TW201614870A - Semiconductor light emitting device and method for manufacturing the same - Google Patents
Semiconductor light emitting device and method for manufacturing the sameInfo
- Publication number
- TW201614870A TW201614870A TW104106054A TW104106054A TW201614870A TW 201614870 A TW201614870 A TW 201614870A TW 104106054 A TW104106054 A TW 104106054A TW 104106054 A TW104106054 A TW 104106054A TW 201614870 A TW201614870 A TW 201614870A
- Authority
- TW
- Taiwan
- Prior art keywords
- light emitting
- fluorescent material
- emitting device
- semiconductor light
- manufacturing
- Prior art date
Links
Abstract
According to one embodiment, a semiconductor light emitting device includes a light emitting element, a fluorescent material layer, and an inorganic layer. The light emitting element has an asperity surface. The fluorescent material layer is provided on the asperity surface. The fluorescent material layer has a glass member and a fluorescent material dispersed in the glass member. The inorganic layer is provided between the asperity surface and the fluorescent material layer. The inorganic layer is in contact with the asperity surface and the fluorescent material layer, and transmissive to light emitted from the light emitting element.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2014207036 | 2014-10-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201614870A true TW201614870A (en) | 2016-04-16 |
Family
ID=55950080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104106054A TW201614870A (en) | 2014-10-08 | 2015-02-25 | Semiconductor light emitting device and method for manufacturing the same |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6688007B2 (en) |
TW (1) | TW201614870A (en) |
Cited By (1)
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Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3827792B2 (en) * | 1997-01-28 | 2006-09-27 | グローリー工業株式会社 | Authenticity judgment device for paper sheets using a fluorescence sensor |
JP2005294820A (en) * | 2004-03-12 | 2005-10-20 | Showa Denko Kk | Group iii nitride semiconductor light-emitting element, method of forming the element, and lamp and light source using the same |
JP2009289976A (en) * | 2008-05-29 | 2009-12-10 | Nichia Corp | Light emitting device |
JP5395097B2 (en) * | 2009-01-13 | 2014-01-22 | 株式会社小糸製作所 | Light emitting module and lamp unit |
JP2010287687A (en) * | 2009-06-10 | 2010-12-24 | Koito Mfg Co Ltd | Light emitting module, and method of manufacturing the same |
JP5397944B2 (en) * | 2009-11-11 | 2014-01-22 | 日東電工株式会社 | Phosphor-containing composite sheet |
JP5505864B2 (en) * | 2010-03-30 | 2014-05-28 | 日本電気硝子株式会社 | Manufacturing method of semiconductor light emitting device |
JP2011233650A (en) * | 2010-04-26 | 2011-11-17 | Toshiba Corp | Semiconductor light-emitting device |
JP5603813B2 (en) * | 2011-03-15 | 2014-10-08 | 株式会社東芝 | Semiconductor light emitting device and light emitting device |
CN103022274B (en) * | 2011-09-22 | 2016-04-13 | 比亚迪股份有限公司 | A kind of LED chip and manufacture method thereof |
JP5814968B2 (en) * | 2013-03-22 | 2015-11-17 | 株式会社東芝 | Nitride semiconductor light emitting device |
-
2015
- 2015-02-25 TW TW104106054A patent/TW201614870A/en unknown
- 2015-04-07 JP JP2015078346A patent/JP6688007B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI747313B (en) * | 2019-07-10 | 2021-11-21 | 日商日立全球先端科技股份有限公司 | Scintillator for charged particle beam device and charged particle beam device |
Also Published As
Publication number | Publication date |
---|---|
JP2016076685A (en) | 2016-05-12 |
JP6688007B2 (en) | 2020-04-28 |
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