SG10201710403QA - Resin sheet - Google Patents
Resin sheetInfo
- Publication number
- SG10201710403QA SG10201710403QA SG10201710403QA SG10201710403QA SG10201710403QA SG 10201710403Q A SG10201710403Q A SG 10201710403QA SG 10201710403Q A SG10201710403Q A SG 10201710403QA SG 10201710403Q A SG10201710403Q A SG 10201710403QA SG 10201710403Q A SG10201710403Q A SG 10201710403QA
- Authority
- SG
- Singapore
- Prior art keywords
- resin
- weight
- outermost layer
- resin sheet
- thermoplastic resin
- Prior art date
Links
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Materials Engineering (AREA)
Abstract
OF THE DISCLOSURE RESIN SHEET Provided is a resin sheet which can suppress a variation in the amount of a resin entering into a hollow part between an electronic device and an adherend for every package. The resin sheet includes an outermost layer and an innermost layer. The outermost layer contains an inorganic filler and a thermoplastic resin. A content of the inorganic filler is % by weight or more with respect to the whole of the outermost layer. A content of the thermoplastic resin is 15% by weight or less with respect to all of resin components of the outermost layer. The innermost layer contains a functional group-containing thermoplastic resin having a weight-average molecular weight of 800 ,000 or more. A content of the functional group-containing thermoplastic resin is 90% by weight or more with respect to all of resin components of the innermost layer. FIG. 1 53
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016255882A JP6933463B2 (en) | 2016-12-28 | 2016-12-28 | Resin sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201710403QA true SG10201710403QA (en) | 2018-07-30 |
Family
ID=62722109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201710403QA SG10201710403QA (en) | 2016-12-28 | 2017-12-14 | Resin sheet |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6933463B2 (en) |
| CN (1) | CN108250679A (en) |
| SG (1) | SG10201710403QA (en) |
| TW (1) | TW201834865A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7343989B2 (en) * | 2019-03-19 | 2023-09-13 | 日東電工株式会社 | Sealing sheet |
| JPWO2021010206A1 (en) * | 2019-07-12 | 2021-01-21 | ||
| JP7494032B2 (en) | 2019-07-12 | 2024-06-03 | 日東電工株式会社 | Sealing resin sheet, sealing multilayer resin sheet and electronic element package |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4383768B2 (en) * | 2003-04-23 | 2009-12-16 | スリーエム イノベイティブ プロパティズ カンパニー | Film adhesive for sealing, film laminate for sealing, and sealing method |
| JP4682796B2 (en) * | 2005-04-19 | 2011-05-11 | 日立化成工業株式会社 | Sealing sheet |
| JP5101931B2 (en) * | 2007-06-13 | 2012-12-19 | 日東電工株式会社 | Thermosetting adhesive sheet |
| JP2009141020A (en) * | 2007-12-04 | 2009-06-25 | Furukawa Electric Co Ltd:The | Electronic component sealing sheet |
| JP5802400B2 (en) * | 2011-02-14 | 2015-10-28 | 日東電工株式会社 | Resin sheet for sealing, semiconductor device using the same, and method for manufacturing the semiconductor device |
| JP5735029B2 (en) * | 2013-03-28 | 2015-06-17 | 日東電工株式会社 | Resin sheet for sealing electronic device and method for manufacturing electronic device package |
| JP6379051B2 (en) * | 2015-01-23 | 2018-08-22 | 日東電工株式会社 | Hollow electronic device sealing sheet |
-
2016
- 2016-12-28 JP JP2016255882A patent/JP6933463B2/en active Active
-
2017
- 2017-11-29 CN CN201711232808.2A patent/CN108250679A/en active Pending
- 2017-12-14 SG SG10201710403QA patent/SG10201710403QA/en unknown
- 2017-12-18 TW TW106144360A patent/TW201834865A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018103584A (en) | 2018-07-05 |
| TW201834865A (en) | 2018-10-01 |
| JP6933463B2 (en) | 2021-09-08 |
| CN108250679A (en) | 2018-07-06 |
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