MY198096A - Epoxy resin composition and electronic component device - Google Patents

Epoxy resin composition and electronic component device

Info

Publication number
MY198096A
MY198096A MYPI2020001352A MYPI2020001352A MY198096A MY 198096 A MY198096 A MY 198096A MY PI2020001352 A MYPI2020001352 A MY PI2020001352A MY PI2020001352 A MYPI2020001352 A MY PI2020001352A MY 198096 A MY198096 A MY 198096A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
resin composition
electronic component
component device
bound
Prior art date
Application number
MYPI2020001352A
Inventor
Mitsuaki Fusumada
Yasunori Kawabata
Kenichi Yamanaka
Shizuka Shiba
Dongchul Kang
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of MY198096A publication Critical patent/MY198096A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)

Abstract

An epoxy resin composition includes: an epoxy resin; a curing agent; an inorganic filler; and a silane compound having a structure in which a chain hydrocarbon group having 6 or more carbon atoms is bound to a silicon atom.
MYPI2020001352A 2017-09-15 2018-08-31 Epoxy resin composition and electronic component device MY198096A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017178300 2017-09-15
JP2017178299 2017-09-15
PCT/JP2018/032497 WO2019054217A1 (en) 2017-09-15 2018-08-31 Epoxy resin composition and electronic component device

Publications (1)

Publication Number Publication Date
MY198096A true MY198096A (en) 2023-07-31

Family

ID=65722750

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020001352A MY198096A (en) 2017-09-15 2018-08-31 Epoxy resin composition and electronic component device

Country Status (4)

Country Link
JP (2) JP7375541B2 (en)
CN (2) CN111094450A (en)
MY (1) MY198096A (en)
WO (1) WO2019054217A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020063343A (en) * 2018-10-16 2020-04-23 日東シンコー株式会社 Resin composition
CN116134084A (en) * 2020-09-03 2023-05-16 株式会社力森诺科 Composite, molded article, and cured product of composite

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004292591A (en) 2003-03-26 2004-10-21 Matsushita Electric Works Ltd Resin composition for optical semiconductor and optical semiconductor device
KR101090654B1 (en) * 2006-10-02 2011-12-07 히다치 가세고교 가부시끼가이샤 Epoxy resin molding material for sealing and electronic component device
JP5601202B2 (en) * 2009-01-23 2014-10-08 味の素株式会社 Resin composition
JP5520183B2 (en) * 2010-09-30 2014-06-11 積水化学工業株式会社 Resin composition, resin sheet and laminated structure
CN103517948A (en) * 2011-05-13 2014-01-15 日立化成株式会社 Epoxy resin molding material for encapsulation and electronic component device
JP6183061B2 (en) * 2013-08-27 2017-08-23 日立化成株式会社 Epoxy resin composition for semiconductor encapsulation and resin-encapsulated semiconductor device using the same
JP6675155B2 (en) 2015-05-20 2020-04-01 京セラ株式会社 Die attach paste for semiconductor and semiconductor device
JP6672630B2 (en) 2015-08-07 2020-03-25 味の素株式会社 Resin composition
JP7167441B2 (en) 2016-05-06 2022-11-09 Dic株式会社 Resin composition, molding, laminate and adhesive

Also Published As

Publication number Publication date
WO2019054217A1 (en) 2019-03-21
JP2024012392A (en) 2024-01-30
JPWO2019054217A1 (en) 2020-10-29
CN116751438A (en) 2023-09-15
JP7375541B2 (en) 2023-11-08
CN111094450A (en) 2020-05-01
TW201920450A (en) 2019-06-01

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