TW201834865A - Resin sheet - Google Patents

Abstract

Provided is a resin sheet which can suppress a variation in the amount of a resin entering into a hollow part between an electronic device and an adherend for every package. The resin sheet includes an outermost layer and an innermost layer. The outermost layer contains an inorganic filler and a thermoplastic resin. A content of the inorganic filler is 85% by weight or more with respect to the whole of the outermost layer. A content of the thermoplastic resin is 15% by weight or less with respect to all of resin components of the outermost layer. The innermost layer contains a functional group-containing thermoplastic resin having a weight-average molecular weight of 800,000 or more. A content of the functional group-containing thermoplastic resin is 90% by weight or more with respect to all of resin components of the innermost layer.

Description

Resin sheet

[0001] The present invention relates to a resin sheet.

[0002] Conventionally, when a hollow electronic device having a hollow structure between an electronic device and a substrate is resin-sealed to produce a hollow electronic device package, a sheet-shaped sealing resin is sometimes used as the sealing resin (for example, refer to a patent) Literature 1). [0003] As a method for manufacturing the package, a sheet-shaped sealing resin is disposed on one or more electronic devices disposed on an adhesive, and then the electronic device is brought closer to the sheet-shaped sealing resin. A method in which an electronic device is pressed into a sheet-like sealing resin, and then the sheet-like sealing resin is thermally cured. [0004] In the case where the above method is adopted, a part of the sealing resin enters the hollow portion between the electronic device and the adhesive. However, there is a problem that the deviation of the entering amount is large in each package. [0005] Patent Document 2 discloses a sealing epoxy resin composition sheet composed of two layers of A layer and B layer. Patent Document 2 describes that a layer A is faced down and a layer B is faced up to be placed on a hollow type device and sealed. [Prior Art Literature] [Patent Literature] [0006] [Patent Literature 1] Japanese Patent Laid-Open No. 2006-19714 [Patent Literature 2] Japanese Patent Laid-Open No. 2011-219726

[Problems to be Solved by the Invention] 000 [0007] However, the layer A of Patent Document 2 uses an epoxy resin in a semi-hardened state, and the epoxy resin with a low molecular weight flows in the curing reaction before curing, so stable hollow cannot be ensured Tightness. [0008] The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a resin sheet that can suppress variations in the amount of resin entering a hollow portion between an electronic device and an adherend in each package. [Means to Solve the Problem] [0009] In order to achieve the above-mentioned object, the present inventors first conducted in-depth research on the reason why the amount of resin entering the hollow portion varies in each package. As a result, it was found that, in the case where the above-mentioned method is adopted, after the electronic device is embedded in the sealing resin, at the time of thermal curing, a part of the sealing resin becomes low viscosity due to heat and flows into the hollow portion. After that, As the heat hardens, the resin becomes highly viscous and the entry of the resin stops. In addition, it was found that the amount of resin flow during heat curing varies greatly from package to package, making it difficult to control. [0010] The inventors of the present application have found that the above-mentioned problems can be solved by employing the following configuration, and the present invention has been completed. [0011] That is, the resin sheet of the present invention is characterized by having an outermost layer and an innermost layer. The outermost layer contains an inorganic filler and a thermoplastic resin. The content of the inorganic filler is 85% by weight relative to the entire outermost layer. In the above, the content of the thermoplastic resin is 15% by weight or less based on the entire resin component of the outermost layer, the innermost layer contains a functional group-containing thermoplastic resin having a weight average molecular weight of 800,000 or more, the functional group-containing heat The content of the plastic resin is 90% by weight or more based on the entire resin component of the innermost layer. [0012] The resin sheet is laminated on the electronic device so that the innermost layer is in contact with the electronic device, and then the electronic device is embedded and used. According to the aforementioned configuration, the innermost layer contains a thermoplastic resin containing a functional group in a proportion of 90% by weight or more with respect to the entire resin component of the innermost layer. Since there are many thermoplastic resin components, when the electronic device is embedded, the resin can be allowed to enter the hollow portion between the electronic device and the adhesive. In addition, since the above-mentioned functional group-containing thermoplastic resin has a functional group, cross-linking occurs from the time when the electronic device is embedded to the end of the thermal curing. In addition, since the weight-average molecular weight of the functional group-containing thermoplastic resin is 800,000 or more, it does not easily flow even when heated. Therefore, it is possible to reduce the amount of resin entering (moving amount) in the hollow portion between the electronic device and the adherend. Here, the innermost layer contains a functional group-containing acrylic resin in an amount of 90% by weight or more relative to the entire resin component of the innermost layer in order to achieve stable hollow sealing properties. Low coefficient of elasticity. Therefore, once it is stuck to the dicing tape during cutting, it becomes difficult to peel off from the dicing tape after cutting. In addition, acrylic resin is easy to follow the wafer during molding due to its viscoelasticity, but it does not flow. Therefore, the depression between the wafer and the wafer becomes larger, and the shape when the wafer is singulated becomes an end depression. shape. Therefore, in the present invention, the outermost layer is provided. The outermost layer contains an inorganic filler in a proportion of 85% by weight or more based on the entire outermost layer. In addition, in the outermost layer, the content of the thermoplastic resin is 15% by weight or less based on the entire resin component of the outermost layer, and a large amount of a highly fluid epoxy resin component is included. As a result, the coefficient of elasticity after hardening becomes high, and the peelability from a dicing tape becomes favorable. In addition, since the outermost layer has high fluidity until it is hardened, the resin flows. As a result, the depression of the top surface, that is, the depression between the wafer and the wafer can be suppressed. [0013] In the above configuration, the functional group-containing thermoplastic resin is preferably a glycidyl group-containing acrylic resin. [0014] If the functional group-containing thermoplastic resin is a glycidyl group-containing acrylic resin, the flow of the resin under the wafer from the time when the electronic device is embedded to the end of the thermal curing can be further reduced. [0015] In the aforementioned configuration, the innermost layer contains a phenol resin as a hardening component, and the content of the phenol resin is preferably in a range of 0.8 to 2.0 relative to the equivalent of the functional group-containing thermoplastic resin. Inside. [0016] If the content ratio of the phenol resin contained in the innermost layer to the functional group-containing thermoplastic resin is within a range of 0.8 to 2.0, it is suitable for the functional resin-containing thermoplastic resin. Functional group reaction. As a result, it is possible to further reduce the flow of the resin under the wafer during the period from the embedment of the electronic device to the end of the thermal curing. [0017] In the above configuration, when measuring the glass transition temperature Tg before the entire resin sheet is cured, it is preferable to have at least one glass transition temperature Tg below 0 ° C. [0018] If at least one glass transition temperature Tg exists below 0 ° C, it can be said that an acrylic resin is contained. If an acrylic resin is contained, the resin can be more appropriately inserted into the hollow portion between the electronic device and the adhesive when the electronic device is embedded. [0019] In the aforementioned configuration, the innermost layer preferably does not include an inorganic filler or an inorganic filler in an amount of 50% by weight or less based on the entirety of the innermost layer. [0020] When the content of the inorganic filler in the innermost layer is 50% by weight or less with respect to the entire innermost layer, the followability to the wafer is good, and stable hollow sealing properties can be ensured. If it is 50% by weight or more, even if the molding temperature or pressure is increased, the wafer will not be followed, and the resin between the wafer and the wafer will not enter sufficiently. There is a risk that the side of the package will become empty during dicing. bad.

