CN111094450A - Epoxy resin composition and electronic component device - Google Patents
Epoxy resin composition and electronic component device Download PDFInfo
- Publication number
- CN111094450A CN111094450A CN201880059554.5A CN201880059554A CN111094450A CN 111094450 A CN111094450 A CN 111094450A CN 201880059554 A CN201880059554 A CN 201880059554A CN 111094450 A CN111094450 A CN 111094450A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- resin composition
- inorganic filler
- group
- chain hydrocarbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 207
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 207
- 239000000203 mixture Substances 0.000 title claims abstract description 160
- -1 silane compound Chemical class 0.000 claims abstract description 123
- 239000011256 inorganic filler Substances 0.000 claims abstract description 113
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 113
- 229910000077 silane Inorganic materials 0.000 claims abstract description 93
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 58
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 14
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract 4
- 125000000524 functional group Chemical group 0.000 claims description 26
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 18
- 125000003545 alkoxy group Chemical group 0.000 claims description 18
- 125000003700 epoxy group Chemical group 0.000 claims description 18
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 81
- 239000002245 particle Substances 0.000 description 49
- 239000007822 coupling agent Substances 0.000 description 36
- 229920005989 resin Polymers 0.000 description 28
- 239000011347 resin Substances 0.000 description 28
- 238000000034 method Methods 0.000 description 25
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 24
- 238000000465 moulding Methods 0.000 description 23
- 239000005011 phenolic resin Substances 0.000 description 20
- 150000001875 compounds Chemical class 0.000 description 18
- 238000011049 filling Methods 0.000 description 15
- 125000004429 atom Chemical group 0.000 description 14
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 13
- 238000011156 evaluation Methods 0.000 description 13
- 239000003063 flame retardant Substances 0.000 description 13
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 13
- 238000007789 sealing Methods 0.000 description 13
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 12
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 12
- 150000002989 phenols Chemical class 0.000 description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 10
- 238000000748 compression moulding Methods 0.000 description 10
- 125000001424 substituent group Chemical group 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 150000002500 ions Chemical class 0.000 description 9
- 238000001721 transfer moulding Methods 0.000 description 9
- 239000000654 additive Substances 0.000 description 8
- 239000003086 colorant Substances 0.000 description 8
- 239000011342 resin composition Substances 0.000 description 8
- QYJYJTDXBIYRHH-UHFFFAOYSA-N trimethoxy-[8-(oxiran-2-ylmethoxy)octyl]silane Chemical compound C(C1CO1)OCCCCCCCC[Si](OC)(OC)OC QYJYJTDXBIYRHH-UHFFFAOYSA-N 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- GAYWTJPBIQKDRC-UHFFFAOYSA-N 8-trimethoxysilyloctyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCCCCCOC(=O)C(C)=C GAYWTJPBIQKDRC-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 6
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 6
- 229960003493 octyltriethoxysilane Drugs 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- 229940005561 1,4-benzoquinone Drugs 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 4
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 4
- NADHCXOXVRHBHC-UHFFFAOYSA-N 2,3-dimethoxycyclohexa-2,5-diene-1,4-dione Chemical compound COC1=C(OC)C(=O)C=CC1=O NADHCXOXVRHBHC-UHFFFAOYSA-N 0.000 description 4
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 4
- 208000036829 Device dislocation Diseases 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000013508 migration Methods 0.000 description 4
- 230000005012 migration Effects 0.000 description 4
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- URLKBWYHVLBVBO-UHFFFAOYSA-N p-dimethylbenzene Natural products CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- UIXPTCZPFCVOQF-UHFFFAOYSA-N ubiquinone-0 Chemical compound COC1=C(OC)C(=O)C(C)=CC1=O UIXPTCZPFCVOQF-UHFFFAOYSA-N 0.000 description 4
- 229910052724 xenon Inorganic materials 0.000 description 4
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- ZEGDFCCYTFPECB-UHFFFAOYSA-N 2,3-dimethoxy-1,4-benzoquinone Natural products C1=CC=C2C(=O)C(OC)=C(OC)C(=O)C2=C1 ZEGDFCCYTFPECB-UHFFFAOYSA-N 0.000 description 2
- AIACLXROWHONEE-UHFFFAOYSA-N 2,3-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=C(C)C(=O)C=CC1=O AIACLXROWHONEE-UHFFFAOYSA-N 0.000 description 2
- SENUUPBBLQWHMF-UHFFFAOYSA-N 2,6-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=CC(=O)C=C(C)C1=O SENUUPBBLQWHMF-UHFFFAOYSA-N 0.000 description 2
- VTWDKFNVVLAELH-UHFFFAOYSA-N 2-methylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=CC(=O)C=CC1=O VTWDKFNVVLAELH-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- RLQZIECDMISZHS-UHFFFAOYSA-N 2-phenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=CC(=O)C(C=2C=CC=CC=2)=C1 RLQZIECDMISZHS-UHFFFAOYSA-N 0.000 description 2
- WCULYVVFGLYOBZ-UHFFFAOYSA-N 6-trimethoxysilylhexyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCCCOC(=O)C=C WCULYVVFGLYOBZ-UHFFFAOYSA-N 0.000 description 2
- CAHIVXHJOTWKEA-UHFFFAOYSA-N 7-trimethoxysilylheptyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCCCCOC(=O)C=C CAHIVXHJOTWKEA-UHFFFAOYSA-N 0.000 description 2
- JOVCTEPPTIOAPX-UHFFFAOYSA-N 8-trimethoxysilyloctyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCCCCCOC(=O)C=C JOVCTEPPTIOAPX-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-methylmorpholine Substances CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001343 alkyl silanes Chemical class 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000004104 aryloxy group Chemical group 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229940125904 compound 1 Drugs 0.000 description 2
- 229940125782 compound 2 Drugs 0.000 description 2
- 229940126214 compound 3 Drugs 0.000 description 2
- 229940125898 compound 5 Drugs 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical class [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 2
- CRGRWBQSZSQVIE-UHFFFAOYSA-N diazomethylbenzene Chemical compound [N-]=[N+]=CC1=CC=CC=C1 CRGRWBQSZSQVIE-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- VRINOTYEGADLMW-UHFFFAOYSA-N heptyl(trimethoxy)silane Chemical compound CCCCCCC[Si](OC)(OC)OC VRINOTYEGADLMW-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 150000003003 phosphines Chemical group 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 2
- SAWDTKLQESXBDN-UHFFFAOYSA-N triethoxy(heptyl)silane Chemical compound CCCCCCC[Si](OCC)(OCC)OCC SAWDTKLQESXBDN-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 2
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 2
- VRHBBGAASHNPHT-UHFFFAOYSA-N trimethoxy-[6-(oxiran-2-ylmethoxy)hexyl]silane Chemical compound CO[Si](OC)(OC)CCCCCCOCC1CO1 VRHBBGAASHNPHT-UHFFFAOYSA-N 0.000 description 2
- ITQVMIOKEJEYEZ-UHFFFAOYSA-N trimethoxy-[7-(oxiran-2-ylmethoxy)heptyl]silane Chemical compound CO[Si](OC)(OC)CCCCCCCOCC1CO1 ITQVMIOKEJEYEZ-UHFFFAOYSA-N 0.000 description 2
- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 2
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- 150000003739 xylenols Chemical class 0.000 description 2
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 2
- QJIMTLTYXBDJFC-UHFFFAOYSA-N (4-methylphenyl)-diphenylphosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QJIMTLTYXBDJFC-UHFFFAOYSA-N 0.000 description 1
- MODAACUAXYPNJH-UHFFFAOYSA-N 1-(methoxymethyl)-4-[4-(methoxymethyl)phenyl]benzene Chemical group C1=CC(COC)=CC=C1C1=CC=C(COC)C=C1 MODAACUAXYPNJH-UHFFFAOYSA-N 0.000 description 1
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- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
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- 230000001590 oxidative effect Effects 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
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- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
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- 239000000454 talc Substances 0.000 description 1
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- MCZDHTKJGDCTAE-UHFFFAOYSA-M tetrabutylazanium;acetate Chemical compound CC([O-])=O.CCCC[N+](CCCC)(CCCC)CCCC MCZDHTKJGDCTAE-UHFFFAOYSA-M 0.000 description 1
- GTCDARUMAMVCRO-UHFFFAOYSA-M tetraethylazanium;acetate Chemical compound CC([O-])=O.CC[N+](CC)(CC)CC GTCDARUMAMVCRO-UHFFFAOYSA-M 0.000 description 1
- PSEQWFPWQRZBOO-UHFFFAOYSA-M tetrahexylazanium;benzoate Chemical compound [O-]C(=O)C1=CC=CC=C1.CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC PSEQWFPWQRZBOO-UHFFFAOYSA-M 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
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- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- 229910052845 zircon Inorganic materials 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
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- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Abstract
The epoxy resin composition contains an epoxy resin, a curing agent, an inorganic filler, and a silane compound having a structure in which a silicon atom is bonded to a chain hydrocarbon group having 6 or more carbon atoms.
Description
Technical Field
The present disclosure relates to an epoxy resin composition and an electronic component device.
Background
Conventionally, in the field of element sealing of electronic parts and devices such as transistors and ICs (Integrated circuits), resin sealing has been the mainstream in terms of productivity, cost, and the like. In recent years, high-density mounting of electronic components on a printed wiring board has been advanced. Accordingly, the semiconductor device is mainly changed from a conventional pin insertion type package to a surface mount type package. Surface mount ICs (ICs), LSIs (Large-Scale integrated circuits), and the like are thin and small packages for improving mounting sealing and reducing mounting height, and the volume occupied by an element with respect to the package increases, and the thickness of the package becomes very thin.
Further, the increase in chip area and the increase in the number of leads have been advanced due to the multifunctionality and the increase in the capacity of the device, and further, the reduction in the pad pitch and the reduction in the pad size, that is, the so-called narrow pad pitch, have been advanced by increasing the number of pads (electrodes). In order to cope with further reduction in Size and weight, the form of a Package is also shifting from QFP (Quad Flat Package), SOP (Small Outline Package), and the like to CSP (Chip Size Package), BGA (Ball Grid Array), and the like, which are more easily compatible with multi-lead and can be mounted at higher density.
As a method for resin sealing of an electronic component device, a compression molding method and the like are available in addition to a transfer molding method which is generally used (for example, see patent document 1). The compression molding method is as follows: the resin is sealed by supplying the resin composition in powder form so as to face an object to be sealed (such as a substrate on which an electronic component such as a semiconductor chip is provided) held in a mold and compressing the object and the resin composition in powder form.
Since the built-in lead is thinned with the increase in the number of functions of the package, it is a problem to suppress the occurrence of lead misalignment in transfer molding which is generally used as a sealing method. On the other hand, even when the compression molding method is used, it is desirable to suppress the viscosity from the viewpoint of filling property and the like.
Further, the amount of heat generated tends to increase with the miniaturization and densification of electronic component devices, and how to dissipate heat is an important issue. Therefore, an inorganic filler having high thermal conductivity is mixed with the sealant to improve the thermal conductivity.
When an inorganic filler is mixed in a sealing material, there is a concern that: as the amount of the inorganic filler increases, the viscosity of the sealant increases, the fluidity decreases, and problems such as poor filling and lead misalignment occur. Therefore, a method of improving the fluidity of the sealing material by using a specific phosphorus compound as a curing accelerator has been proposed (for example, see patent document 2).
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2008-279599
Patent document 2: japanese laid-open patent publication No. 9-157497
Disclosure of Invention
Problems to be solved by the invention
However, in the conventional method, there is room for improvement in suppressing the viscosity of the resin composition used as the sealing material.
In addition, with the progress of miniaturization and high density of electronic component devices, it is desired to provide a resin composition that can be used as a sealing material that maintains thermal conductivity at a higher level and suppresses an increase in viscosity.
In view of the above, an object of embodiment 1 of the present disclosure is to provide a low-viscosity epoxy resin composition and an electronic component device including an element sealed with the epoxy resin composition.
An object of embodiment 2 of the present disclosure is to provide an epoxy resin composition having high thermal conductivity and suppressed viscosity increase, and an electronic component device including an element sealed with the epoxy resin composition.
Means for solving the problems
Embodiments of the present disclosure include the following.
< 1 > an epoxy resin composition comprising an epoxy resin, a curing agent, an inorganic filler, and a silane compound having a structure in which a silicon atom is bonded to a chain hydrocarbon group having 6 or more carbon atoms.
< 2 > the epoxy resin composition according to < 1 >, wherein the chain hydrocarbon group has at least one functional group selected from the group consisting of a (meth) acryloyl group, an epoxy group and an alkoxy group.
< 3 > the epoxy resin composition according to < 1 > or < 2 >, the chain hydrocarbon group having a (meth) acryloyl group.
< 4 > the epoxy resin composition as set forth in any one of < 1 > to < 3 >, wherein the content of the inorganic filler is from 30% by volume to 99% by volume.
< 5 > the epoxy resin composition as defined in any one of < 1 > to < 4 >, wherein the inorganic filler has a thermal conductivity of 20W/(m.K) or more.
< 6 > according to the epoxy resin composition < 5 >, the above inorganic filler having a thermal conductivity of 20W/(m.K) or more contains at least one selected from the group consisting of aluminum oxide, silicon nitride, boron nitride, aluminum nitride, magnesium oxide and silicon carbide.
< 7 > an electronic component device comprising an element sealed with the epoxy resin composition as defined in any one of < 1 > to < 6 >.
Effects of the invention
According to embodiment 1 of the present disclosure, there are provided a low-viscosity epoxy resin composition and an electronic component device including an element sealed with the epoxy resin composition.
According to embodiment 2 of the present disclosure, there are provided an epoxy resin composition having high thermal conductivity and suppressed viscosity increase, and an electronic component device including an element sealed with the epoxy resin composition.
Detailed Description
Hereinafter, embodiments for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps) are not essential unless otherwise explicitly stated. The same applies to values and ranges, and the invention is not limited thereto.
In the present disclosure, the numerical range represented by "to" represents a range including numerical values recited before and after "to" as a minimum value and a maximum value, respectively.
In the numerical ranges recited in the present disclosure in stages, the upper limit value or the lower limit value recited in one numerical range may be replaced with the upper limit value or the lower limit value recited in other numerical ranges recited in stages. In the numerical ranges disclosed in the present disclosure, the upper limit or the lower limit of the numerical range may be replaced with the values shown in the examples.
In the present disclosure, a plurality of substances corresponding to the respective components may be contained. When a plurality of substances corresponding to each component are present in the composition, the content or content of each component refers to the total content or content of the plurality of substances present in the composition unless otherwise specified.
In the present disclosure, a plurality of particles corresponding to each component may be contained. When a plurality of particles corresponding to each component are present in the composition, the particle diameter of each component is a value for a mixture of the plurality of particles present in the composition unless otherwise specified.
In the present disclosure, the term (meth) acryloyl refers to at least one of acryloyl and methacryloyl.
< embodiment 1 > relates to an epoxy resin composition
An epoxy resin composition according to embodiment 1 contains an epoxy resin, a curing agent, an inorganic filler, and a silane compound having a structure in which a chain hydrocarbon group having 6 or more carbon atoms is bonded to a silicon atom. In the present disclosure, a silane compound having a structure in which a chain hydrocarbon group having 6 or more carbon atoms is bonded to a silicon atom is also referred to as a "specific silane compound". The epoxy resin composition according to embodiment 1 may contain other components as needed.
If the epoxy resin composition has the above-mentioned constitution, an epoxy resin composition having a low viscosity can be obtained. The detailed reason why the epoxy resin composition has a low viscosity when it has the above-mentioned constitution is not necessarily clear, but is presumed as follows. In general, a coupling agent having a low molecular weight such as a silane compound having a propyl group is used in the sealing resin composition in order to improve dispersibility of the inorganic filler. On the other hand, if a silane compound having a hydrocarbon group with a longer chain is used, the compatibility of the inorganic filler with the resin is improved, and the frictional resistance between the inorganic fillers is considered to be reduced. As a result, it is estimated that the melt viscosity is reduced as compared with the case where a low-molecular-weight coupling agent is used without using a specific silane compound. Further, it is presumed that by using the low-viscosity epoxy resin composition, an element in which lead wire displacement is suppressed and an electronic component device including the element can be obtained.
The components of the epoxy resin composition according to embodiment 1 will be described in detail below.
(epoxy resin)
The epoxy resin composition according to embodiment 1 contains an epoxy resin. The epoxy resin is not particularly limited in kind as long as it has an epoxy group in a molecule.
Specific examples of the epoxy resin include: will be selected from the group consisting of phenol,A novolak-type epoxy resin obtained by epoxidizing a novolak resin obtained by condensing or co-condensing a phenol compound such as cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F and the like and a naphthol compound such as α -naphthol, β -naphthol, dihydroxynaphthalene and the like under an acidic catalyst (a phenol novolak-type epoxy resin, an o-cresol novolak-type epoxy resin and the like), a triphenylmethane-type epoxy resin obtained by epoxidizing a triphenylmethane-type phenol resin obtained by condensing or co-condensing the above phenol compound and an aromatic aldehyde compound such as benzaldehyde, salicylaldehyde and the like under an acidic catalyst, a co-type epoxy resin obtained by epoxidizing a novolak resin obtained by co-condensing the above phenol compound and naphthol compound under an acidic catalyst, a diphenylmethane-type epoxy resin obtained by epoxidizing a diglycidyl ether such as bisphenol A, bisphenol F and the like, a diphenylmethane-type epoxy resin obtained by epoxidizing a diglycidyl ether such as a bisphenol A, bisphenol F and the like, a diglycidyl ether-type epoxy resin obtained by epoxidizing a diglycidyl ether such as an alkyl-substituted or unsubstituted biphenol-type epoxy ether, a diglycidyl ether obtained by co-condensation under an acidic catalyst, a diglycidyl ether obtained by reacting a diglycidyl ether, a glycidyl ether, a diglycidyl
Alicyclic epoxy resins such as alkanes; as p-xylene modified phenolic resinsA glycidyl ether para-xylene modified epoxy resin; a m-xylene-modified epoxy resin which is a glycidyl ether of a m-xylene-modified phenol resin; terpene-modified epoxy resins as glycidyl ethers of terpene-modified phenolic resins; a dicyclopentadiene-modified epoxy resin which is a glycidyl ether of a dicyclopentadiene-modified phenol resin; a cyclopentadiene-modified epoxy resin which is a glycidyl ether of a cyclopentadiene-modified phenol resin; polycyclic aromatic ring-modified epoxy resin as glycidyl ether of polycyclic aromatic ring-modified phenol resin; naphthalene type epoxy resins as glycidyl ethers of phenolic resins containing naphthalene rings; a halogenated phenol novolac type epoxy resin; p-phenylene bisphenol type epoxy resin; trimethylolpropane type epoxy resins; linear aliphatic epoxy resins obtained by oxidizing an olefin bond with a peracid such as peracetic acid; aralkyl type epoxy resins obtained by epoxidizing aralkyl type phenol resins such as phenol aralkyl resins and naphthol aralkyl resins. Further, epoxy resins such as epoxy compounds of silicone resins and epoxy compounds of acrylic resins can be cited. These epoxy resins may be used alone or in combination of two or more.
The epoxy equivalent (molecular weight/number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of balance among various properties such as moldability, reflow resistance and electrical reliability, it is preferably 100 to 1000g/eq, more preferably 150 to 500 g/eq.
The epoxy equivalent of the epoxy resin is a value measured by a method according to JIS K7236: 2009.
In the case where the epoxy resin is a solid, the softening point or melting point thereof is not particularly limited. From the viewpoint of moldability and reflow resistance, it is preferably from 40 ℃ to 180 ℃, and more preferably from 50 ℃ to 130 ℃ from the viewpoint of workability in preparing the epoxy resin composition.
The melting point of the epoxy resin is a value measured by Differential Scanning Calorimetry (DSC), and the softening point of the epoxy resin is a value measured by a method (ring and ball method) according to JIS K7234: 1986.
The content of the epoxy resin in the epoxy resin composition is preferably 0.5 to 50% by mass, more preferably 2 to 30% by mass, and still more preferably 2 to 20% by mass, from the viewpoint of strength, fluidity, heat resistance, moldability, and the like.
(curing agent)
The epoxy resin composition according to embodiment 1 contains a curing agent. The type of the curing agent is not particularly limited, and may be selected according to the type of the resin, the desired properties of the epoxy resin composition, and the like.
Examples of the curing agent include a phenol curing agent, an amine curing agent, an acid anhydride curing agent, a polythiol curing agent, a polyaminoamide curing agent, an isocyanate curing agent, and a blocked isocyanate curing agent. From the viewpoint of improving heat resistance, the curing agent preferably has a phenolic hydroxyl group in the molecule (phenolic curing agent).
Specific examples of the phenol curing agent include polyhydric phenol compounds such as resorcinol, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenol, novolak-type phenol resins obtained by condensing or co-condensing at least one phenol compound selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol, and naphthol compounds such as α -naphthol, β -naphthol, and dihydroxynaphthalene, aralkyl-type phenol resins such as phenol aralkyl resins and naphthol aralkyl resins synthesized from the above phenol compounds and dimethoxyp-xylene, bis (methoxymethyl) biphenyl, p-xylene and/or m-xylene-modified phenol resins, melamine-modified phenol resins, modified terpene-type phenol resins, dicyclopentadiene-type phenol resins and dicyclopentadiene-type naphthalene-type phenol resins synthesized by copolymerizing the above phenol compounds and dicyclopentadiene, dicyclopentadiene-type phenol resins, polycyclic aromatic ring-modified phenol resins, aromatic ring-type phenol resins, and aromatic phenol resins, and phenol resins obtained by using two or more types of phenol compounds alone or in combination with phenol formaldehyde curing agents.
The functional group equivalent (hydroxyl group equivalent in the case of a phenol curing agent) of the curing agent is not particularly limited. From the viewpoint of balance among various properties such as moldability, reflow resistance and electrical reliability, it is preferably from 70g/eq to 1000g/eq, more preferably from 80g/eq to 500 g/eq.
The functional group equivalent (hydroxyl group equivalent in the case of a phenol curing agent) of the curing agent is a value measured by a method according to JIS K0070: 1992.
In the case where the curing agent is a solid, the softening point or melting point thereof is not particularly limited. From the viewpoint of moldability and reflow resistance, it is preferably from 40 ℃ to 180 ℃, and from the viewpoint of workability in the production of the epoxy resin composition, it is more preferably from 50 ℃ to 130 ℃.
The melting point or softening point of the curing agent is measured in the same manner as the melting point or softening point of the epoxy resin.
The equivalent ratio of the epoxy resin to the curing agent, that is, the ratio of the number of functional groups in the curing agent to the number of epoxy groups in the epoxy resin (the number of functional groups in the curing agent/the number of epoxy groups in the epoxy resin) is not particularly limited. From the viewpoint of suppressing the amount of unreacted components, the amount is preferably in the range of 0.5 to 2.0, more preferably 0.6 to 1.3. From the viewpoint of moldability and reflow resistance, the range of 0.8 to 1.2 is more preferable.
(inorganic Filler)
The epoxy resin composition according to embodiment 1 contains an inorganic filler. The material of the inorganic filler is not particularly limited.
Specific examples of the material of the inorganic filler include: inorganic materials such as fused silica, crystalline silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, magnesium oxide, silicon carbide, beryllium oxide, zirconium oxide, zircon, forsterite, steatite, spinel, mullite, titanium dioxide, talc, clay, mica, and the like. Inorganic fillers having a flame retardant effect may also be used. Examples of the inorganic filler having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, a composite metal hydroxide such as a composite hydroxide of magnesium and zinc, zinc borate, and the like.
Among the inorganic fillers, silica such as fused silica is preferable from the viewpoint of a reduction in the linear expansion coefficient, and alumina is preferable from the viewpoint of high thermal conductivity.
The shape of the inorganic filler is not particularly limited, and is preferably spherical in view of filling properties and mold wear.
One kind of the inorganic filler may be used alone, or two or more kinds may be used in combination. The "combination of two or more inorganic fillers" includes, for example: the case where two or more inorganic fillers having the same components and different average particle diameters are used; the case where two or more inorganic fillers having the same average particle size and different components are used; and the case of using two or more inorganic fillers having different average particle diameters and different types.
The content of the inorganic filler in the epoxy resin composition according to embodiment 1 is not particularly limited. From the viewpoint of further improving the properties of the cured product, such as the thermal expansion coefficient, thermal conductivity, and elastic modulus, the content of the inorganic filler is preferably 30% by volume or more, more preferably 35% by volume or more, still more preferably 40% by volume or more, particularly preferably 45% by volume or more, and very preferably 50% by volume or more of the entire epoxy resin composition. The content of the inorganic filler is preferably 99% by volume or less, more preferably 98% by volume or less, and still more preferably 97% by volume or less of the entire epoxy resin composition, from the viewpoints of improvement in fluidity, reduction in viscosity, and the like.
For example, when the epoxy resin composition is used for compression molding, the content of the inorganic filler may be 70 to 99 vol%, 80 to 99 vol%, 83 to 99 vol%, or 85 to 99 vol% of the entire epoxy resin composition.
The content of the inorganic filler in the epoxy resin composition was measured as follows. First, the total mass of a cured product (epoxy resin molded product) of the epoxy resin composition was measured, and the epoxy resin molded product was fired at 400 ℃ for 2 hours and then at 700 ℃ for 3 hours to evaporate the resin component, thereby measuring the mass of the remaining inorganic filler. The volume was calculated from the obtained masses and the specific gravities thereof, and the ratio of the volume of the inorganic filler to the total volume of the epoxy resin molded product was obtained and used as the content of the inorganic filler.
When the inorganic filler is in the form of particles, the average particle diameter thereof is not particularly limited. For example, the volume average particle diameter of the entire inorganic filler is preferably 80 μm or less, may be 50 μm or less, may be 40 μm or less, may be 30 μm or less, may be 25 μm or less, may be 20 μm or less, and may be 15 μm or less. The volume average particle diameter of the entire inorganic filler is preferably 0.1 μm or more, more preferably 0.2 μm or more, and still more preferably 0.3 μm or more. When the volume average particle diameter of the inorganic filler is 0.1 μm or more, the increase in viscosity of the epoxy resin composition tends to be further suppressed. When the volume average particle diameter is 80 μm or less, the filling property into the narrow gap tends to be further improved. The volume average particle diameter of the inorganic filler can be measured as a particle diameter (D50) at which the cumulative particle diameter from the smaller diameter side becomes 50% in a volume-based particle size distribution measured by a laser scattering diffraction particle size distribution measuring apparatus.
In the case where an epoxy resin composition is used for mold underfill application or the like, the inorganic filler is preferably controlled in the maximum particle diameter (cut point) from the viewpoint of improving the filling property to a narrow gap. The maximum particle diameter of the inorganic filler can be suitably adjusted, and is preferably 105 μm or less, more preferably 75 μm or less, and may be 60 μm or less, and may be 40 μm or less, from the viewpoint of filling property. The maximum particle diameter can be measured by a laser diffraction particle size distribution meter (trade name: LA920, manufactured by horiba, Ltd.).
(specific silane Compound)
The epoxy resin composition according to embodiment 1 contains a specific silane compound. The specific silane compound has a structure in which a chain hydrocarbon group having 6 or more carbon atoms (hereinafter, the chain hydrocarbon group having 6 or more carbon atoms is also simply referred to as a chain hydrocarbon group) is bonded to a silicon atom. The chain hydrocarbon group may be branched or may have a substituent. In the present disclosure, the number of carbon atoms of the chain hydrocarbon group means the number of carbon atoms not containing a branch or a substituent. The chain hydrocarbon group may or may not contain an unsaturated bond, and preferably does not contain an unsaturated bond.
The specific silane compound is considered to function as a coupling agent for the inorganic filler in the epoxy resin composition.
The number of chain hydrocarbon groups bonded to silicon atoms in the specific silane compound is only required to be 1 to 4, preferably 1 to 3, more preferably 1 or 2, and still more preferably 1.
When the number of chain hydrocarbon groups bonded to silicon atoms in the specific silane compound is 1 to 3, the atoms or atomic groups other than the chain hydrocarbon groups bonded to silicon atoms are not particularly limited, and may be independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group, an aryl group, an aryloxy group, or the like. Among these, 1 or more alkoxy groups are preferably bonded in addition to the chain hydrocarbon group, and 1 chain hydrocarbon group and 3 alkoxy groups are more preferably bonded to a silicon atom.
The number of carbon atoms of the chain hydrocarbon group of the specific silane compound is not less than 6, and from the viewpoint of suppressing viscosity, it is preferably not less than 7, and more preferably not less than 8. The upper limit of the number of carbon atoms of the chain hydrocarbon group of the specific silane compound is not particularly limited, but is preferably not more than 12, more preferably not more than 11, and still more preferably not more than 10, from the viewpoints of dispersibility in a resin, physical property balance of a cured product, and the like.
When the chain hydrocarbon group has a substituent, the substituent is not particularly limited. The substituent may be present at the end of the chain hydrocarbon group or may be present in a side chain of the chain hydrocarbon group.
The chain hydrocarbon group preferably has at least one functional group (hereinafter, also referred to as a specific functional group) selected from a (meth) acryloyl group, an epoxy group, and an alkoxy group, more preferably has at least one functional group selected from a (meth) acryloyl group and an epoxy group, and further preferably has a (meth) acryloyl group. The specific functional group may be present at the end of the chain hydrocarbon group or may be present in a side chain of the chain hydrocarbon group. The specific functional group is preferably present at the terminal of the chain hydrocarbon group from the viewpoint of suppressing viscosity.
If the chain hydrocarbon group in the specific silane compound has a specific functional group, the viscosity of the epoxy resin composition tends to be further reduced. The reason for this is not necessarily clear, but is presumed to be: when the chain hydrocarbon group of the specific silane compound has a specific functional group, the compatibility between the specific functional group and the epoxy resin is improved, and the dispersibility between the epoxy resin and the inorganic filler is improved.
