MY141179A - Silicon condenser microphone - Google Patents

Silicon condenser microphone

Info

Publication number
MY141179A
MY141179A MYPI20081622A MYPI20081622A MY141179A MY 141179 A MY141179 A MY 141179A MY PI20081622 A MYPI20081622 A MY PI20081622A MY PI20081622 A MYPI20081622 A MY PI20081622A MY 141179 A MY141179 A MY 141179A
Authority
MY
Malaysia
Prior art keywords
case
plating layer
condenser microphone
resin
silicon condenser
Prior art date
Application number
MYPI20081622A
Other languages
English (en)
Inventor
Song Chung-Dam
Original Assignee
Bse Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bse Co Ltd filed Critical Bse Co Ltd
Publication of MY141179A publication Critical patent/MY141179A/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/34—Directing or guiding sound by means of a phase plug
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Micromachines (AREA)
MYPI20081622A 2006-09-09 2006-12-29 Silicon condenser microphone MY141179A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060087095A KR100740463B1 (ko) 2006-09-09 2006-09-09 실리콘 콘덴서 마이크로폰

Publications (1)

Publication Number Publication Date
MY141179A true MY141179A (en) 2010-03-31

Family

ID=38498934

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20081622A MY141179A (en) 2006-09-09 2006-12-29 Silicon condenser microphone

Country Status (9)