[Best Mode for Carrying Out the Invention] [0022] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to these embodiments. [0023] (Resin Sheet) FIG. 1 is a schematic cross-sectional view of a resin sheet (resin sheet) for sealing an electronic device according to this embodiment. As shown in FIG. 1, a resin sheet 11 for sealing electronic devices (hereinafter also referred to as “resin sheet 11”) is typically laminated on a spacer 10 such as a polyethylene terephthalate (PET) film. Status to provide. In order to facilitate the peeling of the resin sheet 11, the spacer 10 may be subjected to a release treatment. [0024] In this embodiment, a case where a spacer is laminated only on one side of the resin sheet will be described. However, the present invention is not limited to this example, and the interval may be laminated on both sides of the resin sheet. Pieces. In this case, the spacer may be peeled and used immediately before use. In the present invention, the resin sheet may be provided as a monomer of the resin sheet without being laminated on the spacer. In addition, other layers may be laminated on the resin sheet within a range not departing from the intention of the present invention. [0025] The resin sheet 11 has an outermost layer 11a and an innermost layer 11b laminated on the outermost layer 11a. [0026] In the present embodiment, a case where the resin sheet has a two-layer structure of an outermost layer and an innermost layer has been described. However, the present invention is not limited to this example. The resin sheet of the present invention only needs to expose the outermost layer on one side and the innermost layer on the other side, and there may be other layers between the outermost layer and the innermost layer. [0027] (Outermost Layer) The outermost layer 11a contains an inorganic filler and a thermoplastic resin. Content of the said inorganic filler is 85 weight% or more with respect to the whole outermost layer 11a, Preferably it is 87 weight% or more, More preferably, it is 89 weight% or more. In addition, the more the content of the inorganic filler is, the better, but from the viewpoint of sheet formability, it is, for example, 93% by weight or less and 90% by weight or less. Content of the said thermoplastic resin is 15 weight% or less with respect to the whole resin component of the outermost layer 11a, Preferably it is 12 weight% or less, More preferably, it is 8 weight% or less. [0028] The outermost layer 11a contains an inorganic filler in a proportion of 85% by weight or more based on the entire outermost layer 11a. Therefore, since it has a certain degree of hardness after hardening, the peelability of the electronic device from the dicing tape becomes good. In addition, the outermost layer 11a can suppress unevenness of the top surface at the time of embedding. This is because the content of the thermoplastic resin in the outermost layer is 15% by weight or less based on the entire resin component, so that the shape of the top surface is smooth and sufficiently flowed under the influence of the low molecular weight components of the epoxy resin and the phenol component. [0029] Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, neoprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, Polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamine resin such as 6-nylon or 6,6-nylon, phenoxy resin, acrylic resin, PET or PBT, etc. Ester resin, polyamidoimide resin, fluororesin, styrene-isobutylene-styrene block copolymer, etc. These thermoplastic resins may be used alone or in combination of two or more. Among these, an acrylic resin is preferable from the viewpoints that flexibility is easily obtained and dispersibility with an epoxy resin is good. [0030] The acrylic resin is not particularly limited, and examples thereof include 1 of esters of acrylic acid or methacrylic acid having a linear or branched alkyl group having 30 or less carbon atoms, particularly 4 to 18 carbon atoms. A polymer (acrylic copolymer) of one or two or more kinds as a component. Examples of the alkyl group include methyl, ethyl, propyl, isopropyl, n-butyl, tert-butyl, isobutyl, pentyl, isopentyl, hexyl, heptyl, cyclohexyl, 2- Ethylhexyl, octyl, isooctyl, nonyl, isononyl, decyl, isodecyl, undecyl, lauryl, tridecyl, tetradecyl, stearyl, stearyl Or eicosyl and the like. [0031] Among the aforementioned acrylic resins, resins having a weight average molecular weight of 50,000 or more are preferable, resins having a weight average molecular weight of 100,000 to 2 million are more preferable, and resins having a weight average molecular weight of 300,000 to 1.6 million are more preferable. . If it is in the said numerical range, the viscosity and flexibility of the outermost layer 11a can be improved further. The weight average molecular weight is a value measured by GPC (gel permeation chromatography) and calculated by polystyrene conversion. More specifically, in this specification, the weight average molecular weight is a value measured by GPC (gel permeation chromatography) and calculated by polystyrene conversion. The weight-average molecular weight (Mw) is a value measured using a Tosoh GPC: HLC-8120GPC under the following measurement conditions. (Measurement conditions) Column: GMH equivalent _XL × 3 flows: 1. 0ml / min detector: RI detector sample concentration: 0. 1% by weight THF solution injection amount: 150 μl [0032] The other monomers forming the polymer are not particularly limited, and examples thereof include acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, and clothing Various carboxyl-containing monomers such as fumaric acid, maleic acid, fumaric acid or crotonic acid; various anhydride monomers such as maleic anhydride or itaconic anhydride; 2-hydroxyethyl (meth) acrylate, (meth) acrylic acid 2-hydroxypropyl ester, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, (Meth) acrylic acid 12-hydroxylauryl or (4-hydroxymethylcyclohexyl) -methacrylic acid and other various hydroxyl-containing monomers; styrene sulfonic acid, allyl sulfonic acid, 2- (methyl) Sulfonyl-2-methylpropanesulfonic acid, (meth) acrylamidopropanesulfonic acid, sulfopropyl (meth) acrylate or (meth) acrylic acid naphthalenesulfonic acid Monomer; or various phosphate-containing monomers such as 2-hydroxyethylpropenyl phosphonium phosphate. Among these, from the viewpoint that the viscosity or elastic coefficient of the outermost layer 11a can be increased by reacting with the epoxy resin, a carboxyl group-containing monomer, a glycidyl group (epoxy group) -containing monomer, and a hydroxyl group-containing monomer are preferred. At least one of. [0033] The inorganic filler is not particularly limited, and various conventionally known fillers can be used, and examples thereof include quartz glass, talc, silica (fused silica or crystalline silica), alumina, and nitrogen. Powder of aluminum, silicon nitride and boron nitride. These can be used alone or in combination of two or more. Among them, for the reason that the coefficient of linear expansion can be reduced well, silicon dioxide and aluminum oxide are preferred, and silicon dioxide is more preferred. [0034] As the silicon dioxide, silicon dioxide powder is preferred, and fused silicon dioxide powder is more preferred. Examples of the fused silica powder include spherical fused silica powder and crushed fused silica powder. However, from the viewpoint of fluidity, spherical fused silica powder is preferred. [0035] The average particle diameter of the aforementioned inorganic filler is preferably an average particle diameter in the range of 20 μm or less, more preferably 0. The average particle diameter in the range of 1 to 15 μm is particularly preferably 0. An average particle diameter in the range of 5 to 10 μm. In addition, as the inorganic filler, two or more kinds of inorganic fillers having different average particle diameters may be used. When two or more types of inorganic fillers having