MY186932A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
MY186932A
MY186932A MYUI2018700667A MYUI2018700667A MY186932A MY 186932 A MY186932 A MY 186932A MY UI2018700667 A MYUI2018700667 A MY UI2018700667A MY UI2018700667 A MYUI2018700667 A MY UI2018700667A MY 186932 A MY186932 A MY 186932A
Authority
MY
Malaysia
Prior art keywords
photosensitive resin
resin composition
copper
pattern
laminated
Prior art date
Application number
MYUI2018700667A
Other languages
English (en)
Inventor
Yuri Yamada
Kazuya Naito
Junya Kosaka
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY186932A publication Critical patent/MY186932A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C08F222/1063—Esters of polycondensation macromers of alcohol terminated polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F285/00—Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
MYUI2018700667A 2015-09-11 2016-09-07 Photosensitive resin composition MY186932A (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2015179888 2015-09-11
JP2015195984 2015-10-01
JP2015199434 2015-10-07
JP2015218912 2015-11-06
JP2015257519 2015-12-28
PCT/JP2016/076342 WO2017043544A1 (ja) 2015-09-11 2016-09-07 感光性樹脂組成物

Publications (1)

Publication Number Publication Date
MY186932A true MY186932A (en) 2021-08-26

Family

ID=58239851

Family Applications (1)

Application Number Title Priority Date Filing Date
MYUI2018700667A MY186932A (en) 2015-09-11 2016-09-07 Photosensitive resin composition

Country Status (6)

Country Link
JP (3) JP6514346B2 (ja)
KR (3) KR102443749B1 (ja)
CN (2) CN108027559B (ja)
MY (1) MY186932A (ja)
TW (3) TWI691793B (ja)
WO (1) WO2017043544A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6809873B2 (ja) * 2015-12-28 2021-01-06 旭化成株式会社 積層体
JP2019133143A (ja) * 2018-01-30 2019-08-08 旭化成株式会社 感光性樹脂積層体及びレジストパターンの製造方法
CN108205240B (zh) * 2018-02-01 2021-05-07 浙江福斯特新材料研究院有限公司 一种高光敏性和优异掩孔性能的感光性树脂组合物及应用
JP7169351B2 (ja) * 2018-06-22 2022-11-10 旭化成株式会社 感光性樹脂組成物およびレジストパターンの形成方法
JP7422664B2 (ja) * 2018-08-09 2024-01-26 旭化成株式会社 感光性樹脂組成物及びレジストパターンの形成方法
JP2020076945A (ja) * 2018-09-21 2020-05-21 旭化成株式会社 感光性樹脂組成物
JP2022000683A (ja) * 2019-12-13 2022-01-04 旭化成株式会社 感光性樹脂組成物、感光性樹脂組成物を用いた転写フィルム
WO2021220980A1 (ja) * 2020-04-28 2021-11-04 富士フイルム株式会社 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法及びタッチパネルの製造方法
JP2020190735A (ja) * 2020-07-14 2020-11-26 旭化成株式会社 感光性樹脂組成物、感光性樹脂積層体、レジストパターン形成方法及び導体パターン製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4646759B2 (ja) * 2005-09-20 2011-03-09 旭化成イーマテリアルズ株式会社 パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2007226158A (ja) * 2006-02-27 2007-09-06 Asahi Kasei Electronics Co Ltd ドライフィルムレジスト
CN101568883B (zh) * 2006-12-27 2012-01-18 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法以及印刷电路板的制造方法
WO2009022724A1 (ja) 2007-08-15 2009-02-19 Asahi Kasei E-Materials Corporation 感光性樹脂組成物及びその積層体
JP2011233769A (ja) 2010-04-28 2011-11-17 Mec Co Ltd 銅配線パターンの形成方法
KR101444044B1 (ko) * 2010-12-16 2014-09-23 히타치가세이가부시끼가이샤 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
MY179988A (en) * 2010-12-24 2020-11-19 Asahi Kasei E Mat Corporation Photosensitive resin composition
JP2012226254A (ja) 2011-04-22 2012-11-15 Asahi Kasei E-Materials Corp ドライフィルムレジストロール
JP6064480B2 (ja) 2011-10-26 2017-01-25 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP6113976B2 (ja) 2012-08-29 2017-04-12 旭化成株式会社 感光性樹脂組成物
JP2014182305A (ja) * 2013-03-19 2014-09-29 Hitachi Chemical Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターン付き基板の製造方法及びプリント配線板の製造方法
JP5673763B2 (ja) * 2013-09-17 2015-02-18 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP6207943B2 (ja) * 2013-09-19 2017-10-04 旭化成株式会社 感光性樹脂組成物及び感光性樹脂積層体
JP6486672B2 (ja) * 2013-12-20 2019-03-20 旭化成株式会社 感光性エレメント、及びその製造方法
WO2015098870A1 (ja) 2013-12-27 2015-07-02 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2015152854A (ja) * 2014-02-18 2015-08-24 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法
US10338468B2 (en) 2014-09-24 2019-07-02 Asahi Kasei Kabushiki Kaisha Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device

Also Published As

Publication number Publication date
CN108027559A (zh) 2018-05-11
TWI691793B (zh) 2020-04-21
JP2019105841A (ja) 2019-06-27
JP7340581B2 (ja) 2023-09-07
TW201712433A (zh) 2017-04-01
TWI684067B (zh) 2020-02-01
JP6514346B2 (ja) 2019-05-15
JP2022027767A (ja) 2022-02-14
JPWO2017043544A1 (ja) 2018-03-15
TW201944171A (zh) 2019-11-16
KR20190105142A (ko) 2019-09-11
WO2017043544A1 (ja) 2017-03-16
JP7026606B2 (ja) 2022-02-28
TWI709815B (zh) 2020-11-11
KR20180042842A (ko) 2018-04-26
TW201843527A (zh) 2018-12-16
KR102443749B1 (ko) 2022-09-15
CN114296315A (zh) 2022-04-08
KR20220127382A (ko) 2022-09-19
CN108027559B (zh) 2021-10-26
KR102600211B1 (ko) 2023-11-08

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