MX363041B - Modulo semiconductor con una masa de revestimiento de cemento que cubre un componente semiconductor. - Google Patents
Modulo semiconductor con una masa de revestimiento de cemento que cubre un componente semiconductor.Info
- Publication number
- MX363041B MX363041B MX2016005182A MX2016005182A MX363041B MX 363041 B MX363041 B MX 363041B MX 2016005182 A MX2016005182 A MX 2016005182A MX 2016005182 A MX2016005182 A MX 2016005182A MX 363041 B MX363041 B MX 363041B
- Authority
- MX
- Mexico
- Prior art keywords
- encasing
- covers
- semiconductor
- cement mass
- semiconductor module
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/46—Structure, shape, material or disposition of the wire connectors prior to the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48105—Connecting bonding areas at different heights
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Un módulo semiconductor (10) con una masa de revestimiento (30) que cubre un componente semiconductor (20) se caracteriza porque la masa de revestimiento (30) es cemento.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201310112267 DE102013112267A1 (de) | 2013-11-07 | 2013-11-07 | Halbleitermodul mit einer einen Halbleiterbaustein bedeckenden Umhüllungsmasse |
PCT/EP2014/072012 WO2015067441A1 (de) | 2013-11-07 | 2014-10-14 | Halbleitermodul mit einer einen halbleiterbaustein bedeckenden umhüllungsmasse aus zement |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2016005182A MX2016005182A (es) | 2016-08-12 |
MX363041B true MX363041B (es) | 2019-03-06 |
Family
ID=51726499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2016005182A MX363041B (es) | 2013-11-07 | 2014-10-14 | Modulo semiconductor con una masa de revestimiento de cemento que cubre un componente semiconductor. |
Country Status (10)
Country | Link |
---|---|
US (1) | US10685894B2 (es) |
EP (1) | EP3066684B1 (es) |
JP (1) | JP6472458B2 (es) |
KR (1) | KR101931005B1 (es) |
CN (1) | CN105706230B (es) |
DE (1) | DE102013112267A1 (es) |
HU (1) | HUE043748T2 (es) |
MX (1) | MX363041B (es) |
TW (1) | TW201535631A (es) |
WO (1) | WO2015067441A1 (es) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015120100B4 (de) * | 2015-11-19 | 2023-12-07 | Danfoss Silicon Power Gmbh | Elektronisches Modul, Verfahren zur Herstellung eines elektronischen Moduls und Zusammenstellung von übereinandergestapelten elektronischen Modulen |
DE102015120111A1 (de) * | 2015-11-19 | 2017-05-24 | Danfoss Silicon Power Gmbh | Leistungshalbleitermodul |
DE102015223439A1 (de) * | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse |
DE102015223467A1 (de) * | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Elektrische Vorrichtung mit einer Umhüllmasse |
DE102015223449A1 (de) * | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Elektrische Vorrichtung mit einer Umhüllmasse |
DE102015223406A1 (de) | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse |
DE102015223415A1 (de) | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse |
DE102015223466A1 (de) | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Elektrische Vorrichtung mit einer Umhüllmasse |
DE102015223443A1 (de) | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Elektrische Vorrichtung mit einer Umhüllmasse |
DE102015223422A1 (de) * | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Elektrische Vorrichtung mit einer Umhüllmasse |
CN105489560A (zh) * | 2015-11-30 | 2016-04-13 | 广东百圳君耀电子有限公司 | 一种无外壳填充保护型电路元件及其制成工艺 |
DE102016225654A1 (de) * | 2016-12-20 | 2018-06-21 | Robert Bosch Gmbh | Leistungsmodul mit einem in Etagen ausgebildeten Gehäuse |
DE102016226262A1 (de) * | 2016-12-28 | 2018-06-28 | Robert Bosch Gmbh | Elektronikmodul, Verfahren |
DE102017108114A1 (de) | 2017-04-13 | 2018-10-18 | Infineon Technologies Ag | Chipmodul mit räumlich eingeschränktem thermisch leitfähigen Montagekörper |
DE102017207424A1 (de) * | 2017-05-03 | 2018-11-08 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse |
DE102017215298A1 (de) * | 2017-09-01 | 2019-03-07 | Robert Bosch Gmbh | Verbundwerkstoff und Verfahren zu seiner Herstellung |