different average particle diameters are used, the above-mentioned "average particle diameter of the inorganic filler is 20 µm or less" means that the average particle diameter of the entire inorganic filler is 20 µm or less. [0036] The shape of the inorganic filler is not particularly limited, and may be any shape such as a spherical shape (including an ellipsoid shape), a polyhedron shape, a polygonal column shape, a flat shape, and an indefinite shape, but a spherical shape is preferred. [0037] The inorganic filler contained in the outermost layer 11a preferably has two peaks in a particle size distribution measured by a laser diffraction scattering method. Such an inorganic filler can be obtained, for example, by mixing two types of inorganic fillers having different average particle diameters. When an inorganic filler having two peaks in the particle size distribution is used, the inorganic filler can be filled at a high density. As a result, the content of the inorganic filler can be further increased. The aforementioned two peaks are not particularly limited, but it is preferable that the peak on the side with a large particle diameter is in the range of 3 to 30 μm, and the peak on the side with a small particle diameter is 0. Within the range of 1 to 1 μm. If the two peaks are within the aforementioned numerical range, the content of the inorganic filler can be further increased. Specifically, the particle size distribution can be obtained by the following method. (A) Put the outermost layer 11a into a crucible, and heat it strongly at 700 ° C for 2 hours in the atmosphere to ash it. (B) Disperse the obtained ash into pure water, perform ultrasonic treatment for 10 minutes, and use a laser diffraction scattering particle size distribution measuring device (manufactured by Beckman Coulter, "LS 13 320"; wet method) to determine the particle size. Distribution (volume basis). The composition of the outermost layer 11a is an organic component except for the inorganic filler. Actually, all of the organic components are burned out by the above-mentioned intense heat treatment. Therefore, the obtained ash is measured as an inorganic filler. However, the calculation of the average particle diameter can also be performed simultaneously with the particle size distribution. [0038] In the outermost layer 11a, the aforementioned inorganic filler is preferably surface-treated with a silane coupling agent in advance. [0039] The silane coupling agent is not particularly limited as long as it has a methacrylic acid group or an acrylic acid group and can be surface-treated with an inorganic filler. Specific examples of the silane coupling agent include 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, and 3-methacryl Ethoxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, methacryloxyoctyltrimethoxysilane, methacryloxyoctyl Triethoxysilane. Among these, from the viewpoints of reactivity and cost, 3-methacryloxypropyltrimethoxysilane is preferred. [0040] In the case where the outermost layer 11a contains an inorganic filler that has been surface-treated with a compound having a methacryloxy group or acryloxyl group as a silane coupling agent in advance, 100 parts by weight of the inorganic filler, It is better to use 0 in advance. 5 to 2 parts by weight of a silane coupling agent performs surface treatment on the inorganic filler. When the surface treatment of the inorganic filler is performed using a silane coupling agent, the viscosity of the outermost layer 11a can be suppressed from becoming too large. [0041] The outermost layer 11a contains an inorganic filler that has been surface-treated with a compound having a methacryloxy group or acryloxyl group as a silane coupling agent in advance, and uses two kinds of inorganics having different average particle sizes. When the mixture of fillers is used as the inorganic filler, it is preferable to surface-treat the inorganic filler having a smaller average particle diameter with at least a silane coupling agent in advance. Since the inorganic filler having a smaller average particle diameter has a larger specific surface area, it is possible to further suppress an increase in viscosity. When a mixture of two inorganic fillers having different average particle diameters is used as the inorganic filler, it is more preferable to use a silane coupling agent to preliminarily use an inorganic filler having a smaller average particle diameter and a larger inorganic filler. Both agents are surface-treated. In this case, the increase in viscosity can be further suppressed. [0042] The outermost layer 11a preferably contains an epoxy resin and a phenol resin. Thereby, good thermosetting properties are obtained. [0043] The epoxy resin is not particularly limited. For example, triphenylmethane epoxy resin, cresol novolac epoxy resin, biphenyl epoxy resin, modified bisphenol A epoxy resin, bisphenol A epoxy resin, and bisphenol F epoxy resin can be used. Various epoxy resins, such as epoxy resin, modified bisphenol F epoxy resin, dicyclopentadiene epoxy resin, phenol novolac epoxy resin, and phenoxy resin. These epoxy resins may be used alone or in combination of two or more. [0044] From the viewpoint of ensuring the toughness and the reactivity of the epoxy resin after hardening, it is preferable that the ring is a solid ring at a normal temperature of 150 to 250, a softening point or a melting point of 50 to 130 ° C. Among the oxygen resins, bisphenol F-type epoxy resin, bisphenol A-type epoxy resin, biphenyl-type epoxy resin and the like are more preferable from the viewpoint of moldability and reliability. [0045] The phenol resin is not particularly limited as long as it is a phenol resin that undergoes a curing reaction with an epoxy resin. For example, a phenol novolac resin, a phenol aralkyl resin, a biphenylaralkyl resin, a dicyclopentadiene type phenol resin, a cresol novolac resin, a resol novolac resin, and the like can be used. These phenol resins may be used alone or in combination of two or more. [0046] As the phenol resin, a resin having a hydroxyl equivalent of 70 to 250 and a softening point of 50 to 110 ° C. is preferably used from the viewpoint of reactivity with an epoxy resin. Among these, a curing reactivity is high and inexpensive. From the viewpoint, a phenol novolac resin can be suitably used. In addition, from the viewpoint of reliability, a low-hygroscopicity phenol resin such as a phenol aralkyl resin or a biphenyl aralkyl resin can also be suitably used. [0047] The blending ratio of the epoxy resin and the phenol resin, from the viewpoint of curing reactivity, it is preferable to make the total of hydroxyl groups in the phenol resin reach 0 with respect to 1 equivalent of the epoxy group in the epoxy resin. 7 ～ 1. 5 equivalents are blended, more preferably 0. 9 ～ 1. 2 equivalents. [0048] The lower limit of the total content of the epoxy resin and the phenol resin in the outermost layer 11a is preferably 2% by weight or more, and more preferably 3% by weight or more. When it is 2% by weight or more, the adhesive force to electronic devices, substrates, and the like is well obtained. On the other hand, the upper limit of the total content is preferably 25% by weight or less, and more preferably 20% by weight or less. If it is 25% by weight or less, the hygroscopicity of the resin sheet can be reduced. [0049] The outermost layer 11a preferably contains a hardening accelerator. [0050] The curing accelerator is not particularly limited as long as it hardens the epoxy resin and the phenol resin. Examples include 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,4-diamino-6- [2'-formaldehyde Imidazolyl- (1 ')]-ethyl-s-triazine and the like. [0051] The content of the hardening accelerator relative to 100 parts by weight of the total of the epoxy resin and the phenol resin is preferably 0. 