JP5254491B2 - 印刷回路基板用銅箔及び印刷回路基板用銅張積層板 - Google Patents
印刷回路基板用銅箔及び印刷回路基板用銅張積層板 Download PDFInfo
- Publication number
- JP5254491B2 JP5254491B2 JP2012501763A JP2012501763A JP5254491B2 JP 5254491 B2 JP5254491 B2 JP 5254491B2 JP 2012501763 A JP2012501763 A JP 2012501763A JP 2012501763 A JP2012501763 A JP 2012501763A JP 5254491 B2 JP5254491 B2 JP 5254491B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- copper foil
- mass
- zinc
- peel strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 210
- 239000011889 copper foil Substances 0.000 title claims description 131
- 239000010949 copper Substances 0.000 title claims description 109
- 229910052802 copper Inorganic materials 0.000 title claims description 88
- 239000011701 zinc Substances 0.000 claims description 116
- 229910052725 zinc Inorganic materials 0.000 claims description 93
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 85
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 79
- KOMIMHZRQFFCOR-UHFFFAOYSA-N [Ni].[Cu].[Zn] Chemical compound [Ni].[Cu].[Zn] KOMIMHZRQFFCOR-UHFFFAOYSA-N 0.000 claims description 39
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 27
- 238000009713 electroplating Methods 0.000 claims description 26
- 229910052759 nickel Inorganic materials 0.000 claims description 26
- 239000011651 chromium Substances 0.000 claims description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052804 chromium Inorganic materials 0.000 claims description 9
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 7
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 4
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 71
- 239000000758 substrate Substances 0.000 description 68
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 58
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 52
- 230000006866 deterioration Effects 0.000 description 49
- 230000000052 comparative effect Effects 0.000 description 41
- 238000007747 plating Methods 0.000 description 35
- 239000000203 mixture Substances 0.000 description 26
- 239000000243 solution Substances 0.000 description 24
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 22
- 239000000126 substance Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 20
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 15
- 238000010306 acid treatment Methods 0.000 description 14
- 230000032683 aging Effects 0.000 description 14
- 230000003628 erosive effect Effects 0.000 description 14
- 238000005530 etching Methods 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 12
- 238000007788 roughening Methods 0.000 description 11
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 229910001369 Brass Inorganic materials 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000010951 brass Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000004381 surface treatment Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 229910017518 Cu Zn Inorganic materials 0.000 description 4
- 229910017752 Cu-Zn Inorganic materials 0.000 description 4
- 229910017943 Cu—Zn Inorganic materials 0.000 description 4
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 4
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229910018605 Ni—Zn Inorganic materials 0.000 description 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- -1 argon ion Chemical class 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000003449 preventive effect Effects 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910002058 ternary alloy Inorganic materials 0.000 description 2
- NDKWCCLKSWNDBG-UHFFFAOYSA-N zinc;dioxido(dioxo)chromium Chemical compound [Zn+2].[O-][Cr]([O-])(=O)=O NDKWCCLKSWNDBG-UHFFFAOYSA-N 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- YIWGJFPJRAEKMK-UHFFFAOYSA-N 1-(2H-benzotriazol-5-yl)-3-methyl-8-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carbonyl]-1,3,8-triazaspiro[4.5]decane-2,4-dione Chemical compound CN1C(=O)N(c2ccc3n[nH]nc3c2)C2(CCN(CC2)C(=O)c2cnc(NCc3cccc(OC(F)(F)F)c3)nc2)C1=O YIWGJFPJRAEKMK-UHFFFAOYSA-N 0.000 description 1
- LGZNZXOHAFRWEN-UHFFFAOYSA-N 3-[4-(2,5-dioxopyrrol-3-yl)triazin-5-yl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C(=NN=NC=2)C=2C(NC(=O)C=2)=O)=C1 LGZNZXOHAFRWEN-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910017816 Cu—Co Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002335 surface treatment layer Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012501763A JP5254491B2 (ja) | 2010-02-24 | 2011-02-21 | 印刷回路基板用銅箔及び印刷回路基板用銅張積層板 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010038285 | 2010-02-24 | ||