US20190357386A1 (en) * | 2018-05-16 | 2019-11-21 | GM Global Technology Operations LLC | Vascular polymeric assembly |
DE102018212159A1 (de) | 2018-07-20 | 2020-01-23 | Robert Bosch Gmbh | Aufbau und Verfahren zum Verbinden einer ersten und einer zweiten Baugruppe durch Verkleben |
DE102018214641B4 (de) * | 2018-08-29 | 2022-09-22 | Robert Bosch Gmbh | Vergussmasse, Verfahren zum elektrischen Isolieren eines elektrischen oder elektronischen Bauteils unter Verwendung der Vergussmasse, elektrisch isoliertes Bauteil, hergestellt über ein solches Verfahren und Verwendung der Vergussmasse |
EP3719975A1 (de) * | 2019-04-04 | 2020-10-07 | Siemens Aktiengesellschaft | Elektrische maschine |
DE102019108932B4 (de) * | 2019-04-05 | 2022-04-21 | Danfoss Silicon Power Gmbh | Halbleitermodul und Verfahren zu seiner Herstellung |
DE102019111366B3 (de) | 2019-05-02 | 2020-05-14 | Fachhochschule Kiel | Kompaktes Leistungselektronik-Modul mit vergrößerter Kühlfläche |
DE102019111367A1 (de) * | 2019-05-02 | 2020-11-05 | Danfoss Silicon Power Gmbh | Leistungselektronik-Modul mit verbesserter Kühlung |
US11145571B2 (en) * | 2019-06-04 | 2021-10-12 | Semiconductor Components Industries, Llc | Heat transfer for power modules |
DE102019117534B4 (de) | 2019-06-28 | 2022-03-03 | Infineon Technologies Ag | Anorganisches Verkapselungsmittel für eine elektronische Komponente mit Haftvermittler |
DE102019132314B4 (de) * | 2019-11-28 | 2022-03-03 | Infineon Technologies Ag | Package mit Einkapselung unter Kompressionsbelastung |
DE102020115085A1 (de) | 2020-06-05 | 2021-12-09 | Danfoss Silicon Power Gmbh | Leistungselektronik-Modul |
DE212021000463U1 (de) * | 2020-09-17 | 2023-07-13 | Hitachi Energy Switzerland Ag | Leistungsmodul |
EP4245737A1 (de) | 2022-03-18 | 2023-09-20 | Heraeus Deutschland GmbH & Co. KG | Hydraulisch härtbare anorganische zementzusammensetzung |
EP4273110A1 (de) | 2022-05-02 | 2023-11-08 | Heraeus Deutschland GmbH & Co. KG | Hydraulisch härtbare anorganische zementzusammensetzung |
WO2024042064A1 (de) * | 2022-08-23 | 2024-02-29 | Hahn-Schickard-Gesellschaft Für Angewandte Forschung E. V. | Selbstaushärtender beton als neuer werkstoff für mikrosysteme |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1514413A1 (de) | 1965-03-11 | 1969-06-12 | Siemens Ag | Verfahren zum Herstellen von vorzugsweise temperaturbestaendigen Halbleiterbauelementen |
US4529755A (en) * | 1982-10-23 | 1985-07-16 | Denki Kagaku Kogyo Kabushiki Kaisha | Epoxy resin composition for encapsulating semiconductor |
JPS60226149A (ja) | 1984-04-25 | 1985-11-11 | Nec Corp | ヒ−トシンク付セラミツクパツケ−ジ |
US5300459A (en) * | 1989-12-28 | 1994-04-05 | Sanken Electric Co., Ltd. | Method for reducing thermal stress in an encapsulated integrated circuit package |
EP0827215A3 (en) | 1996-08-27 | 2000-09-20 | Kubota Corporation | Thermoelectric modules and thermoelectric elements |
JPH10313134A (ja) * | 1997-05-14 | 1998-11-24 | Kubota Corp | 熱電モジュールの製造方法 |
US7034660B2 (en) * | 1999-02-26 | 2006-04-25 | Sri International | Sensor devices for structural health monitoring |
JP3797021B2 (ja) | 1999-05-31 | 2006-07-12 | 三菱電機株式会社 | 電力用半導体装置 |
US7723162B2 (en) | 2002-03-22 | 2010-05-25 | White Electronic Designs Corporation | Method for producing shock and tamper resistant microelectronic devices |
JP4143450B2 (ja) * | 2003-03-19 | 2008-09-03 | 日本特殊陶業株式会社 | 温度センサの製造方法 |
BRPI0512064A (pt) * | 2004-06-15 | 2008-02-06 | Constr Res & Tech Gmbh | fornecimento de resistência ao congelamento e descongelamento para composições de cimentos |
US7987728B2 (en) * | 2006-07-07 | 2011-08-02 | The University Of Houston System | Piezoceramic-based smart aggregate for unified performance monitoring of concrete structures |
US8637980B1 (en) * | 2007-12-18 | 2014-01-28 | Rockwell Collins, Inc. | Adhesive applications using alkali silicate glass for electronics |
US8617913B2 (en) * | 2006-08-23 | 2013-12-31 | Rockwell Collins, Inc. | Alkali silicate glass based coating and method for applying |
