MX2016005182A - Modulo semiconductor con una masa de revestimiento de cemento que cubre un componente semiconductor. - Google Patents

Modulo semiconductor con una masa de revestimiento de cemento que cubre un componente semiconductor.

Info

Publication number
MX2016005182A
MX2016005182A MX2016005182A MX2016005182A MX2016005182A MX 2016005182 A MX2016005182 A MX 2016005182A MX 2016005182 A MX2016005182 A MX 2016005182A MX 2016005182 A MX2016005182 A MX 2016005182A MX 2016005182 A MX2016005182 A MX 2016005182A
Authority
MX
Mexico
Prior art keywords
semiconductor
encasing
covers
cement mass
semiconductor module
Prior art date
Application number
MX2016005182A
Other languages
English (en)
Other versions
MX363041B (es
Inventor
Eisele Ronald
Original Assignee
Heraeus Deutschland Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Deutschland Gmbh & Co Kg filed Critical Heraeus Deutschland Gmbh & Co Kg
Publication of MX2016005182A publication Critical patent/MX2016005182A/es
Publication of MX363041B publication Critical patent/MX363041B/es

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/141—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being on at least the sidewalls of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Un módulo semiconductor (10) con una masa de revestimiento (30) que cubre un componente semiconductor (20) se caracteriza porque la masa de revestimiento (30) es cemento.
MX2016005182A 2013-11-07 2014-10-14 Modulo semiconductor con una masa de revestimiento de cemento que cubre un componente semiconductor. MX363041B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201310112267 DE102013112267A1 (de) 2013-11-07 2013-11-07 Halbleitermodul mit einer einen Halbleiterbaustein bedeckenden Umhüllungsmasse
PCT/EP2014/072012 WO2015067441A1 (de) 2013-11-07 2014-10-14 Halbleitermodul mit einer einen halbleiterbaustein bedeckenden umhüllungsmasse aus zement

Publications (2)

Publication Number Publication Date
MX2016005182A true MX2016005182A (es) 2016-08-12
MX363041B MX363041B (es) 2019-03-06

Family

ID=51726499

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2016005182A MX363041B (es) 2013-11-07 2014-10-14 Modulo semiconductor con una masa de revestimiento de cemento que cubre un componente semiconductor.

Country Status (10)

Country Link
US (1) US10685894B2 (es)
EP (1) EP3066684B1 (es)
JP (1) JP6472458B2 (es)
KR (1) KR101931005B1 (es)
CN (1) CN105706230B (es)
DE (1) DE102013112267A1 (es)
HU (1) HUE043748T2 (es)
MX (1) MX363041B (es)
TW (1) TW201535631A (es)
WO (1) WO2015067441A1 (es)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015120111A1 (de) * 2015-11-19 2017-05-24 Danfoss Silicon Power Gmbh Leistungshalbleitermodul
DE102015120100B4 (de) * 2015-11-19 2023-12-07 Danfoss Silicon Power Gmbh Elektronisches Modul, Verfahren zur Herstellung eines elektronischen Moduls und Zusammenstellung von übereinandergestapelten elektronischen Modulen
DE102015223422A1 (de) * 2015-11-26 2017-06-01 Robert Bosch Gmbh Elektrische Vorrichtung mit einer Umhüllmasse
DE102015223439A1 (de) 2015-11-26 2017-06-01 Robert Bosch Gmbh Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse
DE102015223467A1 (de) 2015-11-26 2017-06-01 Robert Bosch Gmbh Elektrische Vorrichtung mit einer Umhüllmasse
DE102015223415A1 (de) 2015-11-26 2017-06-01 Robert Bosch Gmbh Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse
DE102015223443A1 (de) * 2015-11-26 2017-06-01 Robert Bosch Gmbh Elektrische Vorrichtung mit einer Umhüllmasse
DE102015223466A1 (de) 2015-11-26 2017-06-01 Robert Bosch Gmbh Elektrische Vorrichtung mit einer Umhüllmasse
DE102015223449A1 (de) * 2015-11-26 2017-06-01 Robert Bosch Gmbh Elektrische Vorrichtung mit einer Umhüllmasse
DE102015223406A1 (de) 2015-11-26 2017-06-01 Robert Bosch Gmbh Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse
CN105489560A (zh) * 2015-11-30 2016-04-13 广东百圳君耀电子有限公司 一种无外壳填充保护型电路元件及其制成工艺
DE102016225654A1 (de) * 2016-12-20 2018-06-21 Robert Bosch Gmbh Leistungsmodul mit einem in Etagen ausgebildeten Gehäuse
DE102016226262A1 (de) 2016-12-28 2018-06-28 Robert Bosch Gmbh Elektronikmodul, Verfahren
DE102017108114B4 (de) 2017-04-13 2025-10-23 Infineon Technologies Ag Chipmodul mit räumlich eingeschränktem thermisch leitfähigen Montagekörper
DE102017207424A1 (de) * 2017-05-03 2018-11-08 Robert Bosch Gmbh Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse
DE102017215298A1 (de) * 2017-09-01 2019-03-07 Robert Bosch Gmbh Verbundwerkstoff und Verfahren zu seiner Herstellung
US20190357386A1 (en) * 2018-05-16 2019-11-21 GM Global Technology Operations LLC Vascular polymeric assembly
DE102018212159A1 (de) 2018-07-20 2020-01-23 Robert Bosch Gmbh Aufbau und Verfahren zum Verbinden einer ersten und einer zweiten Baugruppe durch Verkleben
DE102018214641B4 (de) * 2018-08-29 2022-09-22 Robert Bosch Gmbh Vergussmasse, Verfahren zum elektrischen Isolieren eines elektrischen oder elektronischen Bauteils unter Verwendung der Vergussmasse, elektrisch isoliertes Bauteil, hergestellt über ein solches Verfahren und Verwendung der Vergussmasse
EP3719975A1 (de) * 2019-04-04 2020-10-07 Siemens Aktiengesellschaft Elektrische maschine
DE102019108932B4 (de) * 2019-04-05 2022-04-21 Danfoss Silicon Power Gmbh Halbleitermodul und Verfahren zu seiner Herstellung
EP3731267A1 (en) * 2019-04-25 2020-10-28 Infineon Technologies AG Semiconductor module and method for producing the same
DE102019111367A1 (de) * 2019-05-02 2020-11-05 Danfoss Silicon Power Gmbh Leistungselektronik-Modul mit verbesserter Kühlung
DE102019111366B3 (de) 2019-05-02 2020-05-14 Fachhochschule Kiel Kompaktes Leistungselektronik-Modul mit vergrößerter Kühlfläche
US11145571B2 (en) * 2019-06-04 2021-10-12 Semiconductor Components Industries, Llc Heat transfer for power modules
DE102019117534B4 (de) 2019-06-28 2022-03-03 Infineon Technologies Ag Anorganisches Verkapselungsmittel für eine elektronische Komponente mit Haftvermittler
DE102019132314B4 (de) * 2019-11-28 2022-03-03 Infineon Technologies Ag Package mit Einkapselung unter Kompressionsbelastung
DE102020115085A1 (de) 2020-06-05 2021-12-09 Danfoss Silicon Power Gmbh Leistungselektronik-Modul
EP4214749B1 (en) * 2020-09-17 2026-01-28 Hitachi Energy Ltd Power module and method for producing a power module
WO2022139674A1 (en) * 2020-12-23 2022-06-30 Heraeus Deutschland Gmbh & Co. Kg. Process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconductor packages
EP4053895B1 (en) 2021-03-03 2024-05-15 Ovh Water block assembly having an insulating housing
EP4245737A1 (de) 2022-03-18 2023-09-20 Heraeus Deutschland GmbH & Co. KG Hydraulisch härtbare anorganische zementzusammensetzung
EP4273110A1 (de) 2022-05-02 2023-11-08 Heraeus Deutschland GmbH & Co. KG Hydraulisch härtbare anorganische zementzusammensetzung
WO2024042064A1 (de) * 2022-08-23 2024-02-29 Hahn-Schickard-Gesellschaft Für Angewandte Forschung E. V. Selbstaushärtender beton als neuer werkstoff für mikrosysteme