1 to 5 parts by weight. [0052] The outermost layer 11a may contain a flame retardant component as necessary. As a result, it is possible to reduce the expansion of combustion during a fire due to a short circuit or heat generation of a component. As the flame retardant component, various metal hydroxides such as aluminum hydroxide, magnesium hydroxide, iron hydroxide, calcium hydroxide, tin hydroxide, and composite metal hydroxide can be used; phosphazene-based flame retardant Wait. [0053] The outermost layer 11a preferably contains a pigment. The pigment is not particularly limited, and examples thereof include carbon black. [0054] The content of the pigment in the outermost layer 11a is preferably 0. 1 to 2% by weight. If 0. If it is 1% by weight or more, good marking properties are obtained. If it is 2% by weight or less, the strength of the cured resin sheet can be secured. [0055] In the resin composition for forming the outermost layer 11a, in addition to the above components, other additives may be appropriately blended as necessary. [0056] The thickness of the outermost layer 11a is not particularly limited, and is, for example, 100 to 200 μm. If it exists in the said range, it can shape | mold smoothly into a top surface shape with respect to the wafer thickness of 100-250 micrometers. [Inner Layer] The innermost layer 11b contains a thermoplastic resin containing a functional group. Content of the said functional group containing thermoplastic resin is 90 weight% or more with respect to the whole resin component of the innermost layer 11b, Preferably it is 93 weight% or more, More preferably, it is 95 weight% or more. The weight average molecular weight of the functional group-containing thermoplastic resin is 800,000 or more, preferably 1 million or more, and more preferably 1.2 million or more. The weight average molecular weight is a value measured by GPC (gel permeation chromatography) and calculated by polystyrene conversion. The detailed measurement method is as described above. [0058] The resin sheet 11 is laminated on the electronic device so that the innermost layer 11b is in contact with the electronic device, and then the electronic device is embedded and used. The innermost layer 11b contains a functional group-containing thermoplastic resin in a proportion of 90% by weight or more with respect to the entire resin component of the innermost layer 11b. Since there are many thermoplastic resin components, the resin can be inserted into the hollow portion between the electronic device and the adhesive when the electronic device is embedded. Moreover, since the said functional group containing thermoplastic resin has a functional group, it cross-links during the period from the embedment of an electronic device to completion | finish of thermosetting. In addition, since the weight-average molecular weight of the functional group-containing thermoplastic resin is 800,000 or more, it does not easily flow even when heated. Therefore, it is possible to reduce the amount of resin entering (moving amount) in the hollow portion between the electronic device and the adherend. [0059] Examples of the functional group-containing thermoplastic resin include a functional group-containing acrylic resin. [0060] Examples of the functional group-containing acrylic resin include acrylic resins having any one or more of a glycidyl group and an amino group as a functional group. As a specific example of the said functional group containing acrylic resin, the acrylic resin which has the said functional group among the acrylic resin demonstrated in the item of the outermost layer 11a is mentioned. Among these, a glycidyl group-containing acrylic resin is preferable. If it is an acrylic resin containing a glycidyl group, the amount of resin movement during the period from the embedment of the electronic device to the end of the thermal curing can be further reduced. [0061] The innermost layer 11b preferably contains a phenol resin as a curable component. The content of the phenol resin relative to the equivalent of the functional group-containing thermoplastic resin is preferably 0. 8 to 2. Within the range of 0, more preferably 0. 9 ～ 1. Within the range of 5, more preferably 1. 0 to 1. Within 2 range. If the content of the aforementioned phenol resin contained in the innermost layer 11b with respect to the aforementioned functional group-containing thermoplastic resin, the equivalent ratio is 0. 8 to 2. In the range of 0, it is suitable to react with the functional group of the functional group-containing thermoplastic resin. As a result, it is possible to further reduce the amount of resin movement during the period from the embedment of the electronic device to the end of the thermal curing. [0062] Examples of the phenol resin include the phenol resin described in the item of the outermost layer 11a. [0063] The innermost layer 11b preferably does not include an epoxy resin. [0064] The innermost layer 11b preferably does not contain an inorganic filler or, even if it does, the inorganic filler is contained in a range of 50% by weight or less with respect to the innermost layer 11b. Examples of the inorganic filler include the inorganic fillers described in the outermost layer 11a. [0065] The innermost layer 11b preferably contains a hardening accelerator. Examples of the hardening accelerator include the hardening accelerator described in the outermost layer 11a. [0066] The innermost layer 11b preferably contains a pigment. Examples of the pigment include pigments described in the outermost layer 11a. [0067] In the resin composition for forming the innermost layer 11b, other additives may be appropriately blended as necessary in addition to the above components. [0068] The thickness of the innermost layer 11b is not particularly limited, and is, for example, 50 to 100 μm. Within the above range, the innermost layer can prevent the outermost layer from flowing. [0069] The thickness of the entire resin sheet 11 is not particularly limited, and is, for example, 150 μm to 1000 μm. Within this range, a resin sheet having a wafer thickness of 100 to 700 μm can be stably formed. [0070] When measuring the glass transition temperature Tg of the entire resin sheet 11 before curing, the resin sheet 11 preferably has at least one glass transition temperature Tg below 0 ° C. If at least one glass transition temperature Tg exists below 0 ° C, it can be said that an acrylic resin is contained. If an acrylic resin is contained, it is more suitable for the resin to enter the hollow portion between the electronic device and the adhesive when the electronic device is embedded. The method for measuring the glass transition temperature Tg is based on the method described in the examples. [Manufacturing Method of Resin Sheet] The resin sheet 11 is obtained by producing the outermost layer 11a and the innermost layer 11b separately and bonding them together. [0072] <Production Method of Outermost Layer> The outermost layer 11a can be formed by dissolving and dispersing a resin or the like for forming the outermost layer 11a in an appropriate solvent, adjusting the varnish, and forming a predetermined thickness on the spacer. After the varnish is applied thereon to form a coating film, the coating film is dried under predetermined conditions. The coating method is not particularly limited, and examples thereof include roll coating, screen coating, and gravure coating. The drying conditions are performed, for example, in a range of a drying temperature of 70 to 160 ° C and a drying time of 1 to 30 minutes. Examples of the solvent include methyl ethyl ketone, ethyl acetate, and toluene. The outermost layer 11a can be produced through kneading and extrusion. As a method for manufacturing by kneading and extrusion, for example, each component for forming the outermost layer 11a is melt-kneaded by a known kneading machine such as a kneading roll, a pressure kneader, and an extruder. Thereby, a method of preparing a kneaded product, and a method of plasticizing the obtained kneaded product to form