WO2007010421A3 - Mems microphone and package - Google Patents

Mems microphone and package Download PDF

Info

Publication number
WO2007010421A3
WO2007010421A3 PCT/IB2006/052262 IB2006052262W WO2007010421A3 WO 2007010421 A3 WO2007010421 A3 WO 2007010421A3 IB 2006052262 W IB2006052262 W IB 2006052262W WO 2007010421 A3 WO2007010421 A3 WO 2007010421A3
Authority
WO
WIPO (PCT)
Prior art keywords
die
microphone
package
alcu
backplate
Prior art date
Application number
PCT/IB2006/052262
Other languages
French (fr)
Other versions
WO2007010421A2 (en
Inventor
Langereis Geert
Original Assignee
Koninkl Philips Electronics Nv
Langereis Geert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Langereis Geert filed Critical Koninkl Philips Electronics Nv
Publication of WO2007010421A2 publication Critical patent/WO2007010421A2/en
Publication of WO2007010421A3 publication Critical patent/WO2007010421A3/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

Abstract

A microphone package has a first die (10), a microphone (15) formed on the first die, one or more passive components (20) formed on the first die, and an integrated circuit (25) on a second die (30), mounted on the first die and electrically coupled to the microphone or passive components. Compared to integrating the microphone on the same die as an integrated circuit, the first die can use fewer layers, and fewer processing steps. An integrated capacitive microphone has a diaphragm (70, 230) and a backplate (120, 190) for the microphone made of Al or AlCu on a substrate (40). These materials are more conductive and therefore the associated circuitry can be more sensitive or use less power. Forming the diaphragm and backplate by evaporation or sputtering of Al or AlCu on a substrate is more cost effective.
PCT/IB2006/052262 2005-07-18 2006-07-05 Mems microphone and package WO2007010421A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05106569 2005-07-18
EP05106569.6 2005-07-18

Publications (2)

Publication Number Publication Date
WO2007010421A2 WO2007010421A2 (en) 2007-01-25
WO2007010421A3 true WO2007010421A3 (en) 2007-10-11

Family

ID=37669195

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2006/052262 WO2007010421A2 (en) 2005-07-18 2006-07-05 Mems microphone and package

Country Status (2)

Country Link
TW (1) TW200711510A (en)
WO (1) WO2007010421A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007019639A1 (en) * 2007-04-26 2008-10-30 Robert Bosch Gmbh Micromechanical component and corresponding manufacturing method
GB2451909B (en) 2007-08-17 2012-07-11 Wolfson Microelectronics Plc Mems process and device
GB2467848B (en) * 2009-02-13 2011-01-12 Wolfson Microelectronics Plc MEMS device and process
CN102349311B (en) 2009-03-09 2014-09-17 Nxp股份有限公司 Device comprising microphone and accelerometer, manufacturing method and using method
JP6245989B2 (en) * 2011-03-04 2017-12-13 Tdk株式会社 Method for positioning a membrane between a microphone and two backplates
GB2543443B (en) * 2014-06-10 2017-09-13 Cirrus Logic Int Semiconductor Ltd Packaging for MEMS transducers
US10715924B2 (en) * 2018-06-25 2020-07-14 Taiwan Semiconductor Manufacturing Co., Ltd. MEMS microphone having diaphragm
US11498830B2 (en) 2020-03-09 2022-11-15 Solid State System Co., Ltd. Structure of micro-electro-mechanical-system microphone and method for fabricating the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4495385A (en) * 1982-12-02 1985-01-22 Honeywell Inc. Acoustic microphone
US4507705A (en) * 1982-08-27 1985-03-26 Nissan Motor Company, Limited Vibration analyzing device
US5889872A (en) * 1996-07-02 1999-03-30 Motorola, Inc. Capacitive microphone and method therefor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4507705A (en) * 1982-08-27 1985-03-26 Nissan Motor Company, Limited Vibration analyzing device
US4495385A (en) * 1982-12-02 1985-01-22 Honeywell Inc. Acoustic microphone
US5889872A (en) * 1996-07-02 1999-03-30 Motorola, Inc. Capacitive microphone and method therefor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PEDERSEN M, OLTHUIS W, BERGVELD P: "An integrated silicon capacitive microphone with frequency-modulated digital output", SENSORS AND ACTUATORS A, vol. 69, no. 3, 15 September 1998 (1998-09-15), pages 267 - 275, XP004140050, ISSN: 0924-4247 *

Also Published As

Publication number Publication date
WO2007010421A2 (en) 2007-01-25
TW200711510A (en) 2007-03-16

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