| JP2010038285 | 2010-02-24 | ||
| JP2012501763A JP5254491B2 (ja) | 2010-02-24 | 2011-02-21 | 印刷回路基板用銅箔及び印刷回路基板用銅張積層板 |
| PCT/JP2011/053646 WO2011105318A1 (ja) | 2010-02-24 | 2011-02-21 | 印刷回路基板用銅箔及び印刷回路基板用銅張積層板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2011105318A1 JPWO2011105318A1 (ja) | 2013-06-20 |
| JP5254491B2 true JP5254491B2 (ja) | 2013-08-07 |
Family
ID=44506726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012501763A Active JP5254491B2 (ja) | 2010-02-24 | 2011-02-21 | 印刷回路基板用銅箔及び印刷回路基板用銅張積層板 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5254491B2 (zh) |
| KR (1) | KR101344176B1 (zh) |
| CN (1) | CN102783255B (zh) |
| MY (1) | MY162078A (zh) |
| TW (1) | TWI509113B (zh) |
| WO (1) | WO2011105318A1 (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5497808B2 (ja) * | 2012-01-18 | 2014-05-21 | Ｊｘ日鉱日石金属株式会社 | 表面処理銅箔及びそれを用いた銅張積層板 |
| JP5591422B1 (ja) * | 2013-10-18 | 2014-09-17 | 三菱電機株式会社 | 加工テーブル用治具、加工テーブル用治具の製造方法およびレーザ加工方法 |
| US11375624B2 (en) | 2018-04-27 | 2022-06-28 | Jx Nippon Mining & Metals Corporation | Surface treated copper foil, copper clad laminate, and printed circuit board |
| WO2020017551A1 (ja) * | 2018-07-18 | 2020-01-23 | 日立化成株式会社 | 銅張積層板、プリント配線板、半導体パッケージ及び銅張積層板の製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07202367A (ja) * | 1993-12-28 | 1995-08-04 | Japan Energy Corp | 印刷回路用銅箔の表面処理方法 |
| JP4172704B2 (ja) * | 2003-07-31 | 2008-10-29 | 日鉱金属株式会社 | 表面処理銅箔およびそれを使用した基板 |
| JP2009226874A (ja) * | 2008-03-25 | 2009-10-08 | Nippon Steel Chem Co Ltd | フレキシブル銅張積層板 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3292774B2 (ja) * | 1994-02-15 | 2002-06-17 | 三井金属鉱業株式会社 | プリント配線板用銅箔およびその製造方法 |
| JP3142259B2 (ja) * | 1998-11-30 | 2001-03-07 | 三井金属鉱業株式会社 | 耐薬品性および耐熱性に優れたプリント配線板用銅箔およびその製造方法 |
| JP3670185B2 (ja) * | 2000-01-28 | 2005-07-13 | 三井金属鉱業株式会社 | プリント配線板用表面処理銅箔の製造方法 |
| CN101981230B (zh) * | 2008-06-17 | 2013-01-16 | Jx日矿日石金属株式会社 | 印刷电路板用铜箔及印刷电路板用包铜层压板 |
-
2011
- 2011-02-21 MY MYPI2012003731A patent/MY162078A/en unknown
- 2011-02-21 JP JP2012501763A patent/JP5254491B2/ja active Active
- 2011-02-21 WO PCT/JP2011/053646 patent/WO2011105318A1/ja active Application Filing
- 2011-02-21 KR KR1020127019538A patent/KR101344176B1/ko active IP Right Grant
- 2011-02-21 CN CN201180010771.3A patent/CN102783255B/zh active Active
- 2011-02-23 TW TW100105943A patent/TWI509113B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07202367A (ja) * | 1993-12-28 | 1995-08-04 | Japan Energy Corp | 印刷回路用銅箔の表面処理方法 |
| JP4172704B2 (ja) * | 2003-07-31 | 2008-10-29 | 日鉱金属株式会社 | 表面処理銅箔およびそれを使用した基板 |
| JP2009226874A (ja) * | 2008-03-25 | 2009-10-08 | Nippon Steel Chem Co Ltd | フレキシブル銅張積層板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2011105318A1 (ja) | 2013-06-20 |
| TW201137183A (en) | 2011-11-01 |
| CN102783255A (zh) | 2012-11-14 |
| KR101344176B1 (ko) | 2013-12-20 |
| MY162078A (en) | 2017-05-31 |
| KR20120115339A (ko) | 2012-10-17 |
| TWI509113B (zh) | 2015-11-21 |
| CN102783255B (zh) | 2017-04-19 |
| WO2011105318A1 (ja) | 2011-09-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4938130B2 (ja) | 印刷回路基板用銅箔及び印刷回路基板用銅張積層板 | |
| JP5512567B2 (ja) | プリント配線板用銅箔の製造方法 | |
| KR102104161B1 (ko) | 프린트 배선판용 동박 및 그 제조 방법 | |
| US9028972B2 (en) | Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring board | |
| TWI645073B (zh) | Copper foil and semiconductor package substrate | |
| JP4955104B2 (ja) | 電子回路の形成方法 | |
| JP5254491B2 (ja) | 印刷回路基板用銅箔及び印刷回路基板用銅張積層板 | |
| KR20120115310A (ko) | 전자 회로 및 그 형성 방법 그리고 전자 회로 형성용 동장 적층판 | |
| US20130189538A1 (en) | Method of manufacturing copper foil for printed wiring board, and copper foil printed wiring board | |
| JP2739507B2 (ja) | 銅箔の電解処理方法 | |
| JP5443157B2 (ja) | 高周波用銅箔及びそれを用いた銅張積層板とその製造方法 | |
| WO2012132572A1 (ja) | 銅キャリア付銅箔、同銅箔の製造方法、電子回路用銅箔、同銅箔の製造方法及び電子回路の形成方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130402 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 5254491 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160426 Year of fee payment: 3 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |