MY162078A - Copper foil for printed circuit board and copper-clad laminate for printed circuit board - Google Patents

Copper foil for printed circuit board and copper-clad laminate for printed circuit board

Info

Publication number
MY162078A
MY162078A MYPI2012003731A MYPI2012003731A MY162078A MY 162078 A MY162078 A MY 162078A MY PI2012003731 A MYPI2012003731 A MY PI2012003731A MY PI2012003731 A MYPI2012003731 A MY PI2012003731A MY 162078 A MY162078 A MY 162078A
Authority
MY
Malaysia
Prior art keywords
copper
circuit board
printed circuit
zinc
copper foil
Prior art date
Application number
MYPI2012003731A
Other languages
English (en)
Inventor
Terumasa Moriyama
Masafumi Ishii
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY162078A publication Critical patent/MY162078A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
MYPI2012003731A 2010-02-24 2011-02-21 Copper foil for printed circuit board and copper-clad laminate for printed circuit board MY162078A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010038285 2010-02-24

Publications (1)

Publication Number Publication Date
MY162078A true MY162078A (en) 2017-05-31

Family

ID=44506726

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012003731A MY162078A (en) 2010-02-24 2011-02-21 Copper foil for printed circuit board and copper-clad laminate for printed circuit board

Country Status (6)

Country Link
JP (1) JP5254491B2 (zh)
KR (1) KR101344176B1 (zh)
CN (1) CN102783255B (zh)
MY (1) MY162078A (zh)
TW (1) TWI509113B (zh)
WO (1) WO2011105318A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5497808B2 (ja) * 2012-01-18 2014-05-21 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた銅張積層板
CN104755220B (zh) * 2013-10-18 2016-11-16 三菱电机株式会社 加工工作台用工装件、加工工作台用工装件的制造方法及激光加工方法
EP3786315A4 (en) * 2018-04-27 2022-04-20 JX Nippon Mining & Metals Corporation SURFACE TREATED COPPER FOIL, COPPER COATED LAMINATE AND CIRCUIT BOARD
TW202005800A (zh) * 2018-07-18 2020-02-01 日商日立化成股份有限公司 覆銅積層板、印刷線路板、半導體封裝體及覆銅積層板的製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07202367A (ja) * 1993-12-28 1995-08-04 Japan Energy Corp 印刷回路用銅箔の表面処理方法
JP3292774B2 (ja) * 1994-02-15 2002-06-17 三井金属鉱業株式会社 プリント配線板用銅箔およびその製造方法
JP3142259B2 (ja) * 1998-11-30 2001-03-07 三井金属鉱業株式会社 耐薬品性および耐熱性に優れたプリント配線板用銅箔およびその製造方法
JP3670185B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP4172704B2 (ja) * 2003-07-31 2008-10-29 日鉱金属株式会社 表面処理銅箔およびそれを使用した基板
JP4907580B2 (ja) * 2008-03-25 2012-03-28 新日鐵化学株式会社 フレキシブル銅張積層板
WO2009154066A1 (ja) * 2008-06-17 2009-12-23 日鉱金属株式会社 印刷回路基板用銅箔及び印刷回路基板用銅張積層板

Also Published As

Publication number Publication date
KR101344176B1 (ko) 2013-12-20
JPWO2011105318A1 (ja) 2013-06-20
WO2011105318A1 (ja) 2011-09-01
TW201137183A (en) 2011-11-01
CN102783255B (zh) 2017-04-19
JP5254491B2 (ja) 2013-08-07
CN102783255A (zh) 2012-11-14
TWI509113B (zh) 2015-11-21
KR20120115339A (ko) 2012-10-17

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