When the chain hydrocarbon group has a (meth) acryloyl group, the (meth) acryloyl group may be bonded directly to the chain hydrocarbon group or may be bonded through another atom or atom group. For example, the chain hydrocarbon group may have a (meth) acryloyloxy group. Among them, the chain hydrocarbon group preferably has a methacryloxy group.
When the chain hydrocarbon group has an epoxy group, the epoxy group may be directly bonded to the chain hydrocarbon group or may be bonded to the chain hydrocarbon group through another atom or atom group. For example, the chain hydrocarbon group may have a glycidyloxy group, an alicyclic epoxy group, or the like. Among them, the chain hydrocarbon group preferably has a glycidyloxy group.
When the chain hydrocarbon group has an alkoxy group, the alkoxy group may be directly bonded to the chain hydrocarbon group, may be bonded through another atom or atom group, and is preferably directly bonded to the chain hydrocarbon group. The alkoxy group is not particularly limited, and may be methoxy, ethoxy, propoxy, isopropoxy, or the like. Among them, the chain hydrocarbon group preferably has a methoxy group from the viewpoint of easy acquisition.
The equivalent weight (molecular weight/number of functional groups) of at least one functional group selected from a (meth) acryloyl group, an epoxy group, and an alkoxy group in the specific silane compound is not particularly limited. From the viewpoint of reducing the viscosity of the epoxy resin composition, it is preferably 200g/eq to 420g/eq, more preferably 210g/eq to 405g/eq, and still more preferably 230g/eq to 390 g/eq.
Specific examples of the silane compound include: hexyltrimethoxysilane, heptyltrimethoxysilane, octyltrimethoxysilane, hexyltriethoxysilane, heptyltriethoxysilane, octyltriethoxysilane, 6-glycidoxyhexyltrimethoxysilane, 7-glycidoxyheptyltrimethoxysilane, 8-glycidoxyoctyltrimethoxysilane, 6- (meth) acryloyloxyhexyltrimethoxysilane, 7- (meth) acryloyloxyheptyltrimethoxysilane, 8- (meth) acryloyloxyoctyltrimethoxysilane, decyltrimethoxysilane, etc. Among these, 8-glycidoxyoctyltrimethoxysilane and 8-methacryloxyoctyltrimethoxysilane are preferable from the viewpoint of reducing the viscosity of the epoxy resin composition. The specific silane compound may be used alone or in combination of two or more.
The specific silane compound may be synthesized, or a commercially available silane compound may be used. Specific commercially available silane compounds include KBM-3063 (hexyltrimethoxysilane), KBE-3063 (hexyltriethoxysilane), KBE-3083 (octyltriethoxysilane), KBM-4803 (8-glycidoxyoctyltrimethoxysilane), KBM-5803 (8-methacryloxyoctyltrimethoxysilane), and KBM-3103C (decyltrimethoxysilane), which are available from shin-Etsu chemical industries, Ltd.
The content of the specific silane compound in the epoxy resin composition according to embodiment 1 is not particularly limited. The content of the specific silane compound may be 0.01 parts by mass or more and may be 0.02 parts by mass or more with respect to 100 parts by mass of the inorganic filler. The content of the specific silane compound is preferably not more than 5 parts by mass, and more preferably not more than 2.5 parts by mass, per 100 parts by mass of the inorganic filler. If the content of the specific silane compound is 0.01 parts by mass or more per 100 parts by mass of the inorganic filler, a composition having a low viscosity tends to be obtained. If the content of the specific silane compound is less than or equal to 5 parts by mass with respect to 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
(other coupling Agents)
The epoxy resin composition according to embodiment 1 may further contain another coupling agent in addition to the specific silane compound. The other coupling agent is not particularly limited as long as it is a coupling agent generally used in epoxy resin compositions. Examples of the other coupling agent include known coupling agents such as silane-based compounds (excluding specific silane compounds) such as epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, and vinyl silane, titanium-based compounds, aluminum chelate compounds, and aluminum/zirconium-based compounds. The other coupling agents may be used alone or in combination of two or more.
When the epoxy resin composition according to embodiment 1 contains a coupling agent other than the specific silane compound, the total content of the specific silane compound and the coupling agent may be 0.01 parts by mass or more and may be 0.02 parts by mass or more per 100 parts by mass of the inorganic filler. The total content of the specific silane compound and the other coupling agent is preferably not more than 5 parts by mass, and more preferably not more than 2.5 parts by mass, per 100 parts by mass of the inorganic filler. If the total content of the specific silane compound and the other coupling agent is 0.01 parts by mass or more per 100 parts by mass of the inorganic filler, a composition having a low viscosity tends to be obtained. If the total content of the specific silane compound and the other coupling agent is less than or equal to 5 parts by mass with respect to 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
In the case where the epoxy resin composition according to embodiment 1 contains a coupling agent other than the specific silane compound, the content of the coupling agent is preferably 90% by mass or less, more preferably 70% by mass or less, and still more preferably 50% by mass or less, based on the total amount of the specific silane compound and the coupling agent, from the viewpoint of satisfactorily exerting the function of the specific silane compound.
(curing accelerators)
The epoxy resin composition according to embodiment 1 may contain a curing accelerator. The type of the curing accelerator is not particularly limited, and may be selected according to the type of the epoxy resin, the desired properties of the epoxy resin composition, and the like.
Examples of the curing accelerator include: 1, 5-diazabicyclo [4.3.0 ]]Nonene-5 (DBN), 1, 8-diazabicyclo [5.4.0]Diazabicycloalkenes such as undecene-7 (DBU); cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and 2-heptadecylimidazole; derivatives of the above cyclic amidine compounds; phenol novolac salts of the above cyclic amidine compounds or derivatives thereof; compounds having intramolecular polarization obtained by adding a quinone compound such as maleic anhydride, 1, 4-benzoquinone, 2, 5-toluquinone, 1, 4-naphthoquinone, 2, 3-dimethylbenzoquinone, 2, 6-dimethylbenzoquinone, 2, 3-dimethoxy-5-methyl-1, 4-benzoquinone, 2, 3-dimethoxy-1, 4-benzoquinone, phenyl-1, 4-benzoquinone, or a compound having a pi bond such as diazophenylmethane to these compounds; cyclic amidines such as tetraphenylborate of DBU, tetraphenylborate of DBN, tetraphenylborate of 2-ethyl-4-methylimidazole and tetraphenylborate of N-methylmorpholine
A compound; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris (dimethylaminomethyl) phenol; derivatives of the above tertiary amine compounds; ammonium salt compounds such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, tetrapropylammonium hydroxide and the like; tertiary phosphines such as triphenylphosphine, diphenyl (p-tolyl) phosphine, tri (alkylphenyl) phosphine, tri (alkoxyphenyl) phosphine, tri (alkyl-alkoxyphenyl) phosphine, tri (dialkylphenyl) phosphine, tri (trialkylphenyl) phosphine, tri (tetraalkylphenyl) phosphine, tri (dialkoxyphenyl) phosphine, tri (trialkoxyphenyl) phosphine, tri (tetraalkoxyphenyl) phosphine, trialkylphosphine, dialkylarylphosphine, and alkyldiarylphosphine; on the upper partPhosphine compounds such as complexes of the above tertiary phosphines with organic boron compounds; a compound having intramolecular polarization formed by adding the tertiary phosphine or the phosphine compound to a quinone compound such as maleic anhydride, 1, 4-benzoquinone, 2, 5-toluquinone, 1, 4-naphthoquinone, 2, 3-dimethylbenzoquinone, 2, 6-dimethylbenzoquinone, 2, 3-dimethoxy-5-methyl-1, 4-benzoquinone, 2, 3-dimethoxy-1, 4-benzoquinone, or phenyl-1, 4-benzoquinone, or a compound having a pi bond such as diazophenylmethane; reacting the tertiary phosphine or the phosphine compound with 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodophenol, 3-iodophenol, 2-iodophenol, a compound having intramolecular polarization obtained by reacting a halogenated phenol compound such as 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2, 6-dimethylphenol, 4-bromo-3, 5-dimethylphenol, 4-bromo-2, 6-di-tert-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, or 4-bromo-4' -hydroxybiphenyl, and then dehydrohalogenating the resultant product; tetraphenyl radical
Isoquaternary substitution
Tetra-substitution of tetra-p-tolylborate with no phenyl group bonded to boron atom
And a tetra-substituted borate; tetraphenyl radical
Salts with phenolic compounds, and the like. The curing accelerator may be used singly or in combination of two or more.
When the epoxy resin composition according to embodiment 1 contains a curing accelerator, the amount of the curing accelerator is preferably 0.1 to 30 parts by mass, more preferably 1 to 15 parts by mass, based on 100 parts by mass of the resin component (i.e., the total of the resin and the curing agent). If the amount of the curing accelerator is 0.1 parts by mass or more per 100 parts by mass of the resin component, the curing tends to be good in a short time. If the amount of the curing accelerator is 30 parts by mass or less based on 100 parts by mass of the resin component, the curing rate tends not to be too high, and a good molded article tends to be obtained.
[ various additives ]
The epoxy resin composition according to embodiment 1 may contain various additives such as an ion exchanger, a release agent, a flame retardant, a colorant, and a stress relaxation agent, which are exemplified below, in addition to the above components. The epoxy resin composition according to embodiment 1 may contain, in addition to the additives exemplified below, various additives well known in the art as needed.
(ion exchanger)
The epoxy resin composition according to embodiment 1 may contain an ion exchanger. In particular, when the epoxy resin composition according to embodiment 1 is used as a molding material for sealing, it is preferable to contain an ion exchanger from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of an electronic component device including an element to be sealed. The ion exchanger is not particularly limited, and conventionally known ion exchangers can be used. Specifically, there may be mentioned hydrotalcite compounds, hydrous oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium and bismuth, and the like. One kind of ion exchanger may be used alone, or two or more kinds may be used in combination. Among them, hydrotalcite represented by the following general formula (a) is preferable.