DE102008007021A1 (de) | 2008-01-31 | 2009-08-06 | Osram Gesellschaft mit beschränkter Haftung | Drossel und Verfahren zum Herstellen einer Drosselkerneinheit für eine Drossel |
JP2009252838A (ja) * | 2008-04-02 | 2009-10-29 | Mitsubishi Electric Corp | 半導体装置 |
KR101013555B1 (ko) * | 2008-10-09 | 2011-02-14 | 주식회사 하이닉스반도체 | 반도체 패키지 및 이의 제조 방법 |
JP2013511467A (ja) * | 2009-11-23 | 2013-04-04 | アプライド ナノストラクチャード ソリューションズ リミテッド ライアビリティー カンパニー | カーボンナノチューブ浸出繊維材料を含有するセラミック複合材料とその製造方法 |
JP2010245566A (ja) | 2010-07-20 | 2010-10-28 | Tamura Thermal Device Corp | 発煙軽減型電子部品 |
US20130229777A1 (en) * | 2012-03-01 | 2013-09-05 | Infineon Technologies Ag | Chip arrangements and methods for forming a chip arrangement |
JP5902543B2 (ja) * | 2012-04-20 | 2016-04-13 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
KR101388815B1 (ko) * | 2012-06-29 | 2014-04-23 | 삼성전기주식회사 | 반도체 패키지 |
-
2013
- 2013-11-07 DE DE201310112267 patent/DE102013112267A1/de not_active Withdrawn
-
2014
- 2014-10-14 MX MX2016005182A patent/MX363041B/es unknown
- 2014-10-14 US US15/034,626 patent/US10685894B2/en active Active
- 2014-10-14 EP EP14784224.9A patent/EP3066684B1/de active Active
- 2014-10-14 WO PCT/EP2014/072012 patent/WO2015067441A1/de active Application Filing
- 2014-10-14 CN CN201480061050.9A patent/CN105706230B/zh active Active
- 2014-10-14 HU HUE14784224A patent/HUE043748T2/hu unknown
- 2014-10-14 JP JP2016550968A patent/JP6472458B2/ja active Active
- 2014-10-14 KR KR1020167014401A patent/KR101931005B1/ko active IP Right Grant
- 2014-10-31 TW TW103137949A patent/TW201535631A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP3066684A1 (de) | 2016-09-14 |
HUE043748T2 (hu) | 2019-09-30 |
CN105706230A (zh) | 2016-06-22 |
DE102013112267A1 (de) | 2015-05-07 |
KR20160083031A (ko) | 2016-07-11 |
US20160260648A1 (en) | 2016-09-08 |
JP6472458B2 (ja) | 2019-02-20 |
US10685894B2 (en) | 2020-06-16 |
CN105706230B (zh) | 2020-03-13 |
WO2015067441A1 (de) | 2015-05-14 |
TW201535631A (zh) | 2015-09-16 |
KR101931005B1 (ko) | 2018-12-19 |
JP2016535464A (ja) | 2016-11-10 |
EP3066684B1 (de) | 2019-04-10 |
MX2016005182A (es) | 2016-08-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MX363041B (es) | Modulo semiconductor con una masa de revestimiento de cemento que cubre un componente semiconductor. | |
SG10201705797UA (en) | Compact opto-electronic modules and fabrication methods for such modules | |
EP2959509A4 (en) | MULTIPLE MODULE WITH COMPRESSIBLE STRUCTURE FOR MAINTAINING THE ALIGNMENT BETWEEN CHIPS IN THE MODULE | |
KR20180084819A (ko) | 반도체 장치, 상기 반도체 장치를 가지는 표시 장치, 및 상기 반도체 장치를 가지는 전자 기기 | |
TWM475789U (en) | Carrying apparatus for flat portable electronic device | |
CA151475S (en) | Handheld electronic device | |
HK1205592A1 (en) | A semiconductor device and an electronic device | |
EP2941794A4 (en) | HOUSING OF AN ELECTRONIC DEVICE | |
IN2013KO01129A (es) | ||
EP2973664A4 (en) | PLANAR CONTACTS FOR PSEUDOMORPHES ELECTRONIC AND OPTOELECTRONIC DEVICES | |
EP3032540A4 (en) | Semiconductor integrated circuit device | |
TWD192214S (zh) | 電子裝置 | |
SG10201406149PA (en) | Semiconductor Device And Method For Manufacturing The Same | |
UY4275Q (es) | Controlador para dispositivo electrónico | |
EP3078061A4 (en) | Semiconductor device and semiconductor circuit including the device | |
HK1210869A1 (en) | Semiconductor device and method for manufacturing the same | |
EP3266042A4 (en) | Semiconductor device assembly with underfill containment cavity | |
EP3047466A4 (en) | Smart device for use with an electronic key | |
EP3086305A4 (en) | Electronic device, and translucent cover member for electronic device | |
EP2965325A4 (en) | CONDUCTIVE FILM, METHOD FOR THE PRODUCTION THEREOF AND ELECTRONIC DEVICE THEREFOR | |
HK1205393A1 (en) | Complex device and electronic device having the same | |
EP2960935A4 (en) | HOUSING FOR RECEIVING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE | |
EP2975612A4 (en) | HOUSING FOR ELECTRONIC DEVICE | |
TWI562491B (en) | Protection circuit and electronic device with the same | |
EP3041041A4 (en) | PACKAGE FOR RECEIVING AN ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE |