DE69814710D1 - Beschichtungs-Vorrichtung und Verfahren - Google Patents

Beschichtungs-Vorrichtung und Verfahren

Info

Publication number
DE69814710D1
DE69814710D1 DE69814710T DE69814710T DE69814710D1 DE 69814710 D1 DE69814710 D1 DE 69814710D1 DE 69814710 T DE69814710 T DE 69814710T DE 69814710 T DE69814710 T DE 69814710T DE 69814710 D1 DE69814710 D1 DE 69814710D1
Authority
DE
Germany
Prior art keywords
coating device
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69814710T
Other languages
English (en)
Other versions
DE69814710T2 (de
Inventor
Akihiro Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE69814710D1 publication Critical patent/DE69814710D1/de
Application granted granted Critical
Publication of DE69814710T2 publication Critical patent/DE69814710T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
DE69814710T 1997-03-03 1998-02-28 Beschichtungs-Vorrichtung und Verfahren Expired - Fee Related DE69814710T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4772397 1997-03-03
JP4772397 1997-03-03

Publications (2)

Publication Number Publication Date
DE69814710D1 true DE69814710D1 (de) 2003-06-26
DE69814710T2 DE69814710T2 (de) 2004-03-18

Family

ID=12783256

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69814710T Expired - Fee Related DE69814710T2 (de) 1997-03-03 1998-02-28 Beschichtungs-Vorrichtung und Verfahren

Country Status (6)

Country Link
US (1) US6056998A (de)
EP (1) EP0863538B1 (de)
KR (1) KR100560263B1 (de)
DE (1) DE69814710T2 (de)
SG (1) SG68652A1 (de)
TW (1) TW405170B (de)

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JP3329720B2 (ja) * 1998-01-19 2002-09-30 東京エレクトロン株式会社 塗布装置
US6248171B1 (en) 1998-09-17 2001-06-19 Silicon Valley Group, Inc. Yield and line width performance for liquid polymers and other materials
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US6407009B1 (en) 1998-11-12 2002-06-18 Advanced Micro Devices, Inc. Methods of manufacture of uniform spin-on films
US6530340B2 (en) 1998-11-12 2003-03-11 Advanced Micro Devices, Inc. Apparatus for manufacturing planar spin-on films
US6317642B1 (en) * 1998-11-12 2001-11-13 Advanced Micro Devices, Inc. Apparatus and methods for uniform scan dispensing of spin-on materials
US7029238B1 (en) 1998-11-23 2006-04-18 Mykrolis Corporation Pump controller for precision pumping apparatus
US8172546B2 (en) 1998-11-23 2012-05-08 Entegris, Inc. System and method for correcting for pressure variations using a motor
TW593888B (en) * 1998-11-23 2004-06-21 Mykrolis Corp Pump controller for precision pumping apparatus
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US6325932B1 (en) 1999-11-30 2001-12-04 Mykrolis Corporation Apparatus and method for pumping high viscosity fluid
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US7404681B1 (en) 2000-05-31 2008-07-29 Fsi International, Inc. Coating methods and apparatus for coating
US6746826B1 (en) 2000-07-25 2004-06-08 Asml Holding N.V. Method for an improved developing process in wafer photolithography
US6562136B1 (en) 2000-09-08 2003-05-13 Surmodics, Inc. Coating apparatus and method
KR100375409B1 (ko) * 2000-09-29 2003-03-08 주식회사 실리콘 테크 레지스트 도포장치
KR20030028046A (ko) * 2001-09-27 2003-04-08 삼성전자주식회사 웨이퍼 습식 처리 장치
US6811613B2 (en) * 2001-11-26 2004-11-02 Tokyo Electron Limited Coating film forming apparatus
KR100948220B1 (ko) * 2002-03-19 2010-03-18 도쿄엘렉트론가부시키가이샤 도포처리방법 및 도포처리장치
US6848625B2 (en) * 2002-03-19 2005-02-01 Tokyo Electron Limited Process liquid supply mechanism and process liquid supply method
US7238386B2 (en) * 2002-05-09 2007-07-03 Hexion Specialty Chemicals, Inc. Methods for making and using point lump-free compositions and products coated with point lump-free compositions
US20040072450A1 (en) * 2002-10-15 2004-04-15 Collins Jimmy D. Spin-coating methods and apparatuses for spin-coating, including pressure sensor
US7077910B2 (en) * 2003-04-07 2006-07-18 Surmodics, Inc. Linear rail coating apparatus and method
KR100971397B1 (ko) * 2003-10-01 2010-07-21 엘지디스플레이 주식회사 배향막 도포장치
DE10353968A1 (de) * 2003-11-19 2005-07-07 Itw Gema Ag Beschichtungspulver-Fördervorrichtung und -Förderverfahren
DE102004046970A1 (de) * 2004-09-28 2006-04-13 Fuji Magnetics Gmbh Vorrichtung zur Aufnahme und/oder Abgabe einer Auftragsflüssigkeit
KR101231945B1 (ko) 2004-11-23 2013-02-08 엔테그리스, 아이엔씨. 가변 홈 위치 토출 장치용 시스템 및 방법
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US20060130767A1 (en) 2004-12-22 2006-06-22 Applied Materials, Inc. Purged vacuum chuck with proximity pins
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
DE102005044796A1 (de) 2005-09-19 2007-03-29 Hilger U. Kern Gmbh Verfahren zur Steuerung einer Dosiereinrichtung für flüssige oder pasteuse Medien
US8753097B2 (en) 2005-11-21 2014-06-17 Entegris, Inc. Method and system for high viscosity pump
JP5339914B2 (ja) 2005-11-21 2013-11-13 インテグリス・インコーポレーテッド 低減された形状要因を有するポンプのためのシステムと方法
US8083498B2 (en) 2005-12-02 2011-12-27 Entegris, Inc. System and method for position control of a mechanical piston in a pump
WO2007067342A2 (en) 2005-12-02 2007-06-14 Entegris, Inc. System and method for valve sequencing in a pump
US7878765B2 (en) 2005-12-02 2011-02-01 Entegris, Inc. System and method for monitoring operation of a pump
US7850431B2 (en) 2005-12-02 2010-12-14 Entegris, Inc. System and method for control of fluid pressure
WO2007067358A2 (en) 2005-12-02 2007-06-14 Entegris, Inc. System and method for pressure compensation in a pump
JP4845969B2 (ja) 2005-12-02 2011-12-28 エンテグリース，インコーポレイテッド ポンプ制御装置を結合する入出力システム、方法、および装置
CN101360678B (zh) 2005-12-05 2013-01-02 恩特格里公司 用于泵的误差容积系统和方法
JP4564454B2 (ja) * 2006-01-19 2010-10-20 東京エレクトロン株式会社 塗布方法及び塗布装置及び塗布処理プログラム
TWI402423B (zh) 2006-02-28 2013-07-21 Entegris Inc 用於一幫浦操作之系統及方法
US7684446B2 (en) 2006-03-01 2010-03-23 Entegris, Inc. System and method for multiplexing setpoints
US7494265B2 (en) 2006-03-01 2009-02-24 Entegris, Inc. System and method for controlled mixing of fluids via temperature
WO2007109333A2 (en) * 2006-03-21 2007-09-27 Harland Medical Systems, Llc Apparatus and method for coating of elongate flimsy members
US7897195B2 (en) * 2007-06-15 2011-03-01 Abbott Cardiovascular Systems Inc. Devices for coating stents
US8003157B2 (en) 2007-06-15 2011-08-23 Abbott Cardiovascular Systems Inc. System and method for coating a stent
US20090214782A1 (en) * 2008-02-21 2009-08-27 Forrest Stephen R Organic vapor jet printing system
US9827401B2 (en) 2012-06-01 2017-11-28 Surmodics, Inc. Apparatus and methods for coating medical devices
MX351261B (es) 2012-06-01 2017-10-06 Surmodics Inc Aparato y método para recubrir catéteres con globo.
US11090468B2 (en) 2012-10-25 2021-08-17 Surmodics, Inc. Apparatus and methods for coating medical devices
US9228448B2 (en) * 2013-09-20 2016-01-05 United Technologies Corporation Background radiation measurement system
US10655619B2 (en) * 2014-10-23 2020-05-19 Tokyo Electron Limited Pump, pump device, and liquid supply system
US10518199B2 (en) * 2016-09-08 2019-12-31 Tokyo Electron Limited Treatment solution supply apparatus
CN108262183A (zh) * 2016-12-30 2018-07-10 梁韵琳 粉碎输送机
CN106862010A (zh) * 2017-03-24 2017-06-20 苏州威格尔纳米科技有限公司 一种旋转式狭缝涂布模头及方法
US11628466B2 (en) 2018-11-29 2023-04-18 Surmodics, Inc. Apparatus and methods for coating medical devices
US11819590B2 (en) 2019-05-13 2023-11-21 Surmodics, Inc. Apparatus and methods for coating medical devices
CN112831757B (zh) * 2020-12-31 2022-09-20 深圳市瑞泓塑胶五金镀膜技术有限公司 一种不间断式全自动真空镀膜生产线

