MX2016005182A - Modulo semiconductor con una masa de revestimiento de cemento que cubre un componente semiconductor. - Google Patents

Modulo semiconductor con una masa de revestimiento de cemento que cubre un componente semiconductor.

Info

Publication number
MX2016005182A
MX2016005182A MX2016005182A MX2016005182A MX2016005182A MX 2016005182 A MX2016005182 A MX 2016005182A MX 2016005182 A MX2016005182 A MX 2016005182A MX 2016005182 A MX2016005182 A MX 2016005182A MX 2016005182 A MX2016005182 A MX 2016005182A
Authority
MX
Mexico
Prior art keywords
encasing
covers
semiconductor
cement mass
semiconductor module
Prior art date
Application number
MX2016005182A
Other languages
English (en)
Other versions
MX363041B (es
Inventor
Eisele Ronald
Original Assignee
Heraeus Deutschland Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Deutschland Gmbh & Co Kg filed Critical Heraeus Deutschland Gmbh & Co Kg
Publication of MX2016005182A publication Critical patent/MX2016005182A/es
Publication of MX363041B publication Critical patent/MX363041B/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
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    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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    • H01L23/367—Cooling facilitated by shape of device
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Un módulo semiconductor (10) con una masa de revestimiento (30) que cubre un componente semiconductor (20) se caracteriza porque la masa de revestimiento (30) es cemento.
MX2016005182A 2013-11-07 2014-10-14 Modulo semiconductor con una masa de revestimiento de cemento que cubre un componente semiconductor. MX363041B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201310112267 DE102013112267A1 (de) 2013-11-07 2013-11-07 Halbleitermodul mit einer einen Halbleiterbaustein bedeckenden Umhüllungsmasse
PCT/EP2014/072012 WO2015067441A1 (de) 2013-11-07 2014-10-14 Halbleitermodul mit einer einen halbleiterbaustein bedeckenden umhüllungsmasse aus zement

Publications (2)

Publication Number Publication Date
MX2016005182A true MX2016005182A (es) 2016-08-12
MX363041B MX363041B (es) 2019-03-06

Family

ID=51726499

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2016005182A MX363041B (es) 2013-11-07 2014-10-14 Modulo semiconductor con una masa de revestimiento de cemento que cubre un componente semiconductor.

Country Status (10)

Country Link
US (1) US10685894B2 (es)
EP (1) EP3066684B1 (es)
JP (1) JP6472458B2 (es)
KR (1) KR101931005B1 (es)
CN (1) CN105706230B (es)
DE (1) DE102013112267A1 (es)
HU (1) HUE043748T2 (es)
MX (1) MX363041B (es)
TW (1) TW201535631A (es)
WO (1) WO2015067441A1 (es)

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DE102015223406A1 (de) 2015-11-26 2017-06-01 Robert Bosch Gmbh Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse
DE102015223415A1 (de) 2015-11-26 2017-06-01 Robert Bosch Gmbh Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse
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DE102015223467A1 (de) * 2015-11-26 2017-06-01 Robert Bosch Gmbh Elektrische Vorrichtung mit einer Umhüllmasse
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CN105489560A (zh) * 2015-11-30 2016-04-13 广东百圳君耀电子有限公司 一种无外壳填充保护型电路元件及其制成工艺
DE102016225654A1 (de) * 2016-12-20 2018-06-21 Robert Bosch Gmbh Leistungsmodul mit einem in Etagen ausgebildeten Gehäuse
DE102016226262A1 (de) * 2016-12-28 2018-06-28 Robert Bosch Gmbh Elektronikmodul, Verfahren
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DE102017207424A1 (de) * 2017-05-03 2018-11-08 Robert Bosch Gmbh Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse
DE102017215298A1 (de) * 2017-09-01 2019-03-07 Robert Bosch Gmbh Verbundwerkstoff und Verfahren zu seiner Herstellung
US20190357386A1 (en) * 2018-05-16 2019-11-21 GM Global Technology Operations LLC Vascular polymeric assembly
DE102018212159A1 (de) 2018-07-20 2020-01-23 Robert Bosch Gmbh Aufbau und Verfahren zum Verbinden einer ersten und einer zweiten Baugruppe durch Verkleben
DE102018214641B4 (de) * 2018-08-29 2022-09-22 Robert Bosch Gmbh Vergussmasse, Verfahren zum elektrischen Isolieren eines elektrischen oder elektronischen Bauteils unter Verwendung der Vergussmasse, elektrisch isoliertes Bauteil, hergestellt über ein solches Verfahren und Verwendung der Vergussmasse
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EP3066684B1 (de) 2019-04-10
TW201535631A (zh) 2015-09-16
JP2016535464A (ja) 2016-11-10
KR20160083031A (ko) 2016-07-11
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JP6472458B2 (ja) 2019-02-20
CN105706230A (zh) 2016-06-22
DE102013112267A1 (de) 2015-05-07
HUE043748T2 (hu) 2019-09-30
MX363041B (es) 2019-03-06
WO2015067441A1 (de) 2015-05-14
US10685894B2 (en) 2020-06-16
EP3066684A1 (de) 2016-09-14

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