Mg(1-X)AlX(OH)2(CO3)X/2·mH2O······(A)
(X is more than 0 and less than or equal to 0.5, and m is a positive number)
When the epoxy resin composition according to embodiment 1 contains an ion exchanger, the content thereof is not particularly limited as long as it is an amount sufficient to capture halogen ions and the like. For example, the amount is preferably 0.1 to 30 parts by mass, and more preferably 1 to 10 parts by mass, based on 100 parts by mass of the resin component.
(mold releasing agent)
The epoxy resin composition according to embodiment 1 may contain a release agent from the viewpoint of obtaining good releasability from a mold during molding. The release agent is not particularly limited, and a conventionally known release agent can be used. Specifically, there may be mentioned: and higher fatty acids such as carnauba wax, montanic acid, stearic acid, etc., ester waxes such as higher fatty acid metal salts, montanic acid esters, etc., and polyolefin waxes such as oxidized polyethylene, non-oxidized polyethylene, etc. The release agent may be used alone or in combination of two or more.
When the epoxy resin composition according to embodiment 1 contains a release agent, the amount of the release agent is preferably 0.01 to 10 parts by mass, and more preferably 0.1 to 5 parts by mass, based on 100 parts by mass of the resin component. If the amount of the release agent is 0.01 parts by mass or more per 100 parts by mass of the resin component, sufficient releasability tends to be obtained. When the amount is 10 parts by mass or less, more excellent adhesiveness and curability tend to be obtained.
(flame retardant)
The epoxy resin composition according to embodiment 1 may contain a flame retardant. The flame retardant is not particularly limited, and conventionally known flame retardants can be used. Specifically, examples thereof include organic or inorganic compounds containing a halogen atom, an antimony atom, a nitrogen atom or a phosphorus atom, and metal hydroxides. One kind of the flame retardant may be used alone, or two or more kinds may be used in combination.
When the epoxy resin composition according to embodiment 1 contains a flame retardant, the amount of the flame retardant is not particularly limited as long as the flame retardant is in an amount sufficient to obtain a desired flame retardant effect. For example, the amount is preferably 1 to 30 parts by mass, and more preferably 2 to 20 parts by mass, based on 100 parts by mass of the resin component.
(coloring agent)
The epoxy resin composition according to embodiment 1 may further contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, red lead, and red iron oxide. The content of the colorant may be appropriately selected depending on the purpose and the like. The colorant may be used alone or in combination of two or more.
(stress-relieving agent)
The epoxy resin composition according to embodiment 1 may contain a stress relaxation agent such as silicone oil or silicone rubber particles. By containing the stress relaxation agent, the warpage of the package and the generation of package cracks can be further reduced. As the stress relaxation agent, a generally used known stress relaxation agent (flexibility agent) can be mentioned. Specifically, there may be mentioned: thermoplastic elastomers such as silicone-based, styrene-based, olefin-based, urethane-based, polyester-based, polyether-based, polyamide-based, and polybutadiene-based elastomers, rubber particles such as NR (natural rubber), NBR (acrylonitrile-butadiene rubber), acrylic rubber, urethane rubber, and silicone powder, and rubber particles having a core-shell structure such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, and methyl methacrylate-butyl acrylate copolymer. The stress relaxation agent may be used alone or in combination of two or more.
< embodiment 2 > an epoxy resin composition
The epoxy resin composition according to embodiment 2 contains: an epoxy resin, a curing agent, an inorganic filler having a thermal conductivity of 20W/(m.K) or more, and a silane compound (specific silane compound) having a structure in which a chain hydrocarbon group having 6 or more carbon atoms is bonded to a silicon atom. The thermal conductivity of the inorganic filler in the present disclosure is defined as the thermal conductivity at room temperature (25 ℃). The epoxy resin composition according to embodiment 2 may contain other components as needed.
With the above configuration, an epoxy resin composition having high thermal conductivity and suppressed viscosity increase can be obtained. The detailed reason why the epoxy resin composition according to embodiment 2 exerts the above-described effects is not necessarily clear, but can be estimated as follows.
In general, a coupling agent having a low molecular weight such as a silane compound having a propyl group is used for improving the dispersibility of the inorganic filler in the sealing resin composition. In this regard, it is believed that: when a silane compound having a hydrocarbon group with a longer chain is used, the compatibility of the inorganic filler with the resin is improved, and the frictional resistance between the inorganic fillers is reduced. As a result, it is presumed that: the melt viscosity is lowered as compared with the case where a coupling agent of low molecular weight is used without using a specific silane compound. It is presumed that: the amount of the inorganic filler having high thermal conductivity can be increased while suppressing an increase in viscosity, and high thermal conductivity can be achieved as compared with the conventional one.
The components of the epoxy resin composition according to embodiment 2 will be described in detail below.
(epoxy resin)
The epoxy resin composition according to embodiment 2 contains an epoxy resin. The details of the epoxy resin are the same as those of the epoxy resin used in the epoxy resin composition according to embodiment 1.
(curing agent)
The epoxy resin composition according to embodiment 2 contains a curing agent. The details of the curing agent are the same as those of the curing agent used in the epoxy resin composition according to embodiment 1.
(inorganic Filler)
The epoxy resin composition according to embodiment 2 contains an inorganic filler having a thermal conductivity of 20W/(m · K) or more. The material of the inorganic filler is not particularly limited as long as it has the above thermal conductivity.
In the present disclosure, an inorganic filler having a thermal conductivity of 20W/(m.K) or more means an inorganic filler composed of a material having a thermal conductivity of 20W/(m.K) or more at room temperature (25 ℃ C.). The thermal conductivity of the inorganic filler can be obtained by measuring the thermal conductivity of the material constituting the inorganic filler by a xenon flash (Xe-flash) method or a hot-wire method.
The inorganic filler has a thermal conductivity of 20W/(mK) or more, and preferably 25W/(mK) or more from the viewpoint of heat dissipation when the inorganic filler is used as a cured product. The upper limit of the thermal conductivity of the inorganic filler is not particularly limited, and may be 500W/(m.K) or less, or 300W/(m.K) or less.
Specific examples of the material of the inorganic filler having the thermal conductivity include alumina, silicon nitride, boron nitride, aluminum nitride, magnesium oxide, and silicon carbide. Among them, alumina is preferable from the viewpoint of high sphericity, high moisture resistance, and the like.
The shape of the inorganic filler is not particularly limited, and is preferably spherical in view of filling properties and mold wear.
One kind of the inorganic filler may be used alone, or two or more kinds may be used in combination. The "combination of two or more inorganic fillers" includes, for example: the case where two or more inorganic fillers having the same components and different average particle diameters are used; the case where two or more inorganic fillers having the same average particle size and different components are used; and the case of using two or more inorganic fillers having different average particle diameters and different types.
The content of the inorganic filler in the epoxy resin composition according to embodiment 2 is not particularly limited. From the viewpoint of further improving the properties of the cured product, such as the thermal expansion coefficient, thermal conductivity, and elastic modulus, the content of the inorganic filler is preferably 30% by volume or more, more preferably 35% by volume or more, still more preferably 40% by volume or more, particularly preferably 45% by volume or more, and very preferably 50% by volume or more of the entire epoxy resin composition. The content of the inorganic filler is preferably 99% by volume or less, more preferably 98% by volume or less, and still more preferably 97% by volume or less of the entire epoxy resin composition, from the viewpoints of improvement in fluidity, reduction in viscosity, and the like.
The content of the inorganic filler in the epoxy resin composition according to embodiment 2 is preferably 30 to 99 vol%, more preferably 35 to 99 vol%, still more preferably 40 to 98 vol%, particularly preferably 45 to 97 vol%, and most preferably 50 to 97 vol%.
The content of the inorganic filler in the epoxy resin composition was measured as follows. First, the total mass of a cured product (epoxy resin molded product) of the epoxy resin composition was measured, and the epoxy resin molded product was fired at 400 ℃ for 2 hours and then at 700 ℃ for 3 hours to evaporate the resin component, thereby measuring the mass of the remaining inorganic filler. The volume was calculated from the obtained masses and the specific gravities thereof, and the ratio of the volume of the inorganic filler to the total volume of the epoxy resin molded product was obtained and used as the content of the inorganic filler.
When the inorganic filler is in the form of particles, the average particle diameter thereof is not particularly limited. For example, the volume average particle diameter of the entire inorganic filler is preferably 80 μm or less, may be 50 μm or less, may be 40 μm or less, may be 30 μm or less, may be 25 μm or less, may be 20 μm or less, and may be 15 μm or less. The volume average particle diameter of the entire inorganic filler is preferably 0.1 μm or more, more preferably 0.2 μm or more, and still more preferably 0.3 μm or more. When the volume average particle diameter of the inorganic filler is 0.1 μm or more, the increase in viscosity of the epoxy resin composition tends to be further suppressed. If the volume average particle diameter is 80 μm or less, the filling property into the narrow gap tends to be further improved. The volume average particle diameter of the inorganic filler can be measured as a particle diameter (D50) when the cumulative particle diameter from the smaller diameter side becomes 50% in a volume-based particle size distribution measured by a laser scattering diffraction particle size distribution measuring apparatus.
In the case where the epoxy resin composition is used for an underfill application for molding, the inorganic filler is preferably controlled in the maximum particle diameter (cut point) from the viewpoint of improving the filling property for a narrow gap. The maximum particle diameter of the inorganic filler can be suitably adjusted, and is preferably 105 μm or less, more preferably 75 μm or less, and may be 60 μm or less, and may be 40 μm or less, from the viewpoint of filling property. The maximum particle diameter can be measured by a laser diffraction particle size distribution meter (trade name: LA920, manufactured by horiba, Ltd.).
(specific silane Compound)
The epoxy resin composition according to embodiment 2 contains a specific silane compound. The specific silane compound has a structure in which a chain hydrocarbon group having 6 or more carbon atoms (hereinafter, the chain hydrocarbon group having 6 or more carbon atoms is also simply referred to as a chain hydrocarbon group) is bonded to a silicon atom. The chain hydrocarbon group may be branched or may have a substituent. In the present disclosure, the number of carbon atoms of the chain hydrocarbon group means the number of carbon atoms not containing a branch or a substituent. The chain hydrocarbon group may or may not contain an unsaturated bond, and preferably does not contain an unsaturated bond.
The specific silane compound is considered to function as a coupling agent for the inorganic filler in the epoxy resin composition.
The atoms or groups other than the chain hydrocarbon groups bonded to the silicon atoms are not particularly limited, and may be each independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group, an aryl group, an aryloxy group, or the like. Among these, 1 or more alkoxy groups are preferably bonded in addition to the chain hydrocarbon group, and 1 chain hydrocarbon group and 3 alkoxy groups are more preferably bonded to a silicon atom.
The number of carbon atoms of the chain hydrocarbon group of the specific silane compound is not less than 6, and from the viewpoint of suppressing viscosity, it is preferably not less than 7, and more preferably not less than 8. The upper limit of the number of carbon atoms of the chain hydrocarbon group of the specific silane compound is not particularly limited, but is preferably not more than 12, more preferably not more than 11, and still more preferably not more than 10, from the viewpoints of dispersibility in a resin, physical property balance of a cured product, and the like.
When the chain hydrocarbon group has a substituent, the substituent is not particularly limited. The substituent may be present at the end of the chain hydrocarbon group or may be present in a side chain of the chain hydrocarbon group.
The chain hydrocarbon group preferably has at least one functional group (hereinafter, also referred to as a specific functional group) selected from a (meth) acryloyl group, an epoxy group, and an alkoxy group, more preferably has at least one functional group selected from a (meth) acryloyl group and an epoxy group, and further preferably has a (meth) acryloyl group. The specific functional group may be present at the end of the chain hydrocarbon group or may be present in a side chain of the chain hydrocarbon group. The specific functional group is preferably present at the terminal of the chain hydrocarbon group from the viewpoint of suppressing viscosity.
If the chain hydrocarbon group in the specific silane compound has a specific functional group, the viscosity of the epoxy resin composition tends to be further reduced. The reason for this is not necessarily clear, but is presumed to be: when the chain hydrocarbon group of the specific silane compound has a specific functional group, the compatibility between the specific functional group and the epoxy resin is improved, and the dispersibility between the epoxy resin and the inorganic filler is improved.
When the chain hydrocarbon group has a (meth) acryloyl group, the (meth) acryloyl group may be bonded directly to the chain hydrocarbon group or may be bonded through another atom or atom group. For example, the chain hydrocarbon group may have a (meth) acryloyloxy group. Among them, the chain hydrocarbon group preferably has a methacryloxy group.
When the chain hydrocarbon group has an epoxy group, the epoxy group may be directly bonded to the chain hydrocarbon group or may be bonded to the chain hydrocarbon group through another atom or atom group. For example, the chain hydrocarbon group may have a glycidyloxy group, an alicyclic epoxy group, or the like. Among them, the chain hydrocarbon group preferably has a glycidyloxy group.
When the chain hydrocarbon group has an alkoxy group, the alkoxy group may be directly bonded to the chain hydrocarbon group, may be bonded through another atom or atom group, and is preferably directly bonded to the chain hydrocarbon group. The alkoxy group is not particularly limited, and may be methoxy, ethoxy, propoxy, isopropoxy, or the like. Among them, the chain hydrocarbon group preferably has a methoxy group from the viewpoint of easy acquisition.
The equivalent weight (molecular weight/number of functional groups) of at least one functional group selected from a (meth) acryloyl group, an epoxy group, and an alkoxy group in the specific silane compound is not particularly limited. From the viewpoint of reducing the viscosity of the epoxy resin composition, it is preferably 200g/eq to 420g/eq, more preferably 210g/eq to 405g/eq, and still more preferably 230g/eq to 390 g/eq.
Specific examples of the silane compound include: hexyltrimethoxysilane, heptyltrimethoxysilane, octyltrimethoxysilane, hexyltriethoxysilane, heptyltriethoxysilane, octyltriethoxysilane, 6-glycidoxyhexyltrimethoxysilane, 7-glycidoxyheptyltrimethoxysilane, 8-glycidoxyoctyltrimethoxysilane, 6- (meth) acryloyloxyhexyltrimethoxysilane, 7- (meth) acryloyloxyheptyltrimethoxysilane, 8- (meth) acryloyloxyoctyltrimethoxysilane, decyltrimethoxysilane, etc. Among these, 8-glycidoxyoctyltrimethoxysilane and 8-methacryloxyoctyltrimethoxysilane are preferable from the viewpoint of reducing the viscosity of the epoxy resin composition. The specific silane compound may be used alone or in combination of two or more.
The specific silane compound may be synthesized, or a commercially available silane compound may be used. Specific commercially available silane compounds include KBM-3063 (hexyltrimethoxysilane), KBE-3063 (hexyltriethoxysilane), KBE-3083 (octyltriethoxysilane), KBM-4803 (8-glycidoxyoctyltrimethoxysilane), KBM-5803 (8-methacryloxyoctyltrimethoxysilane), and KBM-3103C (decyltrimethoxysilane), which are available from shin-Etsu chemical industries, Ltd.
The content of the specific silane compound in the epoxy resin composition according to embodiment 2 is not particularly limited. The content of the specific silane compound may be 0.01 parts by mass or more and may be 0.02 parts by mass or more with respect to 100 parts by mass of the inorganic filler. The content of the specific silane compound is preferably not more than 5 parts by mass, and more preferably not more than 2.5 parts by mass, per 100 parts by mass of the inorganic filler. If the content of the specific silane compound is 0.01 parts by mass or more per 100 parts by mass of the inorganic filler, a composition having a low viscosity tends to be obtained. If the content of the specific silane compound is less than or equal to 5 parts by mass with respect to 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
(other coupling Agents)
The epoxy resin composition according to embodiment 2 may further contain another coupling agent in addition to the specific silane compound. The other coupling agent is not particularly limited as long as it is a coupling agent generally used in epoxy resin compositions. Examples of the other coupling agent include known coupling agents such as silane-based compounds (excluding specific silane compounds) such as epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, and vinyl silane, titanium-based compounds, aluminum chelate compounds, and aluminum/zirconium-based compounds. The other coupling agents may be used alone or in combination of two or more.
When the epoxy resin composition according to embodiment 2 contains a coupling agent other than the specific silane compound, the total content of the specific silane compound and the coupling agent may be 0.01 parts by mass or more and may be 0.02 parts by mass or more per 100 parts by mass of the inorganic filler. The total content of the specific silane compound and the other coupling agent is preferably not more than 5 parts by mass, and more preferably not more than 2.5 parts by mass, per 100 parts by mass of the inorganic filler. If the total content of the specific silane compound and the other coupling agent is 0.01 parts by mass or more per 100 parts by mass of the inorganic filler, a composition having a low viscosity tends to be obtained. If the total content of the specific silane compound and the other coupling agent is less than or equal to 5 parts by mass with respect to 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
In the case where the epoxy resin composition according to embodiment 2 contains a coupling agent other than the specific silane compound, the content of the coupling agent is preferably 90% by mass or less, more preferably 70% by mass or less, and still more preferably 50% by mass or less, based on the total amount of the specific silane compound and the coupling agent, from the viewpoint of satisfactorily exerting the function of the specific silane compound.
(curing accelerators)
The epoxy resin composition according to embodiment 2 may contain a curing accelerator. The details of the curing accelerator are the same as those of the curing accelerator used in the epoxy resin composition according to embodiment 1.
[ various additives ]
The epoxy resin composition according to embodiment 2 may contain various additives such as an ion exchanger, a release agent, a flame retardant, a colorant, and a stress relaxation agent in addition to the above components. The details of the various additives are the same as those of the various additives used in the epoxy resin composition according to embodiment 1.
[ Properties of epoxy resin composition ]
Hereinafter, the physical properties of the epoxy resin compositions according to embodiment 1 and embodiment 2 of the present disclosure will be described.
(viscosity of epoxy resin composition)
The viscosity of the epoxy resin composition is not particularly limited. Since the ease of occurrence of lead offset during molding varies depending on the molding method, the composition of the epoxy resin composition, and the like, it is preferable to adjust the viscosity to a desired value depending on the molding method, the composition of the epoxy resin composition, and the like.
For example, in the case of molding the epoxy resin composition by compression molding, from the viewpoint of reducing lead offset, it is preferably not more than 200Pa · s, more preferably not more than 150Pa · s, further preferably not more than 100Pa · s, particularly preferably not more than 50Pa · s, and may be not more than 16Pa · s, and may be not more than 10Pa · s at 175 ℃. The lower limit of the viscosity is not particularly limited, and may be, for example, 5 pas or more.
In addition, for example, in the case of molding the epoxy resin composition by a transfer molding method, from the viewpoint of reducing lead offset, it is preferably not more than 200Pa · s, more preferably not more than 150Pa · s, further preferably not more than 100Pa · s, and may be not more than 68Pa · s, and may be not more than 54Pa · s at 175 ℃. The lower limit of the viscosity is not particularly limited, and may be, for example, 5 pas or more.
The viscosity of the epoxy resin composition can be measured by an elevated flow tester (manufactured by Shimadzu corporation).
(thermal conductivity when made into a cured product)
The thermal conductivity when the epoxy resin composition is formed into a cured product is not particularly limited. From the viewpoint of obtaining the desired heat dissipation property, it may be 3.0W/(mK), 4.0W/(mK), 5.0W/(mK), 6.0W/(mK), 7.0W/(mK), or 8.0W/(mK) at room temperature (25 ℃ C.). The upper limit of the thermal conductivity is not particularly limited, and may be 9.0W/(m.K).
The thermal conductivity of the cured product can be measured by the xenon Flash (Xe-Flash) method (trade name LFA467 type Hyper Flash apparatus manufactured by NETZSCH).
[ method for preparing epoxy resin composition ]
The method for preparing the epoxy resin composition according to embodiment 1 and embodiment 2 is not particularly limited. A general method includes a method of sufficiently mixing the respective components with a mixer or the like, melt-kneading the mixture with a grinding roll, an extruder, or the like, and cooling and pulverizing the mixture. More specifically, for example, the above components are stirred and mixed, and kneaded, cooled and pulverized by a kneader, roll, extruder or the like heated to 70 to 140 ℃.
The epoxy resin composition may be solid or liquid at normal temperature and pressure (e.g., 25 ℃ C. and atmospheric pressure), and is preferably solid. The shape of the epoxy resin composition in the case of being a solid is not particularly limited, and examples thereof include powder, granule, and tablet. From the viewpoint of workability, the size and quality of the epoxy resin composition in the form of a sheet are preferably those which meet the molding conditions of the package.
< electronic component device >
An electronic component device as one embodiment of the present disclosure includes an element sealed with the epoxy resin composition according to embodiment 1 and embodiment 2.
An example of an electronic component device is an electronic component device in which an element section obtained by mounting an element (an active element such as a semiconductor chip, a transistor, a diode, or a thyristor, a passive element such as a capacitor, a resistor, or a coil, or the like) on a support member such as a lead frame, a wired tape carrier, a wiring board, glass, a silicon wafer, or an organic substrate is sealed with an epoxy resin composition.
More specifically, there may be mentioned: a general resin-sealed IC having a structure in which an element is fixed to a lead frame, a terminal portion of an element such as a pad is connected to the lead portion by wire bonding or a bump, and then the element is sealed by transfer molding or the like using an epoxy resin composition; a TCP (Tape Carrier Package) having a structure in which a device connected to a Tape Carrier by bumps is sealed with an epoxy resin composition; a COB (Chip On Board) module, a hybrid IC, a multi-Chip module, and the like having a structure in which an element connected to a wiring formed On a support member by wire bonding, flip Chip bonding, solder, or the like is sealed with an epoxy resin composition; BGA (Ball Grid Array), CSP (Chip Size Package), MCP (Multi Chip Package), etc., having a structure in which a component is mounted on the surface of a support member having terminals for wiring board connection formed on the back surface thereof, the component is connected to wiring formed on the support member by bump or wire bonding, and then the component is sealed with an epoxy resin composition. In addition, the epoxy resin composition can also be suitably used in a printed wiring board.
Examples of a method for sealing an electronic component device using an epoxy resin composition include a low-pressure transfer molding method, an injection molding method, and a compression molding method.
Examples
The embodiments are described below in detail by way of examples, but the scope of the embodiments is not limited to these examples.
Example 1 of embodiment
< preparation of resin composition >
First, each component shown below was prepared.
[ epoxy resin 1(E1) ] JeR YX-4000H (trade name) manufactured by Mitsubishi chemical corporation
[ epoxy resin 2(E2) ] EPOTHTO YSLV-80XY (trade name) manufactured by Nissian Ciki Kaisha
[ epoxy resin 3(E3) ] EPOTHTO YSLV-70XY (trade name) manufactured by Nissian Ciki Kaisha
[ curing agent 1(H1) ] A H-4 (trade name) manufactured by Kazakh chemical Co., Ltd
[ curing agent 2(H2) ] SN-485 (trade name) manufactured by Nissie iron Tokyo chemical Co., Ltd
[ curing agent 3(H3) ] MEH-7851SS (trade name) manufactured by Kazakh chemical Co., Ltd
[ curing Accelerator 1(C1) ] Tri-p-tolylphosphine adduct with 1, 4-benzoquinone
[ curing Accelerator 2(C2) ] triphenylphosphine and 1, 4-benzoquinone adduct
[ inorganic Filler 1(A1) ] of ultrafine alumina having an average particle diameter of 0.2 μm
[ inorganic Filler 2(A2) ] A fine alumina having an average particle diameter of 1 μm and a cut point of 25 μm
[ inorganic Filler 3(A3) ] alumina having a median diameter of 20 μm and a cut point of 35 μm
[ inorganic Filler 4(A4) ] alumina having a median diameter of 13 μm and a cut point of 55 μm
[ inorganic Filler 5(A5) ] alumina having an average particle diameter of 11 μm and a cut point of 75 μm
[ inorganic Filler 6(A6) ] silica having an average particle diameter of 3 μm and a cut point of 10 μm
[ inorganic Filler 7(A7) ] silica having a median diameter of 4 μm and a cut point of 20 μm
[ silane Compound 1] N-phenyl-3-aminopropyltrimethoxysilane; KBM-573 (trade name, product of shin-Yue chemical Co., Ltd.)
[ silane compound 2] methyltrimethoxysilane; KBM-13 (trade name, product of shin-Etsu chemical Co., Ltd.)
[ silane Compound 3] n-propyltrimethoxysilane; KBM-3033 (trade name, manufactured by shin-Etsu chemical Co., Ltd.)
[ silane compound 4] hexyltrimethoxysilane; KBM-3063 (trade name, product of shin-Etsu chemical Co., Ltd.)
[ silane Compound 5] octyltriethoxysilane; KBE-3083 (trade name, product of shin-Etsu chemical Co., Ltd.)
[ silane Compound 6] 8-glycidyloxyoctyltrimethoxysilane; KBM-4803 (trade name, manufactured by shin-Etsu chemical Co., Ltd.)
[ silane Compound 7] 8-methacryloyloxyoctyltrimethoxysilane; KBM-5803 (trade name, product of shin-Etsu chemical Co., Ltd.)
[ silane Compound 8] decyltrimethoxysilane; KBM-3103C (trade name, manufactured by shin-Etsu chemical Co., Ltd.)
The components shown in tables 1 and 2 were blended in the amounts shown in the tables (unit is part by mass) and thoroughly mixed in a mixer, and then melt-kneaded at 100 ℃ for 2 minutes using a twin-screw kneader. Next, the melt was cooled, and the solid matter was pulverized into a powder, thereby preparing the target powdery epoxy resin composition. In the table, the blank column indicates that no component was incorporated, and "-" indicates that no evaluation was performed.
The epoxy resin compositions thus prepared were evaluated by various tests shown below. The evaluation results are shown in tables 1 and 2. The epoxy resin compositions described in examples A-1 to A-7 and comparative examples A-1 to A-3 were molded using a compression molding machine, and the epoxy resin compositions described in examples A-8 to A-17 and comparative examples A-4 to A-5 were molded using a transfer molding machine.
< evaluation of viscosity >
The lowest melt viscosity at 175 ℃ was measured using the epoxy resin compositions described in examples A-1 to A-17 and comparative examples A-1 to A-5. The results are shown in tables 1 and 2 below. The minimum melt viscosity was measured using a high flow tester (Shimadzu corporation).
< evaluation of lead offset >
Using the epoxy resin compositions described in examples A-1 to A-7 and comparative examples A-1 to A-3, a package was sealed by a compression molding machine (PMC-1040S, manufactured by TOWA corporation) under molding conditions of a molding temperature of 175 ℃ and a molding time of 120 seconds, and post-cured at 175 ℃ for 5 hours to obtain a semiconductor device. The semiconductor device was a Ball Grid Array (BGA) package (resin sealing portion size: 228 mm. times.67 mm. times.1 mm in thickness), and the chip size was 7.5 mm. times.7.5 mm. Further, as for the leads, the gold wire lead diameter was 18 μm, and the average gold wire lead length was 5 mm. Then, the formed package was examined for the presence or absence of deformation by observing the state of deformation of the gold wire leads using a soft X-ray analyzer.
Further, using the epoxy resin compositions described in examples A-8 to A-17 and comparative examples A-4 to A-5, a package was sealed by a transfer molding machine (manufactured by TOWA, Inc., Manual-Press Y-1) under molding conditions of a molding temperature of 175 ℃ and a molding time of 120 seconds, and post-cured at 175 ℃ for 5 hours to obtain a semiconductor device. The semiconductor device was a Ball Grid Array (BGA) package (resin sealing portion size: 50mm × 50mm × thickness 0.7mm), and the chip size was 7.5mm × 7.5 mm. Further, as for the leads, the gold wire lead diameter was 22 μm, and the average gold wire lead length was 3 mm. Then, the formed package was examined for the presence or absence of deformation by observing the state of deformation of the gold wire leads using a soft X-ray analyzer.
The evaluation was carried out according to the following criteria.
AA: the incidence of lead wire migration is less than 3%
A: the incidence of lead wire migration is greater than or equal to 3% and less than 5%
B: the incidence of lead migration is greater than or equal to 5% and less than 7%
C: the incidence of lead migration is greater than or equal to 7%
< evaluation of filling Property of Molding Underfill (MUF) >
Using the epoxy resin compositions described in examples A-1 to A-7 and comparative examples A-1 to A-3, semiconductor elements were molded by a compression molding machine (PMC-1040S, manufactured by TOWA corporation) under conditions of a molding temperature of 175 ℃, a clearance between upper and lower molds of 2mm, a vacuum holding time of 6 seconds, and a molding time of 120 seconds, and flip chip filling properties were evaluated. The semiconductor device was a Ball Grid Array (BGA) package (resin sealing portion size: 228 mm. times.67 mm. times.1 mm in thickness), and the chip size was 7.5 mm. times.7.5 mm. The flip chip bump size is 60 μm obtained by summing up 45 μm Cu pillars and 15 μm solder bumps. To evaluate the filling property, the presence or absence of voids in the under-chip gap was checked using an ultrasonic probe apparatus.
The case where the filling property is good is denoted as a, and the case where there is an unfilled portion such as a void is denoted as C.
< evaluation of thermal conductivity >
The epoxy resin compositions described in examples A-1 to A-17 and comparative examples A-1 to A-5 were molded by a high-temperature vacuum molding machine under conditions of 175 ℃ and 600 seconds and a pressure of 7MPa, and the test pieces 1mm thick and 10mm square were measured at room temperature using an LFA467 type HyperFlash device manufactured by NETZSCH, and the value calculated by the xenon flash method was used as the thermal conductivity.
[ Table 1]
[ Table 2]
As is clear from the results in tables 1 and 2, the epoxy resin compositions of examples containing a silane compound having a structure in which a chain hydrocarbon group having 6 or more carbon atoms is bonded to a silicon atom have a lower viscosity and a lower incidence of lead offset than the comparative examples. It is also found that the epoxy resin composition of the example containing the silane compound having a structure in which a chain hydrocarbon group having 6 or more carbon atoms is bonded to a silicon atom is excellent in filling properties when used for mold underfill by compression molding. In particular, when the number of carbon atoms of the chain hydrocarbon group is 8 or more, the thermal conductivity tends to be excellent even when the cured product is obtained.