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JP2803859B2 (ja) * 1989-09-29 1998-09-24 株式会社日立製作所 流動体供給装置およびその制御方法
US5262068A (en) * 1991-05-17 1993-11-16 Millipore Corporation Integrated system for filtering and dispensing fluid having fill, dispense and bubble purge strokes
DE69428391T2 (de) * 1993-03-25 2002-07-04 Tokyo Electron Ltd Verfahren und Vorrichtung zur Beschichtung eines Filmes
JPH0727150U (ja) * 1993-10-07 1995-05-19 大日本スクリーン製造株式会社 シリカ系被膜形成用塗布液吐出装置
JP3485990B2 (ja) * 1995-02-09 2004-01-13 東京エレクトロン株式会社 搬送方法及び搬送装置
TW297910B (de) 1995-02-02 1997-02-11 Tokyo Electron Co Ltd
SE9501559L (sv) * 1995-04-27 1996-10-28 Ind Vision Systems Ab Förfarande och anordning för optisk besiktning av åtminstone en linjeföljd av strängar, särskilt av lim
DE19605602C1 (de) * 1996-02-15 1997-11-20 Singulus Technologies Gmbh Vorrichtung zur Oberflächenbeschichtung bzw. zum Lackieren von Substraten
US5858466A (en) * 1996-06-24 1999-01-12 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist supply system with air venting

Also Published As

Publication number Publication date
DE69814710T2 (de) 2004-03-18
US6056998A (en) 2000-05-02
EP0863538A2 (de) 1998-09-09
SG68652A1 (en) 1999-11-16
KR100560263B1 (ko) 2006-07-06
EP0863538B1 (de) 2003-05-21
TW405170B (en) 2000-09-11
EP0863538A3 (de) 2000-09-06
KR19980079831A (ko) 1998-11-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee