MY196765A - Method for manufacturing light emitting device including light emitting element and color conversion material layer - Google Patents

Method for manufacturing light emitting device including light emitting element and color conversion material layer

Info

Publication number
MY196765A
MY196765A MYPI2020004015A MYPI2020004015A MY196765A MY 196765 A MY196765 A MY 196765A MY PI2020004015 A MYPI2020004015 A MY PI2020004015A MY PI2020004015 A MYPI2020004015 A MY PI2020004015A MY 196765 A MY196765 A MY 196765A
Authority
MY
Malaysia
Prior art keywords
light emitting
color conversion
conversion material
emitting element
light
Prior art date
Application number
MYPI2020004015A
Other languages
English (en)
Inventor
Tamaki Hiroto
Nakabayashi Takuya
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of MY196765A publication Critical patent/MY196765A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
MYPI2020004015A 2014-09-30 2015-09-28 Method for manufacturing light emitting device including light emitting element and color conversion material layer MY196765A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014201416A JP6459354B2 (ja) 2014-09-30 2014-09-30 透光部材及びその製造方法ならびに発光装置及びその製造方法

Publications (1)

Publication Number Publication Date
MY196765A true MY196765A (en) 2023-05-03

Family

ID=54249355

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI2020004015A MY196765A (en) 2014-09-30 2015-09-28 Method for manufacturing light emitting device including light emitting element and color conversion material layer
MYPI2015703421A MY183451A (en) 2014-09-30 2015-09-28 Light emitting device and method for manufacturing thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI2015703421A MY183451A (en) 2014-09-30 2015-09-28 Light emitting device and method for manufacturing thereof

Country Status (7)

Country Link
US (3) US9825001B2 (enExample)
EP (2) EP3012878B1 (enExample)
JP (1) JP6459354B2 (enExample)
KR (1) KR102443500B1 (enExample)
CN (1) CN105470368B (enExample)
MY (2) MY196765A (enExample)
TW (1) TWI686965B (enExample)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6582382B2 (ja) * 2014-09-26 2019-10-02 日亜化学工業株式会社 発光装置の製造方法
JP6459354B2 (ja) * 2014-09-30 2019-01-30 日亜化学工業株式会社 透光部材及びその製造方法ならびに発光装置及びその製造方法
JP6484982B2 (ja) * 2014-09-30 2019-03-20 日亜化学工業株式会社 発光装置の製造方法
JP6249002B2 (ja) * 2015-09-30 2017-12-20 日亜化学工業株式会社 発光装置の製造方法
US9704839B2 (en) * 2015-11-18 2017-07-11 Infineon Technologies Ag Semiconductor devices for integration with light emitting chips and modules thereof
JP6711021B2 (ja) 2016-03-02 2020-06-17 日亜化学工業株式会社 発光装置及びその製造方法
JP6940740B2 (ja) * 2016-05-06 2021-09-29 日亜化学工業株式会社 発光装置の製造方法
JP6790478B2 (ja) 2016-06-14 2020-11-25 日亜化学工業株式会社 発光装置の製造方法
JP7280820B2 (ja) * 2016-07-28 2023-05-24 ルミレッズ リミテッド ライアビリティ カンパニー 反射性側面コーティングを伴う発光デバイスの製造方法
CN107689409B (zh) * 2016-08-03 2019-09-20 展晶科技(深圳)有限公司 发光二极管
US10319789B2 (en) 2016-08-12 2019-06-11 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic component and an optoelectronic component
JP6512201B2 (ja) * 2016-09-30 2019-05-15 日亜化学工業株式会社 線状発光装置の製造方法及び線状発光装置
JP6800703B2 (ja) * 2016-11-08 2020-12-16 スタンレー電気株式会社 半導体発光装置
US10971663B2 (en) 2016-11-08 2021-04-06 Stanley Electric Co., Ltd. Semiconductor light emitting device
WO2018088301A1 (ja) * 2016-11-11 2018-05-17 スタンレー電気株式会社 紫外発光ダイオード
JP6798279B2 (ja) * 2016-11-28 2020-12-09 豊田合成株式会社 発光装置の製造方法
JP6635007B2 (ja) 2016-11-30 2020-01-22 日亜化学工業株式会社 発光装置の製造方法
JP6740374B2 (ja) * 2016-12-22 2020-08-12 シャープ株式会社 表示装置および製造方法
KR102831200B1 (ko) * 2017-02-02 2025-07-10 서울반도체 주식회사 발광 다이오드 패키지
JP6720887B2 (ja) * 2017-02-02 2020-07-08 豊田合成株式会社 発光装置の製造方法
WO2018155253A1 (ja) * 2017-02-23 2018-08-30 東レ株式会社 蛍光体シート、それを用いたｌｅｄチップおよびｌｅｄパッケージ、ｌｅｄパッケージの製造方法、ならびにｌｅｄパッケージを含む発光装置、バックライトユニットおよびディスプレイ
JP6966691B2 (ja) 2017-05-31 2021-11-17 日亜化学工業株式会社 発光装置及び発光装置の製造方法
JP6627838B2 (ja) * 2017-09-29 2020-01-08 日亜化学工業株式会社 透光性シートの製造方法
KR102435798B1 (ko) * 2017-11-20 2022-08-25 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
DE102017129623B4 (de) * 2017-12-12 2024-03-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Licht emittierendes Halbleiterbauelement
US11355548B2 (en) * 2017-12-20 2022-06-07 Lumileds Llc Monolithic segmented LED array architecture
US11335835B2 (en) 2017-12-20 2022-05-17 Lumileds Llc Converter fill for LED array
JP7235944B2 (ja) 2018-02-21 2023-03-09 日亜化学工業株式会社 発光装置及び発光装置の製造方法
CN110323213B (zh) 2018-03-30 2024-05-03 日亚化学工业株式会社 发光装置的制造方法
JP6777127B2 (ja) * 2018-03-30 2020-10-28 日亜化学工業株式会社 発光装置の製造方法
JP6978690B2 (ja) * 2018-05-25 2021-12-08 日亜化学工業株式会社 透光性部材の形成方法および発光装置の製造方法、ならびに、発光装置
US10910433B2 (en) 2018-12-31 2021-02-02 Lumileds Llc Pixelated LED array with optical elements
CN109799647B (zh) * 2019-03-29 2021-12-31 深圳创维－Rgb电子有限公司 一种背光源及液晶显示模组
KR102579748B1 (ko) 2019-05-08 2023-09-19 삼성전자주식회사 디스플레이 모듈 및 디스플레이 모듈 몰딩 방법
TWI748924B (zh) * 2019-05-24 2021-12-01 晶元光電股份有限公司 封裝與顯示模組
WO2020240907A1 (ja) * 2019-05-30 2020-12-03 株式会社村田製作所 電子デバイス及びその製造方法
JP6985630B2 (ja) * 2019-09-25 2021-12-22 日亜化学工業株式会社 発光モジュールの製造方法及び発光モジュール
JP7343763B2 (ja) * 2019-09-27 2023-09-13 日亜化学工業株式会社 発光装置及びその製造方法
JP6885494B1 (ja) * 2019-09-27 2021-06-16 日亜化学工業株式会社 発光装置の製造方法
JP7108196B2 (ja) * 2019-12-26 2022-07-28 日亜化学工業株式会社 発光装置、波長変換部材の製造方法及び発光装置の製造方法
CN117280280A (zh) * 2021-04-21 2023-12-22 维耶尔公司 在微器件中集成颜色转换材料
CN115346970A (zh) * 2021-05-13 2022-11-15 群创光电股份有限公司 电子装置
JP7538432B2 (ja) * 2022-03-31 2024-08-22 日亜化学工業株式会社 光学部材及び発光装置
TWI894592B (zh) * 2022-08-11 2025-08-21 美商科銳Ｌｅｄ公司 具有單一透鏡結構的固態發光構件
CN119439555B (zh) * 2023-07-31 2026-01-27 京东方科技集团股份有限公司 发光模组和显示装置