Country Link
US (1) US20080063232A1 (de)
EP (1) EP1898668A3 (de)
JP (1) JP2008067383A (de)
KR (1) KR100740463B1 (de)
CN (1) CN101141834A (de)
MY (1) MY141179A (de)
SG (1) SG141311A1 (de)
TW (1) TW200814832A (de)
WO (1) WO2008029972A1 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4264104B2 (ja) * 2004-03-09 2009-05-13 パナソニック株式会社 エレクトレットコンデンサーマイクロホン
KR100834884B1 (ko) 2007-01-17 2008-06-03 주식회사 씨에스티 음/전 변환 패키지
KR100856892B1 (ko) 2007-01-23 2008-09-05 주식회사 씨에스티 음/전 변환 패키지
US8283756B2 (en) * 2007-08-20 2012-10-09 Infineon Technologies Ag Electronic component with buffer layer
KR101008399B1 (ko) * 2007-09-03 2011-01-14 주식회사 비에스이 내벽을 금속성 혹은 전도성 물질로 감싼 세라믹 패키지를이용한 콘덴서 마이크로폰
JP5298384B2 (ja) * 2008-08-07 2013-09-25 船井電機株式会社 マイクロホンユニット
KR100970894B1 (ko) * 2008-09-19 2010-07-20 주식회사 씨에스티 음／전 변환 소자 및 그 제조방법
JP5375311B2 (ja) 2009-04-28 2013-12-25 オムロン株式会社 電子部品実装装置及びその製造方法
JP5402320B2 (ja) * 2009-07-01 2014-01-29 船井電機株式会社 マイクロホンユニット
KR101066557B1 (ko) * 2009-10-14 2011-09-21 주식회사 비에스이 플로팅 구조의 콘덴서 마이크로폰 조립체
JP5409430B2 (ja) * 2010-02-22 2014-02-05 株式会社オーディオテクニカ グースネック型コンデンサマイクロホン
KR101000968B1 (ko) 2010-04-16 2010-12-13 주식회사 네오스코 디지털 마이크로폰용 몸체 및 그 제조방법
CN102238455A (zh) * 2010-04-23 2011-11-09 安国国际科技股份有限公司 具有电磁波接收器的声音感测器
KR101288284B1 (ko) * 2010-10-27 2013-07-26 삼성전기주식회사 반도체 패키지 제조 방법
KR101153570B1 (ko) * 2010-11-01 2012-06-11 삼성전기주식회사 반도체 패키지 모듈
ITTO20110577A1 (it) 2011-06-30 2012-12-31 Stmicroelectronics Malta Ltd Incapsulamento per un sensore mems e relativo procedimento di fabbricazione
KR101992596B1 (ko) * 2011-08-16 2019-06-25 삼성전자 주식회사 반도체 장치
US8824706B2 (en) * 2011-08-30 2014-09-02 Qualcomm Mems Technologies, Inc. Piezoelectric microphone fabricated on glass
US8724832B2 (en) 2011-08-30 2014-05-13 Qualcomm Mems Technologies, Inc. Piezoelectric microphone fabricated on glass
JP2013090142A (ja) * 2011-10-18 2013-05-13 Hosiden Corp エレクトレットコンデンサマイクロホン
KR101320574B1 (ko) 2011-11-30 2013-10-23 주식회사 비에스이 멤스 마이크로폰
US9078063B2 (en) * 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
ITTO20120976A1 (it) 2012-11-09 2014-05-10 St Microelectronics Srl Procedimento per la fabbricazione di un cappuccio per una struttura di incapsulamento di dispositivi elettronici e cappuccio per una struttura di incapsulamento di dispositivi elettronici
CN102938867A (zh) * 2012-11-26 2013-02-20 山东共达电声股份有限公司 抗气压吹击声电传感器
US9226052B2 (en) 2013-01-22 2015-12-29 Invensense, Inc. Microphone system with non-orthogonally mounted microphone die
KR101452396B1 (ko) * 2013-04-08 2014-10-27 싸니코전자 주식회사 복수의 음향통과홀을 구비한 멤스 마이크로폰
US9508663B2 (en) * 2013-07-24 2016-11-29 Invensense, Inc. Assembly and packaging of MEMS device
ITTO20130651A1 (it) 2013-07-31 2015-02-01 St Microelectronics Srl Procedimento di fabbricazione di un dispositivo incapsulato, in particolare un sensore micro-elettro-meccanico incapsulato, dotato di una struttura accessibile, quale un microfono mems e dispositivo incapsulato cosi' ottenuto
KR101351906B1 (ko) 2013-09-10 2014-01-20 (주)비엔씨넷 실리콘 콘덴서 마이크로폰
KR101514332B1 (ko) * 2013-11-05 2015-04-22 (주)파트론 마이크로폰 패키지 및 그 제조 방법
US10589987B2 (en) * 2013-11-06 2020-03-17 Infineon Technologies Ag System and method for a MEMS transducer
US10689249B2 (en) 2015-09-16 2020-06-23 Advanced Semiconductor Engineering, Inc. Semiconductor device package including a wall and a grounding ring exposed from the wall
US10386173B2 (en) * 2015-11-19 2019-08-20 Kris Vossough Integrated sensory systems
KR101776725B1 (ko) * 2015-12-11 2017-09-08 현대자동차 주식회사 멤스 마이크로폰 및 그 제조방법
US10206023B2 (en) * 2016-07-06 2019-02-12 Knowles Electronics, Llc Transducer package with through-vias
JP7241310B2 (ja) * 2017-11-07 2023-03-17 パナソニックＩｐマネジメント株式会社 インターホン装置、及びインターホンシステム
CN110854575A (zh) * 2018-07-25 2020-02-28 鸿富锦精密工业(武汉)有限公司 Usb接口连接装置
US10728674B2 (en) * 2018-08-27 2020-07-28 Solid State System Co., Ltd. Microphone package
GB2584498B (en) * 2019-06-03 2021-06-02 Cirrus Logic Int Semiconductor Ltd Packaging for MEMS transducers
JP7180624B2 (ja) 2020-02-03 2022-11-30 株式会社デンソー 電力変換装置
CN212324360U (zh) * 2020-06-30 2021-01-08 瑞声声学科技(深圳)有限公司 麦克风
US11365118B1 (en) * 2020-12-03 2022-06-21 Knowles Electronics, Llc Acoustic transducer assembly