Example 2 of embodiment
< preparation of resin composition >
First, each component shown below was prepared. The inorganic fillers 1 to 3 each have a thermal conductivity of 20W/(mK) or more.
[ epoxy resin 1(E1) ] manufactured by Mitsubishi chemical corporation, jER YX-4000H (trade name)
[ epoxy resin 2(E2) ] manufactured by Nissan iron Cijin chemical Co., Ltd., EPOTHTO YSLV-80XY (trade name)
[ curing agent 1(H1) ] Ming He Cheng chemical Co., Ltd., H-4 (trade name)
[ curing agent 2(H2) ] SN-485 (trade name) manufactured by Nissie iron Tokyo chemical Co., Ltd
[ curing Accelerator 1(C1) ] Tri-p-tolylphosphine adduct with 1, 4-benzoquinone
[ inorganic Filler 1(A1) ] of ultrafine alumina having an average particle diameter of 0.2 μm
[ inorganic Filler 2(A2) ] alumina having a median diameter of 13 μm and a cut point of 55 μm
[ inorganic Filler 3(A3) ] alumina having an average particle diameter of 11 μm and a cut point of 75 μm
[ silane Compound 1] N-phenyl-3-aminopropyltrimethoxysilane; KBM-573 (trade name, product of shin-Yue chemical Co., Ltd.)
[ silane compound 2] hexyltrimethoxysilane; KBM-3063 (trade name, product of shin-Etsu chemical Co., Ltd.)
[ silane Compound 3] octyltriethoxysilane; KBE-3083 (trade name, product of shin-Etsu chemical Co., Ltd.)
[ silane Compound 4] 8-glycidyloxyoctyltrimethoxysilane; KBM-4803 (trade name, manufactured by shin-Etsu chemical Co., Ltd.)
[ silane Compound 5] 8-methacryloyloxyoctyltrimethoxysilane; KBM-5803 (trade name, product of shin-Etsu chemical Co., Ltd.)
[ silane Compound 6] decyltrimethoxysilane; KBM-3103C (trade name, manufactured by shin-Etsu chemical Co., Ltd.)
The components shown in tables 3 and 4 were blended in the amounts shown in the tables (unit is part by mass) and thoroughly mixed in a mixer, and then melt-kneaded at 100 ℃ for 2 minutes using a twin-screw kneader. Next, the melt was cooled, and the solid matter was pulverized into a powder, thereby preparing the target powdery epoxy resin composition. In the table, the blank column indicates that no component was incorporated, and "-" indicates that no evaluation was performed.
The epoxy resin compositions thus prepared were evaluated by various tests shown below. The evaluation results are shown in tables 3 and 4. The molding of examples B-1 to B-10 and comparative examples B-1 to B-2 was performed using a transfer molding machine.
< evaluation of viscosity >
Using the epoxy resin compositions of examples and comparative examples, the minimum melt viscosity at 175 ℃ was measured. The results are shown in tables 3 and 4 below. The minimum melt viscosity was measured using a high flow tester (Shimadzu corporation).
< evaluation of lead offset >
Using the epoxy resin compositions of examples and comparative examples, a package was sealed by a transfer molding machine (manufactured by TOWA, Manual-Press Y-1) under molding conditions of a molding temperature of 175 ℃ and a molding time of 120 seconds, and post-cured at 175 ℃ for 5 hours to obtain a semiconductor device. The semiconductor device was a Ball Grid Array (BGA) package (resin sealing portion size: 50mm × 50mm × thickness 0.7mm), and the chip size was 7.5mm × 7.5 mm. Further, as for the leads, the gold wire lead diameter was 22 μm, and the average gold wire lead length was 3 mm. Then, the formed package was examined for the presence or absence of deformation by observing the state of deformation of the gold wire leads using a soft X-ray analyzer.
The evaluation was carried out according to the following criteria.
AA: the incidence of lead wire migration is less than 3%
A: the incidence of lead wire migration is greater than or equal to 3% and less than 5%
B: the incidence of lead migration is greater than or equal to 5% and less than 7%
C: the incidence of lead migration is greater than or equal to 7%
< evaluation of thermal conductivity >
The epoxy resin compositions of examples and comparative examples were molded by a high-temperature vacuum molding machine under conditions of 175 ℃, 600 seconds, and 7MPa, and the test pieces 1mm thick and 10mm square were measured at room temperature using an LFA467 Hyper Flash apparatus manufactured by NETZSCH, and the value calculated by the xenon Flash method was used as the thermal conductivity.
[ Table 3]
[ Table 4]
From the results of the examples, it is understood that the epoxy resin composition of the examples containing the silane compound having a structure in which the aluminum oxide and the chain hydrocarbon group having 6 or more carbon atoms are bonded to the silicon atom has a low viscosity and is excellent in thermal conductivity when it is cured into a cured product. In particular, when the number of carbon atoms of the chain hydrocarbon group is 8 or more, the thermal conductivity in the case of forming a cured product is improved.
The disclosures of japanese patent application nos. 2017-178299 and 2017-178300 are incorporated by reference in their entirety into this specification.
All documents, patent applications, and technical standards described in the present specification are incorporated by reference into the present specification to the same extent as if each document, patent application, and technical standard was specifically and individually indicated to be incorporated by reference.
Claims (7)
1. An epoxy resin composition comprising an epoxy resin, a curing agent, an inorganic filler, and a silane compound having a structure in which a silicon atom is bonded to a chain hydrocarbon group having 6 or more carbon atoms.
2. The epoxy resin composition according to claim 1, wherein the chain hydrocarbon group has at least one functional group selected from a (meth) acryloyl group, an epoxy group and an alkoxy group.
3. The epoxy resin composition according to claim 1 or 2, wherein the chain hydrocarbon group has a (meth) acryloyl group.
4. The epoxy resin composition according to any one of claims 1 to 3, wherein the content of the inorganic filler is 30 to 99 vol%.
5. The epoxy resin composition according to any one of claims 1 to 4, wherein the inorganic filler has a thermal conductivity of 20W/(m-K) or more.
6. The epoxy resin composition according to claim 5, wherein the inorganic filler having a thermal conductivity of 20W/(m-K) or more contains at least one selected from the group consisting of aluminum oxide, silicon nitride, boron nitride, aluminum nitride, magnesium oxide and silicon carbide.
7. An electronic component device comprising an element sealed with the epoxy resin composition according to any one of claims 1 to 6.
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| CN202310717825.4A CN116751438A (en) | 2017-09-15 | 2018-08-31 | Epoxy resin composition and electronic component device |
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| PCT/JP2018/032497 WO2019054217A1 (en) | 2017-09-15 | 2018-08-31 | Epoxy resin composition and electronic component device |
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| JP2020117625A (en) | 2019-01-24 | 2020-08-06 | 株式会社Adeka | Composition and cured product |
| JPWO2022050170A1 (en) * | 2020-09-03 | 2022-03-10 | ||
| JP7552161B2 (en) | 2020-09-03 | 2024-09-18 | 株式会社レゾナック | Compound, molded body, and cured product of compound |
| TWI772106B (en) * | 2021-07-14 | 2022-07-21 | 福思材料股份有限公司 | Thermally conductive material |
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|---|---|---|---|---|
| CN101522792A (en) * | 2006-10-02 | 2009-09-02 | 日立化成工业株式会社 | Epoxy resin molding material for sealing and electronic component device |
| WO2010084939A1 (en) * | 2009-01-23 | 2010-07-29 | 味の素株式会社 | Resin composition |
| CN103517948A (en) * | 2011-05-13 | 2014-01-15 | 日立化成株式会社 | Epoxy resin molding material for encapsulation and electronic component device |
| JP2016219600A (en) * | 2015-05-20 | 2016-12-22 | 京セラ株式会社 | Die attach paste for semiconductor and semiconductor device |
| CN106433025A (en) * | 2015-08-07 | 2017-02-22 | 味之素株式会社 | Resin composition |
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| JP2004292591A (en) | 2003-03-26 | 2004-10-21 | Matsushita Electric Works Ltd | Resin composition for optical semiconductor and optical semiconductor device |
| JP5520183B2 (en) | 2010-09-30 | 2014-06-11 | 積水化学工業株式会社 | Resin composition, resin sheet and laminated structure |
| JP6183061B2 (en) | 2013-08-27 | 2017-08-23 | 日立化成株式会社 | Epoxy resin composition for semiconductor encapsulation and resin-encapsulated semiconductor device using the same |
| JP7167441B2 (en) | 2016-05-06 | 2022-11-09 | Dic株式会社 | Resin composition, molding, laminate and adhesive |
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- 2018-08-31 JP JP2019542000A patent/JP7375541B2/en active Active
- 2018-08-31 CN CN202310717825.4A patent/CN116751438A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101522792A (en) * | 2006-10-02 | 2009-09-02 | 日立化成工业株式会社 | Epoxy resin molding material for sealing and electronic component device |
| WO2010084939A1 (en) * | 2009-01-23 | 2010-07-29 | 味の素株式会社 | Resin composition |
| CN103517948A (en) * | 2011-05-13 | 2014-01-15 | 日立化成株式会社 | Epoxy resin molding material for encapsulation and electronic component device |
| JP2016219600A (en) * | 2015-05-20 | 2016-12-22 | 京セラ株式会社 | Die attach paste for semiconductor and semiconductor device |
| CN106433025A (en) * | 2015-08-07 | 2017-02-22 | 味之素株式会社 | Resin composition |
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| JP7375541B2 (en) | 2023-11-08 |
| TWI839335B (en) | 2024-04-21 |
| JPWO2019054217A1 (en) | 2020-10-29 |
| WO2019054217A1 (en) | 2019-03-21 |
| JP2024012392A (en) | 2024-01-30 |
| MY198096A (en) | 2023-07-31 |
| TW201920450A (en) | 2019-06-01 |
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