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514413A1 (de) 1965-03-11 1969-06-12 Siemens Ag Verfahren zum Herstellen von vorzugsweise temperaturbestaendigen Halbleiterbauelementen
US4529755A (en) * 1982-10-23 1985-07-16 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
JPS60226149A (ja) * 1984-04-25 1985-11-11 Nec Corp ヒ−トシンク付セラミツクパツケ−ジ
US5300459A (en) * 1989-12-28 1994-04-05 Sanken Electric Co., Ltd. Method for reducing thermal stress in an encapsulated integrated circuit package
JPH10313134A (ja) * 1997-05-14 1998-11-24 Kubota Corp 熱電モジュールの製造方法
EP0827215A3 (en) 1996-08-27 2000-09-20 Kubota Corporation Thermoelectric modules and thermoelectric elements
US7034660B2 (en) * 1999-02-26 2006-04-25 Sri International Sensor devices for structural health monitoring
JP3797021B2 (ja) * 1999-05-31 2006-07-12 三菱電機株式会社 電力用半導体装置
US7723162B2 (en) 2002-03-22 2010-05-25 White Electronic Designs Corporation Method for producing shock and tamper resistant microelectronic devices
JP4143450B2 (ja) * 2003-03-19 2008-09-03 日本特殊陶業株式会社 温度センサの製造方法
MXPA06014834A (es) 2004-06-15 2007-03-26 Constr Res & Tech Gmbh Proporcion de resistencia a la congelacion y al deshielo en composicioes cementosas.
US7987728B2 (en) * 2006-07-07 2011-08-02 The University Of Houston System Piezoceramic-based smart aggregate for unified performance monitoring of concrete structures
US8617913B2 (en) 2006-08-23 2013-12-31 Rockwell Collins, Inc. Alkali silicate glass based coating and method for applying
US8637980B1 (en) * 2007-12-18 2014-01-28 Rockwell Collins, Inc. Adhesive applications using alkali silicate glass for electronics
DE102008007021A1 (de) * 2008-01-31 2009-08-06 Osram Gesellschaft mit beschränkter Haftung Drossel und Verfahren zum Herstellen einer Drosselkerneinheit für eine Drossel
JP2009252838A (ja) * 2008-04-02 2009-10-29 Mitsubishi Electric Corp 半導体装置
KR101013555B1 (ko) 2008-10-09 2011-02-14 주식회사 하이닉스반도체 반도체 패키지 및 이의 제조 방법
KR20120117978A (ko) * 2009-11-23 2012-10-25 어플라이드 나노스트럭처드 솔루션스, 엘엘씨. 카본 나노튜브-주입된 섬유 재료를 포함하는 세라믹 복합재료 및 이의 제조방법
JP2010245566A (ja) * 2010-07-20 2010-10-28 Tamura Thermal Device Corp 発煙軽減型電子部品
US20130229777A1 (en) 2012-03-01 2013-09-05 Infineon Technologies Ag Chip arrangements and methods for forming a chip arrangement
JP5902543B2 (ja) * 2012-04-20 2016-04-13 三菱電機株式会社 半導体装置及びその製造方法
KR101388815B1 (ko) * 2012-06-29 2014-04-23 삼성전기주식회사 반도체 패키지

Also Published As

Publication number Publication date
KR20160083031A (ko) 2016-07-11
US20160260648A1 (en) 2016-09-08
JP2016535464A (ja) 2016-11-10
EP3066684A1 (de) 2016-09-14
WO2015067441A1 (de) 2015-05-14
CN105706230B (zh) 2020-03-13
HUE043748T2 (hu) 2019-09-30
MX363041B (es) 2019-03-06
TW201535631A (zh) 2015-09-16
US10685894B2 (en) 2020-06-16
KR101931005B1 (ko) 2018-12-19
JP6472458B2 (ja) 2019-02-20
CN105706230A (zh) 2016-06-22
DE102013112267A1 (de) 2015-05-07
EP3066684B1 (de) 2019-04-10

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