DE69735240D1 - Elektronisches bauteil und bestückungsverfahren und -vorrichtung - Google Patents

Elektronisches bauteil und bestückungsverfahren und -vorrichtung

Info

Publication number
DE69735240D1
DE69735240D1 DE69735240T DE69735240T DE69735240D1 DE 69735240 D1 DE69735240 D1 DE 69735240D1 DE 69735240 T DE69735240 T DE 69735240T DE 69735240 T DE69735240 T DE 69735240T DE 69735240 D1 DE69735240 D1 DE 69735240D1
Authority
DE
Germany
Prior art keywords
electronic component
assembly method
assembly
electronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69735240T
Other languages
English (en)
Other versions
DE69735240T2 (de
Inventor
Takeshi Kuribayashi
Kazuyuki Nakano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69735240D1 publication Critical patent/DE69735240D1/de
Publication of DE69735240T2 publication Critical patent/DE69735240T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
DE69735240T 1996-12-13 1997-12-12 Elektronisches bauteil und bestückungsverfahren und -vorrichtung Expired - Lifetime DE69735240T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP33378296 1996-12-13
JP33378296 1996-12-13
PCT/JP1997/004578 WO1998026641A1 (fr) 1996-12-13 1997-12-12 Composant electronique et son procede et son dispositif de montage

Publications (2)

Publication Number Publication Date
DE69735240D1 true DE69735240D1 (de) 2006-04-20
DE69735240T2 DE69735240T2 (de) 2006-09-21

Family

ID=18269907

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69735240T Expired - Lifetime DE69735240T2 (de) 1996-12-13 1997-12-12 Elektronisches bauteil und bestückungsverfahren und -vorrichtung

Country Status (5)

Country Link
US (2) US6429387B1 (de)
EP (1) EP0948250B1 (de)
CN (1) CN1138463C (de)
DE (1) DE69735240T2 (de)
WO (1) WO1998026641A1 (de)

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US6798076B2 (en) * 1999-12-21 2004-09-28 Intel Corporation Method and apparatus for encoding information in an IC package
EP1280204A3 (de) 2001-06-27 2004-09-01 Shinko Electric Industries Co. Ltd. Schaltungssubstrat mit Positionierungsmarke
US7813559B2 (en) 2001-11-13 2010-10-12 Cyberoptics Corporation Image analysis for pick and place machines with in situ component placement inspection
US7555831B2 (en) 2001-11-13 2009-07-07 Cyberoptics Corporation Method of validating component feeder exchanges
US7239399B2 (en) 2001-11-13 2007-07-03 Cyberoptics Corporation Pick and place machine with component placement inspection
JP3565835B1 (ja) * 2003-04-28 2004-09-15 松下電器産業株式会社 配線基板およびその製造方法ならびに半導体装置およびその製造方法
US7706595B2 (en) 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
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JP4417779B2 (ja) * 2004-05-31 2010-02-17 株式会社日立ハイテクインスツルメンツ 電子部品装着装置及び電子部品装着方法
US7636449B2 (en) * 2004-11-12 2009-12-22 Cognex Technology And Investment Corporation System and method for assigning analysis parameters to vision detector using a graphical interface
JP4353100B2 (ja) * 2005-01-21 2009-10-28 パナソニック株式会社 電子部品実装システムおよび電子部品実装方法
JP4607612B2 (ja) * 2005-02-09 2011-01-05 日東電工株式会社 配線回路基板およびその製造方法
NL1029247C2 (nl) * 2005-06-14 2006-12-18 Assembleon Nv Werkwijze voor het instellen van ten minste een optionele instelling van een verwerkingseigenschap van de componentplaatsingsinrichting alsmede een dergelijke componentplaatsingsinrichting en elektronische sleutel.
KR100861512B1 (ko) * 2007-03-06 2008-10-02 삼성테크윈 주식회사 복수의 칩마운터 통합 제어 시스템
US8156642B2 (en) * 2007-04-03 2012-04-17 Panasonic Corporation Component mounting method
JP5350604B2 (ja) * 2007-05-16 2013-11-27 スパンション エルエルシー 半導体装置及びその製造方法
JP5143906B2 (ja) * 2007-09-26 2013-02-13 モレックス インコーポレイテド 電気部品取付組立体
US20100155106A1 (en) * 2008-12-22 2010-06-24 Sun Microsystems, Inc. Method and apparatus for optical differentiation to detect missing components on a circuit board
CN101772299B (zh) * 2008-12-29 2012-09-05 华硕电脑股份有限公司 组装识别系统
JP2012134400A (ja) * 2010-12-23 2012-07-12 Denso Corp 回路基板
JP6099116B2 (ja) * 2011-12-12 2017-03-22 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． バンプ付きｉｃチップの回路基板上への実装装置及び実装方法
JP5945699B2 (ja) * 2012-12-25 2016-07-05 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法
JP5845448B2 (ja) * 2013-02-07 2016-01-20 パナソニックＩｐマネジメント株式会社 生産データ作成装置および生産データ作成方法
US20160057855A1 (en) * 2013-04-15 2016-02-25 Heptagon Micro Optics Pte. Ltd. Accurate Positioning and Alignment of a Component During Processes Such as Reflow Soldering
CN104494313A (zh) * 2014-12-18 2015-04-08 深圳市五株科技股份有限公司 制作ic载板标识的方法及其打标装置
WO2016194035A1 (ja) 2015-05-29 2016-12-08 富士機械製造株式会社 部品取付装置及び部品取付方法
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CN112447555A (zh) * 2019-08-29 2021-03-05 芝浦机械电子装置株式会社 电子零件的安装装置
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Also Published As

Publication number Publication date
DE69735240T2 (de) 2006-09-21
WO1998026641A1 (fr) 1998-06-18
EP0948250B1 (de) 2006-02-08
EP0948250A4 (de) 2000-11-08
US20010027877A1 (en) 2001-10-11
CN1240568A (zh) 2000-01-05
US6429387B1 (en) 2002-08-06
EP0948250A1 (de) 1999-10-06
CN1138463C (zh) 2004-02-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)