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4811886A (en) * 1988-02-18 1989-03-14 Ethicon, Inc. Staple positioning tab
KR910003966B1 (ko) * 1988-11-30 1991-06-17 진성전자 주식회사 전자콘덴서 마이크로폰의 진동판
KR920000387B1 (ko) * 1989-07-08 1992-01-13 한국전자통신연구소 프레임 동기회로
JP3049566B2 (ja) * 1990-10-01 2000-06-05 株式会社オーディオテクニカ マイクロホンの音響管
JP3427032B2 (ja) * 2000-02-28 2003-07-14 京セラ株式会社 エレクトレットコンデンサマイクロホン
JP3805576B2 (ja) * 1999-09-14 2006-08-02 松下電器産業株式会社 振動変換器およびこの振動変換器を備えた加速度センサ
JP2001128278A (ja) * 1999-10-26 2001-05-11 Matsushita Electric Ind Co Ltd イヤホンジャック保持装置
WO2001061754A1 (en) * 2000-02-15 2001-08-23 Hitachi, Ltd. Semiconductor device fabrication method and semiconductor device fabrication device
JP2002124883A (ja) * 2000-10-17 2002-04-26 Matsushita Electric Ind Co Ltd 卓上ワイヤレスマイク
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US7434305B2 (en) * 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7062058B2 (en) * 2001-04-18 2006-06-13 Sonion Nederland B.V. Cylindrical microphone having an electret assembly in the end cover
KR200286533Y1 (ko) * 2002-05-15 2002-08-21 (주)비에이텔레콤 반도체 일렉트릭 콘덴서 마이크로폰 조립체
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
CN1810068A (zh) * 2003-06-19 2006-07-26 波零公司 印刷电路板的emi吸收屏蔽
KR100712149B1 (ko) * 2004-04-27 2007-04-27 호시덴 가부시기가이샤 일렉트릿 콘덴서 마이크로폰
JP2006211468A (ja) * 2005-01-31 2006-08-10 Sanyo Electric Co Ltd 半導体センサ
US7436054B2 (en) * 2006-03-03 2008-10-14 Silicon Matrix, Pte. Ltd. MEMS microphone with a stacked PCB package and method of producing the same

Also Published As

Publication number Publication date
EP1898668A3 (de) 2009-11-11
KR100740463B1 (ko) 2007-07-18
TW200814832A (en) 2008-03-16
SG141311A1 (en) 2008-04-28
CN101141834A (zh) 2008-03-12
WO2008029972A1 (en) 2008-03-13
EP1898668A2 (de) 2008-03-12
US20080063232A1 (en) 2008-03-13
JP2008067383A (ja) 2008-03-21

Similar Documents

Publication Publication Date Title
MY141179A (en) Silicon condenser microphone
US8670579B2 (en) MEMS microphone
US8331589B2 (en) MEMS microphone
US9992563B2 (en) MEMS microphone
KR101443477B1 (ko) Ｍｅｍｓ 장치용 반도체 패키지 및 그 제조 방법
US8816453B2 (en) MEMS component and a semiconductor component in a common housing having at least one access opening
EP2273247A3 (de) Drucksensorverpackung mit einem spannungsfreien Sensor-Chip
US20100086146A1 (en) Silicon-based microphone package
WO2001019134A3 (en) Silicon-based sensor system
EP1992588A2 (de) Verkapselung eines MEMS-Mikrofons
EP1992589A3 (de) Verkapselung eines MEMS-Mikrofons
EP2403065A3 (de) Gehäuse für elektronische Vorrichtung mit darin eingebettetem Antennenmuster, Herstellungsverfahren dafür, Form zur Herstellung eines Antennenmusterrahmens und elektronische Vorrichtung
SG144862A1 (en) Image sensor module and the method of the same
CN101316462A (zh) 微机电系统麦克风封装体及其封装组件
US8519492B2 (en) Silicon condenser microphone having an additional back chamber and a fabrication method therefor
US20130320465A1 (en) Thin mems microphone module
MY146310A (en) Condenser microphone using the ceramic package whose inside is encompassed by metal or conductive materials
EP2088841A3 (de) Umgossene elektronische Baugruppe mit Metalldichtring
CN101437187A (zh) 用以减缩微型传感器封装体积的堆叠式封装结构
WO2007010421A3 (en) Mems microphone and package
US20090141913A1 (en) Microelectromechanical system
EP1566992A3 (de) Technik zur Entkopplung zwischen Verbinder und Leiterplatte zur Eliminierung von Biegungen
US20110268296A1 (en) Condenser microphone assembly with floating configuration
HK1120901A1 (en) Analogue watch comprising a micro-transponder associated with an antenna- resonator intended for increasing the reading distance of said micro- transponder using an rfid reader
TWM344696U (en) Condenser microphone