MY162078A - Copper foil for printed circuit board and copper-clad laminate for printed circuit board - Google Patents

Copper foil for printed circuit board and copper-clad laminate for printed circuit board

Info

Publication number
MY162078A
MY162078A MYPI2012003731A MYPI2012003731A MY162078A MY 162078 A MY162078 A MY 162078A MY PI2012003731 A MYPI2012003731 A MY PI2012003731A MY PI2012003731 A MYPI2012003731 A MY PI2012003731A MY 162078 A MY162078 A MY 162078A
Authority
MY
Malaysia
Prior art keywords
copper
circuit board
printed circuit
zinc
copper foil
Prior art date
Application number
MYPI2012003731A
Inventor
Terumasa Moriyama
Masafumi Ishii
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY162078A publication Critical patent/MY162078A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A COPPER FOIL FOR A PRINTED CIRCUIT BOARD COMPRISING A LAYER CONTAINING NICKEL, ZINC AND COPPER (HEREINAFTER REFERRED TO AS A “COPPER-NICKEL-ZINC LAYER”) ON A SURFACE OF THE COPPER FOIL; WHEREIN A ZINC ADHESION WEIGHT PER UNIT AREA OF THE COPPER-NICKEL-ZINC LAYER, IS 200 PG/DM2 OR MORE AND 2000 PG/DM2 OR LESS, AND IN THE COPPER-NICKE-ZINC LAYER, NI IS 1 TO 50 MASS%, (ZINC ADHESION AMOUNT (MASS%)) {100 - (COPPER ADHESION AMOUNT (MASS%))} EVALUATES TO 0.3 OR MORE.THIS COPPER FOIL SURFACE TREATMENT TECHNOLOGY IS ABLE TO EFFECTIVELY PREVENT THE CIRCUIT EROSION PHENOMENON IN CASES OF LAMINATING A COPPER FOIL ON A RESIN BASE MATERIAL AND PERFORMING SOFT ETCHING TO THE CIRCUIT WITH A SULFURIC ACID/HYDROGEN PEROXIDE-BASED ETCHING SOLUTION. (FIG. 1)
MYPI2012003731A 2010-02-24 2011-02-21 Copper foil for printed circuit board and copper-clad laminate for printed circuit board MY162078A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010038285 2010-02-24

Publications (1)

Publication Number Publication Date
MY162078A true MY162078A (en) 2017-05-31

Family

ID=44506726

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012003731A MY162078A (en) 2010-02-24 2011-02-21 Copper foil for printed circuit board and copper-clad laminate for printed circuit board

Country Status (6)

Country Link
JP (1) JP5254491B2 (en)
KR (1) KR101344176B1 (en)
CN (1) CN102783255B (en)
MY (1) MY162078A (en)
TW (1) TWI509113B (en)
WO (1) WO2011105318A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5497808B2 (en) * 2012-01-18 2014-05-21 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil and copper-clad laminate using the same
WO2015056349A1 (en) * 2013-10-18 2015-04-23 三菱電機株式会社 Machining table jig, manufacturing method of machining table jig, and laser processing method
EP3786315A4 (en) 2018-04-27 2022-04-20 JX Nippon Mining & Metals Corporation Surface-treated copper foil, copper clad laminate, and printed wiring board
US20210267052A1 (en) * 2018-07-18 2021-08-26 Showa Denko Materials Co., Ltd. Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07202367A (en) * 1993-12-28 1995-08-04 Japan Energy Corp Surface treatment method of copper foil for printed circuit
JP3292774B2 (en) * 1994-02-15 2002-06-17 三井金属鉱業株式会社 Copper foil for printed wiring board and method for producing the same
JP3142259B2 (en) * 1998-11-30 2001-03-07 三井金属鉱業株式会社 Copper foil for printed wiring board excellent in chemical resistance and heat resistance and method for producing the same
JP3670185B2 (en) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 Method for producing surface-treated copper foil for printed wiring board
JP4172704B2 (en) * 2003-07-31 2008-10-29 日鉱金属株式会社 Surface-treated copper foil and substrate using the same
JP4907580B2 (en) * 2008-03-25 2012-03-28 新日鐵化学株式会社 Flexible copper clad laminate
CN101981230B (en) * 2008-06-17 2013-01-16 Jx日矿日石金属株式会社 Copper foil for printed circuit board and copper clad laminate plate for printed circuit board

Also Published As

Publication number Publication date
JPWO2011105318A1 (en) 2013-06-20
WO2011105318A1 (en) 2011-09-01
TWI509113B (en) 2015-11-21
JP5254491B2 (en) 2013-08-07
KR101344176B1 (en) 2013-12-20
CN102783255A (en) 2012-11-14
CN102783255B (en) 2017-04-19
TW201137183A (en) 2011-11-01
KR20120115339A (en) 2012-10-17

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