MY193439A - Resin molding apparatus and manufacturing method of resin-molded product - Google Patents

Resin molding apparatus and manufacturing method of resin-molded product

Info

Publication number
MY193439A
MY193439A MYPI2019002978A MYPI2019002978A MY193439A MY 193439 A MY193439 A MY 193439A MY PI2019002978 A MYPI2019002978 A MY PI2019002978A MY PI2019002978 A MYPI2019002978 A MY PI2019002978A MY 193439 A MY193439 A MY 193439A
Authority
MY
Malaysia
Prior art keywords
die
resin
clamping mechanism
molding
molding apparatus
Prior art date
Application number
MYPI2019002978A
Other languages
English (en)
Inventor
Ogawa Keisuke
OGAWA Fuyuhiko
TAKUWA Naohisa
SHIMIZU Hisakatsu
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY193439A publication Critical patent/MY193439A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3607—Moulds for making articles of definite length, i.e. discrete articles with sealing means or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/585—Measuring, controlling or regulating detecting defects, e.g. foreign matter between the moulds, inaccurate position, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
MYPI2019002978A 2018-06-21 2019-05-27 Resin molding apparatus and manufacturing method of resin-molded product MY193439A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018117803A JP7084226B2 (ja) 2018-06-21 2018-06-21 樹脂成形装置および樹脂成形品の製造方法

Publications (1)

Publication Number Publication Date
MY193439A true MY193439A (en) 2022-10-13

Family

ID=68968477

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019002978A MY193439A (en) 2018-06-21 2019-05-27 Resin molding apparatus and manufacturing method of resin-molded product

Country Status (5)

Country Link
JP (1) JP7084226B2 (zh)
KR (1) KR102220010B1 (zh)
CN (1) CN110625871B (zh)
MY (1) MY193439A (zh)
TW (1) TWI725451B (zh)

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB724103A (en) * 1952-05-29 1955-02-16 Plastic Products Ltd Improvements in or relating to injection moulding apparatus
JPH0716780B2 (ja) * 1985-05-27 1995-03-01 東芝機械株式会社 金型間異物検出機能を有する型締力自動調整装置
KR930005422B1 (ko) * 1988-07-05 1993-06-21 신인준 환편기용 루우프 편침
JPH0252706A (ja) * 1988-08-17 1990-02-22 Mitsubishi Electric Corp 金型間異物検出装置
JP2760575B2 (ja) * 1989-06-14 1998-06-04 住友重機械工業株式会社 金型の保護方法
JPH0326515A (ja) * 1989-06-26 1991-02-05 Toshiba Corp 樹脂成形装置の金型保護装置
JPH0516202A (ja) * 1991-07-15 1993-01-26 Okuma Mach Works Ltd 射出成形機の金型保護装置
JPH0818356B2 (ja) * 1991-12-03 1996-02-28 株式会社日本製鋼所 射出開始時期制御方法
JPH06143379A (ja) * 1992-10-30 1994-05-24 Toowa Kk 樹脂成形機における異物検出方法
JPH06151489A (ja) 1992-11-05 1994-05-31 Toshiba Corp 半導体樹脂封止装置
US5800750A (en) * 1996-04-19 1998-09-01 Industrial Technology Research Institute Method for mold protection of crank-type clamping unit
JP4217572B2 (ja) * 2003-09-18 2009-02-04 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド装置
JP4177800B2 (ja) * 2003-12-25 2008-11-05 日精樹脂工業株式会社 型締装置の金型保護方法
JP4146383B2 (ja) * 2004-03-31 2008-09-10 日精樹脂工業株式会社 型締装置の金型保護方法
JP5154888B2 (ja) 2007-10-19 2013-02-27 大豊工業株式会社 バルブアセンブリ
JP4568350B2 (ja) * 2008-05-26 2010-10-27 ファナック株式会社 射出成形機の異常検出装置
JP5723676B2 (ja) * 2011-05-30 2015-05-27 東芝機械株式会社 型締装置、成形機、型締装置の制御方法
JP6132353B2 (ja) * 2011-07-26 2017-05-24 東洋機械金属株式会社 射出成形機
WO2014076752A1 (ja) * 2012-11-13 2014-05-22 東洋機械金属株式会社 射出成形機
JP6400314B2 (ja) * 2014-03-26 2018-10-03 住友重機械工業株式会社 射出成形機
JP7016780B2 (ja) * 2018-09-26 2022-02-07 株式会社三共 遊技機
CN111941782B (zh) * 2020-07-24 2022-06-28 深圳市汇川技术股份有限公司 模具保护方法、系统及可读存储介质

Also Published As

Publication number Publication date
JP2019217714A (ja) 2019-12-26
JP7084226B2 (ja) 2022-06-14
CN110625871B (zh) 2022-05-10
KR102220010B1 (ko) 2021-02-25
KR20190143817A (ko) 2019-12-31
TW202000423A (zh) 2020-01-01
TWI725451B (zh) 2021-04-21
CN110625871A (zh) 2019-12-31

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