MY193439A - Resin molding apparatus and manufacturing method of resin-molded product - Google Patents

Resin molding apparatus and manufacturing method of resin-molded product

Info

Publication number
MY193439A
MY193439A MYPI2019002978A MYPI2019002978A MY193439A MY 193439 A MY193439 A MY 193439A MY PI2019002978 A MYPI2019002978 A MY PI2019002978A MY PI2019002978 A MYPI2019002978 A MY PI2019002978A MY 193439 A MY193439 A MY 193439A
Authority
MY
Malaysia
Prior art keywords
die
resin
clamping mechanism
molding
molding apparatus
Prior art date
Application number
MYPI2019002978A
Inventor
Ogawa Keisuke
OGAWA Fuyuhiko
TAKUWA Naohisa
SHIMIZU Hisakatsu
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY193439A publication Critical patent/MY193439A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3607—Moulds for making articles of definite length, i.e. discrete articles with sealing means or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/585—Measuring, controlling or regulating detecting defects, e.g. foreign matter between the moulds, inaccurate position, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

A resin molding apparatus (1) includes: a die clamping mechanism (23) configured to vary a distance between a first die and a second die (11, 18); and a controller (100) configured to control the die clamping mechanism. The controller is configured to perform: a process (S116) of measuring a clamping force which is a pressure applied to a molding die by the die clamping mechanism, while decreasing the distance between the first die and the second die in a state where an object to be molded is located in the molding die; a process (S118, S120, S122) of obtaining a first position of the die clamping mechanism at which the measured clamping force exceeds a predetermined first set value; a process (S130) of setting, as a foreign object detection position, a second position obtained by correcting the first position with a correction value; and a process (P1) of detecting a foreign object in the molding die in a molding operation, based on the clamping force measured at the foreign object detection position. Figure 8
MYPI2019002978A 2018-06-21 2019-05-27 Resin molding apparatus and manufacturing method of resin-molded product MY193439A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018117803A JP7084226B2 (en) 2018-06-21 2018-06-21 Resin molding equipment and manufacturing method of resin molded products

Publications (1)

Publication Number Publication Date
MY193439A true MY193439A (en) 2022-10-13

Family

ID=68968477

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019002978A MY193439A (en) 2018-06-21 2019-05-27 Resin molding apparatus and manufacturing method of resin-molded product

Country Status (5)

Country Link
JP (1) JP7084226B2 (en)
KR (1) KR102220010B1 (en)
CN (1) CN110625871B (en)
MY (1) MY193439A (en)
TW (1) TWI725451B (en)

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB724103A (en) * 1952-05-29 1955-02-16 Plastic Products Ltd Improvements in or relating to injection moulding apparatus
JPH0716780B2 (en) * 1985-05-27 1995-03-01 東芝機械株式会社 Automatic mold clamping force adjuster with foreign material detection function between molds
KR930005422B1 (en) * 1988-07-05 1993-06-21 신인준 Loop knitted needle for circular knitting machine
JPH0252706A (en) * 1988-08-17 1990-02-22 Mitsubishi Electric Corp Device for sensing foreign matter between molds
JP2760575B2 (en) * 1989-06-14 1998-06-04 住友重機械工業株式会社 Mold protection method
JPH0326515A (en) * 1989-06-26 1991-02-05 Toshiba Corp Protective device for mold of resin molding device
JPH0516202A (en) * 1991-07-15 1993-01-26 Okuma Mach Works Ltd Protective device of metal mold in injection molding machine
JPH0818356B2 (en) * 1991-12-03 1996-02-28 株式会社日本製鋼所 Injection start timing control method
JPH06143379A (en) * 1992-10-30 1994-05-24 Toowa Kk Foreign matter detecting method in resin molding machine
JPH06151489A (en) 1992-11-05 1994-05-31 Toshiba Corp Device for sealing semiconductor with resin
US5800750A (en) * 1996-04-19 1998-09-01 Industrial Technology Research Institute Method for mold protection of crank-type clamping unit
JP4217572B2 (en) * 2003-09-18 2009-02-04 アピックヤマダ株式会社 Resin molding method and resin molding apparatus
JP4177800B2 (en) * 2003-12-25 2008-11-05 日精樹脂工業株式会社 Mold protection method for mold clamping device
JP4146383B2 (en) * 2004-03-31 2008-09-10 日精樹脂工業株式会社 Mold protection method for mold clamping device
JP5154888B2 (en) 2007-10-19 2013-02-27 大豊工業株式会社 Valve assembly
JP4568350B2 (en) * 2008-05-26 2010-10-27 ファナック株式会社 Abnormality detection device for injection molding machine
JP5723676B2 (en) * 2011-05-30 2015-05-27 東芝機械株式会社 Mold clamping device, molding machine, and control method of mold clamping device
EP2737993B1 (en) * 2011-07-26 2018-02-28 Toyo Machinery & Metal Co., Ltd. Injection molding machine
JP6042451B2 (en) * 2012-11-13 2016-12-14 東洋機械金属株式会社 Abnormality monitoring method for injection molding machines
JP6400314B2 (en) * 2014-03-26 2018-10-03 住友重機械工業株式会社 Injection molding machine
JP7016780B2 (en) * 2018-09-26 2022-02-07 株式会社三共 Pachinko machine
CN111941782B (en) * 2020-07-24 2022-06-28 深圳市汇川技术股份有限公司 Mold protection method, system and readable storage medium

Also Published As

Publication number Publication date
KR20190143817A (en) 2019-12-31
JP7084226B2 (en) 2022-06-14
CN110625871A (en) 2019-12-31
CN110625871B (en) 2022-05-10
TW202000423A (en) 2020-01-01
KR102220010B1 (en) 2021-02-25
JP2019217714A (en) 2019-12-26
TWI725451B (en) 2021-04-21

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