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6274890B1 (en) * 1997-01-15 2001-08-14 Kabushiki Kaisha Toshiba Semiconductor light emitting device and its manufacturing method
US5952681A (en) * 1997-11-24 1999-09-14 Chen; Hsing Light emitting diode emitting red, green and blue light
JPH11329726A (ja) 1998-05-21 1999-11-30 Sharp Corp 有機ｅｌ素子
JP4756841B2 (ja) * 2004-09-29 2011-08-24 スタンレー電気株式会社 半導体発光装置の製造方法
US7411225B2 (en) * 2005-03-21 2008-08-12 Lg Electronics Inc. Light source apparatus
US9048400B2 (en) 2006-10-12 2015-06-02 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device with a wavelength converting layer and method for manufacturing the same
JPWO2009031571A1 (ja) * 2007-09-06 2010-12-16 ソニー株式会社 光抽出素子、光抽出素子の製造方法および表示装置
JP5278023B2 (ja) 2009-02-18 2013-09-04 日亜化学工業株式会社 発光装置の製造方法
JP5326705B2 (ja) * 2009-03-17 2013-10-30 日亜化学工業株式会社 発光装置
US9006763B2 (en) 2009-05-22 2015-04-14 Panasonic Intellectual Property Management Co., Ltd. Semiconductor light-emitting device and light source device using the same
WO2010140411A1 (ja) * 2009-06-05 2010-12-09 コニカミノルタオプト株式会社 発光装置の製造方法及び発光装置
WO2011027418A1 (ja) * 2009-09-01 2011-03-10 株式会社 東芝 半導体発光素子及び半導体発光装置
JP5368913B2 (ja) 2009-09-02 2013-12-18 スタンレー電気株式会社 発光装置およびその製造方法
JP5612298B2 (ja) 2009-11-20 2014-10-22 株式会社小糸製作所 発光モジュールおよび車両用灯具
JP5701523B2 (ja) * 2010-06-22 2015-04-15 日東電工株式会社 半導体発光装置
DE102010048162A1 (de) * 2010-10-11 2012-04-12 Osram Opto Semiconductors Gmbh Konversionsbauteil
JP5549539B2 (ja) * 2010-10-28 2014-07-16 日本電気硝子株式会社 波長変換素子、それを備える光源及びその製造方法
US9638396B2 (en) 2010-11-18 2017-05-02 Nippon Electric Glass Co., Ltd. Wavelength conversion element and light source provided with same
JP5585421B2 (ja) 2010-11-30 2014-09-10 日本電気硝子株式会社 波長変換素子及びそれを備える光源
JP5553741B2 (ja) * 2010-12-22 2014-07-16 スタンレー電気株式会社 発光装置およびその製造方法
US8316534B2 (en) * 2011-01-26 2012-11-27 GEM Weltronics TWN Corporation Method for packaging airtight multi-layer array type LED
JP2013038187A (ja) * 2011-08-05 2013-02-21 Stanley Electric Co Ltd 発光装置およびその製造方法
JP2013077679A (ja) * 2011-09-30 2013-04-25 Citizen Electronics Co Ltd 半導体発光装置とその製造方法
US9222640B2 (en) * 2011-10-18 2015-12-29 Tsmc Solid State Lighting Ltd. Coated diffuser cap for LED illumination device
US9142747B2 (en) * 2011-11-17 2015-09-22 Lumens Co., Ltd. Light emitting device package and backlight unit comprising the same
JP5860289B2 (ja) * 2012-01-05 2016-02-16 シチズン電子株式会社 Ｌｅｄ装置の製造方法
JP5848631B2 (ja) * 2012-02-23 2016-01-27 シャープ株式会社 照明装置およびそれを備えた表示装置
JP6005953B2 (ja) * 2012-03-02 2016-10-12 スタンレー電気株式会社 発光装置
US20130240934A1 (en) 2012-03-14 2013-09-19 Samsung Electronics Co., Ltd. Light emitting element package and method of manufacturing the same
JP5941306B2 (ja) 2012-03-19 2016-06-29 スタンレー電気株式会社 発光装置およびその製造方法
US8907502B2 (en) 2012-06-29 2014-12-09 Nitto Denko Corporation Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device
US20140001948A1 (en) 2012-06-29 2014-01-02 Nitto Denko Corporation Reflecting layer-phosphor layer-covered led, producing method thereof, led device, and producing method thereof
DE102012109905B4 (de) * 2012-10-17 2021-11-11 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterbauteilen
CN202948973U (zh) * 2012-11-27 2013-05-22 北京半导体照明科技促进中心 荧光粉层、led封装单元及led封装系统
JP5995695B2 (ja) 2012-12-03 2016-09-21 シチズンホールディングス株式会社 Ｌｅｄ装置の製造方法
JP6150050B2 (ja) 2012-12-07 2017-06-21 東芝ライテック株式会社 発光装置及び照明装置
CN103855142B (zh) 2012-12-04 2017-12-29 东芝照明技术株式会社 发光装置及照明装置
DE102012113003A1 (de) 2012-12-21 2014-04-03 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil
JP2014127679A (ja) * 2012-12-27 2014-07-07 Panasonic Corp 発光装置及びその製造方法
CN103346243B (zh) * 2013-07-12 2016-08-31 广东洲明节能科技有限公司 承载散热板和远程荧光粉结构的led光源及其生产方法
DE102013214877A1 (de) * 2013-07-30 2015-02-19 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines Abdeckelements und eines optoelektronischen Bauelements, Abdeckelement und optoelektronisches Bauelement
DE102013214896B4 (de) 2013-07-30 2021-09-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines Konverterelements und eines optoelektronischen Bauelements, Konverterelement und optoelektronisches Bauelement
JP6459354B2 (ja) * 2014-09-30 2019-01-30 日亜化学工業株式会社 透光部材及びその製造方法ならびに発光装置及びその製造方法

Also Published As

Publication number Publication date
TW201614875A (en) 2016-04-16
US10636764B2 (en) 2020-04-28
EP3734676B1 (en) 2024-11-27
CN105470368B (zh) 2020-09-22
US20160093781A1 (en) 2016-03-31
KR102443500B1 (ko) 2022-09-15
EP3734676A1 (en) 2020-11-04
US9825001B2 (en) 2017-11-21
CN105470368A (zh) 2016-04-06
US20180040583A1 (en) 2018-02-08
EP3012878A1 (en) 2016-04-27
JP6459354B2 (ja) 2019-01-30
US10290607B2 (en) 2019-05-14
US20190221541A1 (en) 2019-07-18
JP2016072471A (ja) 2016-05-09
EP3012878B1 (en) 2021-09-01
MY183451A (en) 2021-02-18
KR20160038867A (ko) 2016-04-07
TWI686965B (zh) 2020-03-01

Similar Documents

Publication Publication Date Title
MY183451A (en) Light emitting device and method for manufacturing thereof
TW201614870A (en) Semiconductor light emitting device and method for manufacturing the same
MX2017003480A (es) Metodo para la fabricacion de cubierta de radar y cubierta de radar.
EP3094160A4 (en) Optical substrate, mold to be used in optical substrate manufacture, and light emitting element including optical substrate
GB2544017A8 (en) Optical body, display device and method for producing optical body
MY188668A (en) Light source unit, laminated member, and display and lighting apparatus including them
TW201612561A (en) Color conversion film, display device using the color conversion film, and manufacturing method of the color conversion film
EP3433650C0 (en) GRID-BASED BACKLIGHTING USING REFLECTIVE GRID ISLANDS
TW201612262A (en) Curable resin composition, cured film, wavelength conversion film, light emitting element, and method for forming light emitting layer
EP3244238A4 (en) Diffuse reflection material, diffuse reflection layer, wavelength conversion device and light source system
PH12015502510A1 (en) Method of providing a security document with a security feature, and security document
EP2642537A3 (en) Light emitting device and method for manufacturing the same
TW201614783A (en) Power module
MX363041B (es) Modulo semiconductor con una masa de revestimiento de cemento que cubre un componente semiconductor.
MY189900A (en) Light emitting device
EP3157994A4 (en) Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition
GB2550822A (en) A security document or token
JOP20170141B1 (ar) مرشح ضوئي وطريقة لتصنيع مرشح ضوئي
MX336753B (es) Material impreso, dispositivo de inspeccion de material impreso, metodo de manufactura de material impreso y dispositivo de manufactura de material impreso.
JP2014241456A5 (enExample)
TW201612452A (en) Lens and light emitting diode module using the same
IN2014DE03043A (enExample)
TW201613146A (en) Light-emitting device
EP3566880A4 (en) DECORATION SHEET WITH A DISCONTINUOUS LENTICULAR LENS
PL124280U1 (pl) Opaska odblaskowa