033705B2 (ja) * | 2002-05-08 | 2008-01-16 | 富士機械製造株式会社 | プリント配線板位置誤差取得方法,プログラムおよび電子回路部品装着システム |
US7428329B2 (en) * | 2003-05-28 | 2008-09-23 | Fuji Machine Mfg. Co., Ltd. | Pickup image processing device of electronic part mounting device and pickup image processing method |
WO2005013665A1 (en) | 2003-08-04 | 2005-02-10 | Assembleon N.V. | Component placement device and method |
JP4390503B2 (ja) * | 2003-08-27 | 2009-12-24 | パナソニック株式会社 | 部品実装装置及び部品実装方法 |
CN1592574B (zh) * | 2003-09-01 | 2010-06-09 | 重机公司 | 电子器件安装机中的电子器件的吸附位置修正装置 |
EP1564792A3 (de) * | 2004-02-13 | 2006-11-02 | Assembléon N.V. | Methode und Apparat zur Abschätzung der Platzierungs-Position einer Komponente auf einem Substrat |
DE102005046963B4 (de) * | 2005-09-30 | 2007-10-04 | Siemens Ag | Maschinengrundkörper und Bestücksystem zum Bestücken von Substraten mit elektrischen Bauteilen |
JP4860270B2 (ja) * | 2006-01-13 | 2012-01-25 | Juki株式会社 | 実装装置における電子部品の同時吸着の可否判定方法 |
TWI331491B (en) * | 2007-04-04 | 2010-10-01 | Unimicron Technology Corp | Apparatus for transplanting multi-circuit boards |
JP5103238B2 (ja) * | 2008-03-25 | 2012-12-19 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP5342159B2 (ja) * | 2008-03-25 | 2013-11-13 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP2010073924A (ja) * | 2008-09-19 | 2010-04-02 | Panasonic Corp | 部品実装装置 |
JP4894841B2 (ja) * | 2008-10-10 | 2012-03-14 | パナソニック株式会社 | 電子部品実装装置および電子部品の搭載ヘッド |
US20120015458A1 (en) * | 2009-03-23 | 2012-01-19 | Takayoshi Akamatsu | Mounting apparatus and mounting method |
KR101308467B1 (ko) * | 2009-08-04 | 2013-09-16 | 엘지디스플레이 주식회사 | 전자 부품 실장 장치 및 방법 |
JP2011077096A (ja) * | 2009-09-29 | 2011-04-14 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置、部品供給装置及び電子部品装着方法 |
JP5075214B2 (ja) * | 2010-01-26 | 2012-11-21 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
US9844170B2 (en) * | 2012-02-28 | 2017-12-12 | Fuji Machine Mfg. Co., Ltd. | Component mounting machine |
WO2015063934A1 (ja) * | 2013-10-31 | 2015-05-07 | 富士機械製造株式会社 | 部品装着機 |
US9778650B2 (en) | 2013-12-11 | 2017-10-03 | Honda Motor Co., Ltd. | Apparatus, system and method for kitting and automation assembly |
CN110199585B (zh) * | 2017-01-25 | 2021-06-15 | 株式会社富士 | 控制装置、安装装置及控制方法 |
JP6842989B2 (ja) * | 2017-05-19 | 2021-03-17 | アルファーデザイン株式会社 | 部品実装装置、部品実装方法 |
CN108145711A (zh) * | 2017-12-14 | 2018-06-12 | 苏州华兴源创电子科技有限公司 | 产品位置移动方法和系统 |
US11217471B2 (en) * | 2019-03-06 | 2022-01-04 | Rohinni, LLC | Multi-axis movement for transfer of semiconductor devices |
WO2021084831A1 (ja) * | 2019-10-29 | 2021-05-06 | パナソニックIpマネジメント株式会社 | 部品実装装置および実装基板の製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4442388A (en) * | 1980-04-02 | 1984-04-10 | Optimetrix Corporation | X-Y Addressable workpiece positioner having an improved X-Y address indicia sensor |
US4342090A (en) * | 1980-06-27 | 1982-07-27 | International Business Machines Corp. | Batch chip placement system |
NL8103574A (nl) * | 1981-07-29 | 1983-02-16 | Philips Nv | Werkwijze en inrichting voor het plaatsen van elektrische en/of elektronische onderdelen op een substraat. |
US4670981A (en) * | 1986-03-17 | 1987-06-09 | Nitto Kogyo Kabushiki Kaisha | Method of mounting electronic parts on the predetermined positions of a printed circuit board |
JPH03160799A (ja) * | 1989-11-17 | 1991-07-10 | Matsushita Electric Ind Co Ltd | 電子部品実装装置 |
JP2811899B2 (ja) * | 1990-04-05 | 1998-10-15 | 松下電器産業株式会社 | 電子部品実装装置 |
JP2957648B2 (ja) * | 1990-07-10 | 1999-10-06 | 松下電器産業株式会社 | 部品供給装置 |
JP2517178B2 (ja) * | 1991-03-04 | 1996-07-24 | 松下電器産業株式会社 | 電子部品の実装方法 |
JPH06314897A (ja) * | 1993-04-30 | 1994-11-08 | Tescon:Kk | チップマウンター |
DE69404015T2 (de) * | 1993-10-29 | 1998-02-12 | Sanyo Electric Co | Vorrichtung und Verfahren zur automatischen Bestückung elektronischer Teile |
SG52900A1 (en) * | 1996-01-08 | 1998-09-28 | Matsushita Electric Ind Co Ltd | Mounting apparatus of electronic components and mounting methods of the same |
JP3502228B2 (ja) * | 1996-09-27 | 2004-03-02 | サンデン株式会社 | 低温庫 |
US5953812A (en) * | 1997-07-03 | 1999-09-21 | Schlumberger Technologies, Inc. | Misinsert sensing in pick and place tooling |
US6230393B1 (en) * | 1997-07-07 | 2001-05-15 | Matsushita Electric Industrial Co., Ltd. | Method and device for mounting electronic component |
JP3739218B2 (ja) * | 1998-04-02 | 2006-01-25 | 松下電器産業株式会社 | 部品装着方法及び装置 |
EP0994641B1 (de) * | 1998-10-13 | 2004-10-27 | Matsushita Electric Industrial Co., Ltd. | Vorrichtung und Verfahren zur Montage eines elektronischen Bauteils |
JP2000133989A (ja) * | 1998-10-22 | 2000-05-12 | Sony Corp | 部品供給装置 |
-
1999
- 1999-11-05 JP JP31515999A patent/JP2001135995A/ja active Pending
-
2000
- 2000-10-27 EP EP00970114A patent/EP1231828B1/de not_active Expired - Lifetime
- 2000-10-27 DE DE60027318T patent/DE60027318T2/de not_active Expired - Lifetime
- 2000-10-27 US US10/129,190 patent/US6681468B1/en not_active Expired - Fee Related
- 2000-10-27 CN CN00815339.6A patent/CN1191749C/zh not_active Expired - Fee Related
- 2000-10-27 WO PCT/JP2000/007522 patent/WO2001035706A1/ja active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
WO2001035706A1 (fr) | 2001-05-17 |
EP1231828B1 (de) | 2006-04-12 |
CN1191749C (zh) | 2005-03-02 |
CN1387747A (zh) | 2002-12-25 |
US6681468B1 (en) | 2004-01-27 |
DE60027318T2 (de) | 2007-01-04 |
EP1231828A1 (de) | 2002-08-14 |
EP1231828A4 (de) | 2004-05-12 |
JP2001135995A (ja) | 2001-05-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |
|
8320 | Willingness to grant licences declared (paragraph 23) |