JP5254491B2 - 印刷回路基板用銅箔及び印刷回路基板用銅張積層板 - Google Patents

印刷回路基板用銅箔及び印刷回路基板用銅張積層板 Download PDF

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Publication number
JP5254491B2
JP5254491B2 JP2012501763A JP2012501763A JP5254491B2 JP 5254491 B2 JP5254491 B2 JP 5254491B2 JP 2012501763 A JP2012501763 A JP 2012501763A JP 2012501763 A JP2012501763 A JP 2012501763A JP 5254491 B2 JP5254491 B2 JP 5254491B2
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JP
Japan
Prior art keywords
copper
copper foil
mass
zinc
peel strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012501763A
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English (en)
Japanese (ja)
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JPWO2011105318A1 (ja
Inventor
晃正 森山
雅史 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2012501763A priority Critical patent/JP5254491B2/ja
Publication of JPWO2011105318A1 publication Critical patent/JPWO2011105318A1/ja
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2012501763A 2010-02-24 2011-02-21 印刷回路基板用銅箔及び印刷回路基板用銅張積層板 Active JP5254491B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012501763A JP5254491B2 (ja) 2010-02-24 2011-02-21 印刷回路基板用銅箔及び印刷回路基板用銅張積層板

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010038285 2010-02-24
JP2010038285 2010-02-24
JP2012501763A JP5254491B2 (ja) 2010-02-24 2011-02-21 印刷回路基板用銅箔及び印刷回路基板用銅張積層板
PCT/JP2011/053646 WO2011105318A1 (ja) 2010-02-24 2011-02-21 印刷回路基板用銅箔及び印刷回路基板用銅張積層板

Publications (2)

Publication Number Publication Date
JPWO2011105318A1 JPWO2011105318A1 (ja) 2013-06-20
JP5254491B2 true JP5254491B2 (ja) 2013-08-07

Family

ID=44506726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012501763A Active JP5254491B2 (ja) 2010-02-24 2011-02-21 印刷回路基板用銅箔及び印刷回路基板用銅張積層板

Country Status (6)

Country Link
JP (1) JP5254491B2 (zh)
KR (1) KR101344176B1 (zh)
CN (1) CN102783255B (zh)
MY (1) MY162078A (zh)
TW (1) TWI509113B (zh)
WO (1) WO2011105318A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5497808B2 (ja) * 2012-01-18 2014-05-21 Jx日鉱日石金属株式会社 表面処理銅箔及びそれを用いた銅張積層板
JP5591422B1 (ja) * 2013-10-18 2014-09-17 三菱電機株式会社 加工テーブル用治具、加工テーブル用治具の製造方法およびレーザ加工方法
US11375624B2 (en) 2018-04-27 2022-06-28 Jx Nippon Mining & Metals Corporation Surface treated copper foil, copper clad laminate, and printed circuit board
WO2020017551A1 (ja) * 2018-07-18 2020-01-23 日立化成株式会社 銅張積層板、プリント配線板、半導体パッケージ及び銅張積層板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07202367A (ja) * 1993-12-28 1995-08-04 Japan Energy Corp 印刷回路用銅箔の表面処理方法
JP4172704B2 (ja) * 2003-07-31 2008-10-29 日鉱金属株式会社 表面処理銅箔およびそれを使用した基板
JP2009226874A (ja) * 2008-03-25 2009-10-08 Nippon Steel Chem Co Ltd フレキシブル銅張積層板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3292774B2 (ja) * 1994-02-15 2002-06-17 三井金属鉱業株式会社 プリント配線板用銅箔およびその製造方法
JP3142259B2 (ja) * 1998-11-30 2001-03-07 三井金属鉱業株式会社 耐薬品性および耐熱性に優れたプリント配線板用銅箔およびその製造方法
JP3670185B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
CN101981230B (zh) * 2008-06-17 2013-01-16 Jx日矿日石金属株式会社 印刷电路板用铜箔及印刷电路板用包铜层压板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07202367A (ja) * 1993-12-28 1995-08-04 Japan Energy Corp 印刷回路用銅箔の表面処理方法
JP4172704B2 (ja) * 2003-07-31 2008-10-29 日鉱金属株式会社 表面処理銅箔およびそれを使用した基板
JP2009226874A (ja) * 2008-03-25 2009-10-08 Nippon Steel Chem Co Ltd フレキシブル銅張積層板

Also Published As

Publication number Publication date
JPWO2011105318A1 (ja) 2013-06-20
TW201137183A (en) 2011-11-01
CN102783255A (zh) 2012-11-14
KR101344176B1 (ko) 2013-12-20
MY162078A (en) 2017-05-31
KR20120115339A (ko) 2012-10-17
TWI509113B (zh) 2015-11-21
CN102783255B (zh) 2017-04-19
WO2011105318A1 (ja) 2011-09-01

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