MY165894A - Epoxy resin molding material for encapsulation and electronic component device including element encapsulated with same - Google Patents

Epoxy resin molding material for encapsulation and electronic component device including element encapsulated with same

Info

Publication number
MY165894A
MY165894A MYPI2013700814A MYPI2013700814A MY165894A MY 165894 A MY165894 A MY 165894A MY PI2013700814 A MYPI2013700814 A MY PI2013700814A MY PI2013700814 A MYPI2013700814 A MY PI2013700814A MY 165894 A MY165894 A MY 165894A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
encapsulation
molding material
resin molding
electronic component
Prior art date
Application number
MYPI2013700814A
Other languages
English (en)
Inventor
Kenji Tanaka
Mitsuyoshi Hamada
Fumio Furusawa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of MY165894A publication Critical patent/MY165894A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
MYPI2013700814A 2010-11-26 2011-11-10 Epoxy resin molding material for encapsulation and electronic component device including element encapsulated with same MY165894A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010263558 2010-11-26
JP2011240690A JP5906673B2 (ja) 2010-11-26 2011-11-01 封止用エポキシ樹脂成形材料、及びこの成形材料で封止した素子を備えた電子部品装置

Publications (1)

Publication Number Publication Date
MY165894A true MY165894A (en) 2018-05-18

Family

ID=46145750

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013700814A MY165894A (en) 2010-11-26 2011-11-10 Epoxy resin molding material for encapsulation and electronic component device including element encapsulated with same

Country Status (5)

Country Link
JP (1) JP5906673B2 (ja)
CN (1) CN103221452B (ja)
MY (1) MY165894A (ja)
TW (1) TWI568788B (ja)
WO (1) WO2012070402A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6291742B2 (ja) * 2013-08-12 2018-03-14 日立化成株式会社 樹脂組成物、めっきプロセス用接着補助層、支持体付きめっきプロセス用接着補助層、配線板用積層板、配線板用積層板の製造方法、多層配線板、及び多層配線板の製造方法
CN106553350A (zh) * 2015-09-30 2017-04-05 明光市奇美橡塑有限公司 一种高强度油封的生产方法
CN105419232A (zh) * 2015-12-03 2016-03-23 佛山市顺德区创格电子实业有限公司 一种电容器环氧树脂组合物
JP6916997B2 (ja) * 2016-03-17 2021-08-11 富士電機株式会社 半導体装置
JP7343978B2 (ja) * 2016-04-28 2023-09-13 株式会社レゾナック エポキシ樹脂組成物及び電子部品装置
JP6520872B2 (ja) * 2016-09-01 2019-05-29 信越化学工業株式会社 半導体封止用熱硬化性樹脂組成物
MY177304A (en) * 2017-03-31 2020-09-11 Hitachi Chemical Co Ltd Protective material for electronic circuit, sealing material for protective material for electronic circuit, sealing method, and method for manufacturing semiconductor device
JP7400473B2 (ja) * 2017-12-28 2023-12-19 株式会社レゾナック ボールグリッドアレイパッケージ封止用エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置
WO2021020081A1 (ja) * 2019-07-26 2021-02-04 富士フイルム株式会社 熱伝導材料形成用組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス
CN113201302B (zh) * 2021-05-06 2023-03-03 黑龙江省科学院石油化学研究院 一种双氨基双邻苯二甲腈改性环氧树脂胶粘剂及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0780435A1 (en) * 1995-12-21 1997-06-25 National Starch and Chemical Investment Holding Corporation Flexible epoxy adhesives with low bleeding tendency
JPH09302070A (ja) * 1996-05-20 1997-11-25 Sumitomo Metal Ind Ltd 熱硬化性エポキシ樹脂組成物とその用途および硬化剤
JPH10130189A (ja) * 1996-10-25 1998-05-19 Sumitomo Chem Co Ltd 多価フェノール化合物、およびそれを用いた樹脂組成物
JP4572522B2 (ja) * 2003-07-31 2010-11-04 Ｄｉｃ株式会社 エポキシ樹脂組成物、エポキシ樹脂硬化物、及びノボラック樹脂
JP5218785B2 (ja) * 2008-01-30 2013-06-26 日産化学工業株式会社 硫黄原子を含有するレジスト下層膜形成用組成物及びレジストパターンの形成方法

Also Published As

Publication number Publication date
JP2012126891A (ja) 2012-07-05
CN103221452A (zh) 2013-07-24
TW201229124A (en) 2012-07-16
TWI568788B (zh) 2017-02-01
CN103221452B (zh) 2016-06-22
WO2012070402A1 (ja) 2012-05-31
JP5906673B2 (ja) 2016-04-20

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