a sheet, and the like. Specifically, the resin sheet can be formed by directly performing extrusion molding at a high temperature without cooling the kneaded material after the melt-kneading. The extrusion method is not particularly limited, and examples thereof include a T-die extrusion method, a roll calender method, a roll kneading method, a coextrusion method, and a calendering method. The extrusion temperature is preferably above the softening point of each of the above components. In consideration of the thermosetting properties and moldability of the epoxy resin, it is, for example, 40 to 150 ° C, preferably 50 to 140 ° C, and more preferably 70. ~ 120 ° C. In the above manner, the outermost layer 11a can be formed. [0073] <Production Method of Innermost Layer> The innermost layer 11b can be formed by the same method as the outermost layer 11a. [0074] In addition, as another method for manufacturing the resin sheet 11, a varnish for forming the outermost layer 11a may be applied to the spacer, and dried to obtain the outermost layer 11a, and then applied to the outermost layer 11a. The varnish of the innermost layer 11b is formed and allowed to dry. [Manufacturing Method of Hollow Electronic Device Package] The resin sheet of the present invention can be suitably used as a resin sheet for electronic device sealing for hollow sealing. The method for manufacturing a hollow electronic device package according to this embodiment includes at least: a step of preparing a laminate in which an electronic device is fixed to an adhesive via a bump; a step of preparing the resin sheet; and placing the resin sheet in the innermost part. A step of disposing the layer on the electronic device of the laminated body in contact with the electronic device of the laminated body; a step of embedding the electronic device into the resin sheet by hot pressing; and after the embedding step, A step of thermally curing the resin sheet to obtain a sealed body. [0076] The adhesive is not particularly limited, and examples thereof include a printed wiring board, a ceramic substrate, a silicon substrate, a metal substrate, and a LTCC (Low Temperature Co-fired Ceramics) substrate. In this embodiment, the SAW wafer 13 mounted on the printed wiring board 12 is hollow-sealed with the resin sheet 11 to produce a hollow electronic device package. The SAW chip 13 refers to a wafer having a SAW (Surface Acoustic Wave) filter. That is, in this embodiment, a case where the electronic device of the present invention is a wafer having a SAW (Surface Acoustic Wave) filter will be described. 2 to 6 are schematic cross-sectional views for describing a method for manufacturing a hollow electronic device package according to this embodiment. [Step of Preparing Laminate] In the method of manufacturing a hollow electronic device package according to this embodiment, first, a laminate in which a plurality of SAW chips 13 (SAW filters 13) are mounted on a printed wiring board 12 is prepared. 15 (refer to Figure 2). The SAW wafer 13 can be formed by slicing a piezoelectric crystal having a predetermined comb electrode formed thereon by a known method and singulating the piezoelectric crystal. When mounting the SAW wafer 13 on the printed wiring board 12, a known device such as a flip chip bonder or a wafer bonder can be used. The SAW wafer 13 and the printed wiring board 12 are electrically connected via a bump 13a. In addition, a hollow portion 14 is maintained between the SAW wafer 13 and the printed wiring board 12 without hindering the propagation of the surface elastic wave on the surface of the SAW filter. The distance (the width of the hollow portion) between the SAW wafer 13 and the printed wiring board 12 can be appropriately set, and is usually about 10 to 100 μm. [0079] (Step of Preparing Resin Sheet) In the method for manufacturing a hollow electronic device package according to the present embodiment, a resin sheet 11 is prepared (see FIG. 1). [0080] (Step of Arranging Resin Sheet) Next, as shown in FIG. 3, the laminated body 15 is disposed on the lower heating plate 22 with the surface on which the SAW wafer 13 is fixed facing upward, and is disposed on the surface of the SAW wafer 13. Resin sheet 11. At this time, they are arranged so that the surface of the SAW wafer 13 is in contact with the innermost layer 11 b of the resin sheet 11. In this step, the laminated body 15 may be firstly arranged on the lower heating plate 22, and then the resin sheet 11 may be arranged on the laminated body 15; or the resin sheet 11 may be laminated on the laminated body 15 first, and then laminated with A laminate of the laminate 15 and the resin sheet 11 is arranged on the lower heating plate 22. [0081] (Step of Embedding Electronic Device in Resin Sheet) Next, as shown in FIG. 4, the lower heating plate 22 and the upper heating plate 24 are hot-pressed to embed the SAW wafer 13 into the resin sheet 11. The lower heating plate 22 and the upper heating plate 24 may be devices provided by flat pressing. The resin sheet 11 functions as a sealing resin for protecting the SAW wafer 13 and its attached components from the external environment. [0082] The embedding step is preferably performed in such a manner that the amount X2 (see FIG. 7) of the resin constituting the resin sheet 11 entering the hollow portion 14 between the SAW filter 13 and the printed wiring board 12 is reached (see FIG. 7). 0 μm or more and 20 μm or less. FIG. 7 is an enlarged cross-sectional view for explaining the amount X2 of entry. The amount X2 of entry is preferably 0 μm or more and 15 μm or less. As a method of making the said amount X2 of 0 micrometers or more and 20 micrometers or less, it can achieve by adjusting the viscosity of the resin sheet 11, or adjusting a hot-pressing condition. More specifically, for example, a method of setting the pressure and temperature relatively high may be mentioned. In the case where a plurality of SAW filters 13 are sealed together, the “entry amount X2 is 0 μm or more and 20 μm or less” means that the “entry amount X2 is 0 μm or more and 20 μm or less” for all the SAW filters 13. ". [0083] Specifically, the hot-pressing conditions when the SAW wafer 13 is embedded in the resin sheet 11 vary depending on the viscosity of the resin sheet 11 and the like, but the temperature is preferably 20 to 150 ° C, and more preferably 40 to 100 ° C. The pressure is, for example, 0. 01 ～ 20MPa, preferably 0. 05 ～ 5MPa, time is, for example, 0. 3 to 10 minutes, preferably 0. 5 to 5 minutes. Examples of the hot pressing method include parallel flat plate pressing or roll pressing. Among them, parallel flat plate extrusion is preferred. By making the hot-pressing condition within the above-mentioned numerical range, it is easy to make the entering amount X2 within the above-mentioned numerical range. If the temperature during hot pressing is too high, a reaction will occur during hot pressing, and there may be variations in the amount of intrusion. From the viewpoint of operability, a low temperature (for example, 100 ° C or lower) is also required. In addition, from the viewpoint of preventing breakage of the wafer, the pressure is also preferably low. [0084] In consideration of improving the adhesion and followability of the resin sheet 11 to the SAW wafer 13 and the printed wiring board 12, it is preferable to perform the extrusion under reduced pressure. As the aforementioned decompression conditions, the pressure is, for example, 0 to 20 Torr, preferably 5 to 10 Torr, and the decompression holding time (time from the start of decompression to the start of extrusion) is, for example, 5 to 600 seconds, preferably 10 to 300 second. [0085] (Separator Separating Step) Next, as in this embodiment, when the resin sheet 11 is used in a state where the spacer is attached on one side, the spacer 11a is peeled (see FIG. 5). [Step of Thermally Curing to Obtain a Sealed Body] Next, the resin sheet 11 is thermally cured to obtain a sealed body 25. The step of obtaining the sealing body is preferably performed as follows: When the amount of the resin entering the hollow portion 14 in the state after the step of obtaining the sealing body 25 is set to Y2, the amount of the entering amount is subtracted from the amount of the entering amount Y2. The value obtained by X2 is 30 μm or less. The value obtained by subtracting the above-mentioned entrance amount X2 from the above-mentioned entrance amount Y2 is preferably 25 μm or less. As a method of making the value obtained by subtracting the amount X2 from the amount Y2 from entering into 30 μm or less, the resin sheet 11 can be adjusted by adjusting the viscosity before curing of the resin sheet 11 or increasing the curing rate during heating. To achieve. Specifically, it can be achieved by selecting the said hardening accelerator, for example. [0087] Specifically, the conditions for the thermosetting treatment vary depending on the viscosity of the resin sheet 11, the constituent materials, and the like, but the heating temperature is preferably 100 ° C or more, and more preferably 120 ° C or more. On the other hand, the upper limit of the heating temperature is preferably 200 ° C or lower, and more preferably 180 ° C or lower. The heating time is preferably 10 minutes or more, and more preferably 30 minutes or more. On the other hand, the upper limit of the heating time is preferably 180 minutes or less, and more preferably 120 minutes or less. In addition, pressure can also be applied as needed, preferably 0. Above 1MPa, more preferably 0. 5MPa or more. On the other hand, the upper limit is preferably 10 MPa or less, and more preferably 5 MPa or less. By setting the conditions of the thermosetting treatment within the above-mentioned numerical range, it is easy to make the resin flow distance from the embedding step to after the thermosetting step, that is, the value obtained by subtracting the entering amount X2 from the entering amount Y2. It is 30 μm or less. [0088] When only one SAW filter 13 as an electronic device is sealed, the sealing body 25 may be used as one hollow electronic device package. In addition, when a plurality of SAW filters 13 are collectively sealed, they are divided into a single SAW filter, so that each can be made into a hollow electronic device package. That is, as in the present embodiment, when a plurality of SAW filters 13 are collectively sealed, the following configuration may be performed. [0089] (Cutting Step) After the heat curing step, cutting of the sealing body 25 may be performed (see FIG. 6). Thereby, the hollow package 18 (hollow-type electronic device package) with the SAW wafer 13 as a unit can be obtained. A cutting tape is stuck on the outermost layer 11a side of the sealing body 25, and then cutting is performed. Since the dicing tape is adhered to the outermost layer 11a, the hollow package 18 can be easily peeled from the dicing tape after cutting. [0090] (Substrate Mounting Step) If necessary, a substrate mounting step of forming a bump on the hollow package 18 and mounting the bump on another substrate (not shown) may be performed. When the hollow package 18 is mounted on a substrate, a known device such as a flip chip bonder or a wafer bonder can be used. [0091] In the embodiment described above, the case where the hollow electronic device of the present invention is a SAW wafer 13 as a semiconductor wafer having a movable portion has been described. However, the hollow electronic device of the present invention is not limited to this example as long as it has a hollow portion between the adherend and the electronic device. For example, a semiconductor wafer having a MEMS (Micro Electro Mechanical Systems) as a movable portion such as a pressure sensor or a vibration sensor may be used. In addition, in the embodiment described above, a case where an electronic device is embedded using a resin sheet and extruded by a parallel flat plate has been described. However, the present invention is not limited to this example, and a vacuum in a vacuum state may be used. After the laminate of the electronic device and the resin sheet is sealed with a release film in the chamber, a gas at atmospheric pressure or higher is introduced into the chamber, and the electronic device is buried in the thermosetting resin sheet of the resin sheet. Specifically, the electronic device can be embedded in the thermosetting resin sheet of the resin sheet by the method described in Japanese Patent Application Laid-Open No. 2013-52424. [Examples] [0092] Hereinafter, suitable examples of the present invention will be described in detail by way of example. However, the materials, blending amounts, and the like described in this example are not intended to limit the scope of the present invention to this unless they are specifically limited. [0093] The components of the resin sheet used in the examples will be described. Epoxy resin: YSLV-80XY (bisphenol F-type epoxy resin, epoxy equivalent 200g / eq. Made by Nippon Steel Chemical Co., Ltd.) 、 Softening point 80 ℃) Phenol resin: LVR8210DL (phenol-form phenol resin, hydroxyl equivalent 104g / eq.) Manufactured by Qunrong Chemical. And softening point: 60 ° C) Thermoplastic resin A: HME-2006M (carboxyl-containing acrylate copolymer, weight average molecular weight: about 600,000, glass transition temperature (Tg): -35 ° C) manufactured by Gensangyo Corporation B: NDHB-101 (glycidyl-containing acrylate copolymer, weight-average molecular weight: about 1 million, glass transition temperature (Tg): -31 ° C) manufactured by Gensang Industrial Co., Ltd. Thermoplastic resin C: ND-77L (glycidyl-containing acrylate copolymer, weight average molecular weight: about 1.1 million, glass transition temperature (Tg): -10 ° C) Thermoplastic resin D: ND-78L (including glycidol) Acrylate copolymer, weight average molecular weight: about 1.1 million, glass transition temperature (Tg): -15 ° C) thermoplastic resin E: NDF-001 (glycidyl group-containing acrylate copolymer, Weight average molecular weight: about 500,000, glass transition temperature (Tg): 4 ° C) thermoplastic resin F: NDF-002 (glycidyl-containing acrylate copolymer) Weight-average molecular weight: about 100,000, glass transition temperature (Tg): 4 ° C) Inorganic filler A: FB-5SDC manufactured by Electrochemical Industry Co., Ltd. (average particle diameter 5 μm, without surface treatment) Inorganic filler B: Admatechs Company-made SO-25R (average particle size 0. 5 μm) Inorganic filler after surface treatment with 3-methacryloxypropyltrimethoxysilane (product name: Shin-Etsu Chemical Co., Ltd .: KBM-503). The surface treatment was performed with 1 part by weight of a silane coupling agent with respect to 100 parts by weight of the inorganic filler B. Carbon black: # 20 hardening accelerator manufactured by Mitsubishi Chemical Corporation: 2PHZ-PW (2-phenyl-4,5-dihydroxymethylimidazole) manufactured by Shikoku Chemical Industry Co., Ltd. [0094] [Examples and Comparative Examples Production of Resin Sheet] Each component was dissolved and dispersed in methyl ethyl ketone as a solvent in accordance with the blending ratios shown in Table 1 to obtain a varnish having a concentration of 85% by weight. This varnish was applied to a silicone release-treated spacer, and then dried at 110 ° C for 5 minutes. Thus, a sheet having a thickness of 55 μm was obtained. This sheet was laminated with three upper layers and one lower layer, respectively, to produce a resin sheet having a thickness of 220 μm. In the following evaluation, the thickness of the resin sheet is preferably implemented by a thickness equal to or greater than the total of the wafer thickness and the bump height used in the following evaluation. This is because if the sheet thickness is too thin, the amount of invasion decreases, and stable evaluation cannot be performed. Therefore, in this embodiment, the "total of wafer thickness and bump height" in the following evaluation is 220 μm. [0095] (Top Surface Roughness Evaluation) FIG. 8 (a) is a schematic cross-sectional view for explaining the top surface roughness evaluation, and FIG. 8 (b) is a plan view thereof. 9 to 11 are schematic cross-sectional views for explaining the evaluation of the unevenness of the top surface. FIG. 12 is a schematic plan view for explaining the evaluation of the unevenness of the top surface. [0091] <Step A1> First, four model wafers 113 of the following pattern are prepared (see FIGS. 8 (a) and 8 (b)). [Style of model wafer] Wafer size: 3mm vertical, 3mm horizontal, 200μm thick Hollow Gap: 20μm (that is, bump height 20μm) Material: Silicon wafer Wafer: Photosensitive resin bumps are still relatively thin in recent years in electronic devices The advancement of thinning requires thinning of wafers or semiconductor packages. Therefore, the bump height formed on the surface of the wafer is required to be about 10 to 50 μm. Here, since a bump is formed on the wafer surface after the silicon wafer is ground to a predetermined thickness, if the wafer thickness is too thin, the bump cannot be efficiently formed. Therefore, in this embodiment, in consideration of the limit of the thickness of the wafer where the bumps can be formed stably, the evaluation was performed using approximately 200 μm as the wafer thickness. In addition, in order to suppress the deviation of the evaluation, the lower the bump height, the better. From this viewpoint, the bump height was evaluated at 20 μm. [0097] <Step B1> On the substrate 112 (size: 6cm in length, 10cm in width, thickness: 1. 3 mm, material: glass), the prepared model wafer 113 is arranged so that the distance W from the adjacent wafer is 300 μm (see FIGS. 8 (a) and 8 (b)). [0098] <Step C1> A resin sheet having a thickness of 220 μm produced in the above-mentioned Examples and Comparative Examples was cut into 25 mm in length and 25 mm in width as Sample 111 (see FIG. 9). [0099] <Step D1> The sample 111 is placed on the model wafer 113 (see FIG. 10). [0100] <Step E1> In a state where the spacer 110 is attached, lamination is performed by vacuum extrusion under conditions of 75 ° C. for 60 seconds and a pressure of 300 kPa (see FIG. 11). Lamination is performed by hot pressing the lower heating plate 122 and the upper heating plate 124. Then, it heated at 150 degreeC for 1 hour. After that, the spacer 110 is peeled. In this example, as a hardening accelerator, 2PHZ-PW (2-phenyl-4,5-dihydroxymethylimidazole) manufactured by Shikoku Chemical Industry Co., Ltd. was used, and the reaction of the product "2PHZ-PW" Since the starting temperature was around 145 ° C, the heating conditions were set to 150 ° C and 1 hour. [0101] <Step F1> The thickness of the portion of the center Y (see FIG. 12) of the sample 111 below the plane was measured with a contact surface roughness meter. The amount of depression between the wafers was determined based on the center of the wafer. A case where the thickness is 30 μm or more was evaluated as ×, and a case where the value was less than 30 μm was evaluated as ○. The results are shown in Table 1. [0102] (Evaluation of Invasion Amount During Squeezing) FIG. Figure 13 (b) is a cross-sectional schematic diagram of the intrusion amount evaluation during compression. Figures 14 to 16 are schematic cross-sectional diagrams illustrating the evaluation of the unevenness of the top surface. [0103] First, prepare the following pattern 25 model wafers 213 are mounted on a glass substrate 212 (6 cm in length, 10 cm in width, and 1. 3 mm) model wafer mounting substrate 215 (see FIGS. 13 (a) and 13 (b)). The gap width between the glass substrate 212 and the model wafer 213 is 50 μm. The distance W2 between adjacent wafers is 300 μm. [Model wafer pattern] Wafer size: 3mm in height, 3mm in width, 200μm thick Bump material: resin bump (resin material: acrylic resin) Bump height: 20μm Number of bumps: 100 bumps configuration Position: 10 vertical × 10 horizontal, 200 μm pitch. Specifically, the model wafer 213 is mounted on a glass substrate 212 under the following bonding conditions to prepare a model wafer mounting substrate 215. <Joining conditions> Apparatus: Matsushita Electric Works Co., Ltd. Joining conditions: 200 ° C, 3N, 1 second, ultrasonic output 2W [0104] <Step B2> The resin sheet having a thickness of 220 μm produced in the above examples and comparative examples was cut into 3 cm in length and 3 cm in width were used as samples 211 (see FIG. 14). [0105] <Step C2> The sample 211 is placed on the model wafer 213 of the model wafer mounting substrate 215 (see FIG. 15). [0106] <Step D2> In a state where the spacer 210 is attached, the model wafer 213 is embedded in the sample 211 under the following embedding conditions (see FIG. 16). The embedding is performed by hot pressing of the lower heating plate 222 and the upper heating plate 224. <Buried conditions> Extrusion method: Flat plate extrusion temperature: 75 ° C Pressure: 1500kPa Vacuum degree during extrusion: 1. 6 kPa extrusion time: 1 minute [0107] <Step E2> After opening to atmospheric pressure, place in a hot air dryer at 150 ° C for 1 hour. Thereby, the said sample was heat-hardened and the sealing body sample was obtained. The amount Y1 of the resin entering the sample 211 into the hollow portion between the model wafer 213 and the glass substrate 212 of the obtained sealed body sample was measured. Specifically, the amount of resin entering Y1 into the hollow portion between the model wafer 213 and the glass substrate 212 was measured using a brand name "Digital Microscope" (200 times) manufactured by KEYENCE Corporation. The resin penetration amount Y1 was measured as the maximum reach of the resin entering the hollow part from the end of the SAW wafer, and this was taken as the resin penetration amount Y1. In addition, when the hollow portion is extended beyond the SAW wafer without entering, the resin entering amount is expressed as a negative value. (In this example and the comparative example, there is no case where it is a negative value). The measurement of the penetration amount Y1 is performed on the model wafer 213-1 arranged on the outside and the model wafer 213-2 arranged on the inside. The model wafer 213-1 arranged on the outside refers to a model wafer located at each vertex of a square arranged 5 × 5. The entry amount Y1 of the model wafer 213-1 arranged on the outside is an average value of 4 wafers (in Table 1, it is expressed as an outside entry amount). The model wafer 213-2 arranged on the inside refers to: among the wafers arranged in a 5 × 5 square, the third one from the top (the third from the bottom) and the third from the left (the third from the right) Model wafer. The entry amount Y1 of the model wafer 213-2 arranged on the inside adopts the measured value of the entry amount Y1 of the one model wafer 213-2 (in Table 1, it is expressed as the inside entry amount). A case where both the inside entry amount and the outside entry amount were 20 μm or less and the difference between the inside entry amount and the outside entry amount was 30 μm or less was evaluated as 0. The case where at least one of the inside entry amount and the outside entry amount was larger than 20 μm, and the case where the difference between the inside entry amount and the outside entry amount was greater than 30 μm were evaluated as ×. [0108] <Measurement of Glass Transition Temperature Tg before Curing of the Whole Sheet> The glass transition temperature Tg is measured by a loss tangent (tan δ) measured using a dynamic viscoelasticity measuring device (DMA, frequency 1 Hz, heating rate 10 ° C./min) To get the maximum value. Dynamic viscoelasticity measuring device (DMA): trade name "RSAG2", TA Instruments company mode: tensile mode heating rate: 10 ° C / min frequency: 1Hz sample thickness: 260μm distance between chucks: 20mm strain: 0. 1% measurement temperature range: -50 ℃ ～ 100 ℃ [0109]

[0110]

11‧‧‧Resin sheet (resin sheet) for electronic device sealing

13‧‧‧SAW filter (electronic device)

14‧‧‧ Hollow

15‧‧‧ laminated

18‧‧‧ hollow electronic device package

25‧‧‧Sealed body

[0021] FIG. 1 is a schematic cross-sectional view of a resin sheet according to this embodiment. [FIG. 2] A schematic cross-sectional view for explaining a method for manufacturing an electronic device package according to this embodiment. [FIG. 3] It is a schematic cross-sectional view for explaining the manufacturing method of the electronic device package of this embodiment. [FIG. 4] A schematic cross-sectional view for explaining a method for manufacturing an electronic device package according to this embodiment. [FIG. 5] A schematic cross-sectional view illustrating a method for manufacturing an electronic device package according to this embodiment. [FIG. 6] It is a schematic cross-sectional view for explaining the manufacturing method of the electronic device package of this embodiment. [Fig. 7] is an enlarged view of a cross-sectional part for explaining the approach amount X2. [Fig. 8], (a) is a schematic cross-sectional diagram for explaining the evaluation of the unevenness of the top surface, and (b) is a plan view of the plane. [Fig. 9] is a schematic cross-sectional view for explaining the bump evaluation of the top surface. [Fig. 10] is a schematic cross-sectional view for explaining the bump evaluation of the top surface. [Fig. 11] is a schematic cross-sectional view for explaining the bump evaluation of the top surface. [Fig. 12] is a schematic cross-sectional view for explaining the bump evaluation of the top surface. In [Fig. 13], (a) is a schematic cross-sectional diagram for explaining the evaluation of the amount of intrusion during compression, and (b) is a plan view of the plane. [Fig. 14] is a schematic cross-sectional view for explaining the evaluation of the amount of invasion during extrusion. [Fig. 15] is a schematic cross-sectional view for explaining the evaluation of the amount of invasion during extrusion. [Fig. 16] is a schematic cross-sectional view for explaining the evaluation of the amount of invasion during extrusion.

Claims (5)

A resin sheet having an outermost layer and an innermost layer. The outermost layer includes an inorganic filler and a thermoplastic resin. ， The content of the inorganic filler is 85% by weight or more relative to the entire outermost layer. The content of the thermoplastic resin. It is 15% by weight or less based on the total resin component of the outermost layer. The innermost layer contains a functional group-containing thermoplastic resin having a weight average molecular weight of 800,000 or more. The content of the functional group-containing thermoplastic resin relative to the aforementioned The total resin component of the inner layer is 90% by weight or more. The resin sheet according to claim 1, wherein the functional group-containing thermoplastic resin is a glycidyl group-containing acrylic resin. The resin sheet according to claim 1, wherein the innermost layer contains a phenol resin as a hardening component, and the content ratio of the phenol resin to the functional group-containing thermoplastic resin is in a range of 0.8 to 2.0. The resin sheet according to claim 1, wherein when the glass transition temperature Tg of the entire resin sheet before curing is measured, at least one glass transition temperature Tg exists at 0 ° C or lower. The resin sheet according to any one of 1 to 4, wherein the innermost layer does not include an inorganic filler or contains an inorganic filler in an amount of 1% by weight or less based on the entirety of the innermost layer.