TW200711510A - Mems microphone and package - Google Patents

Mems microphone and package

Info

Publication number
TW200711510A
TW200711510A TW095125893A TW95125893A TW200711510A TW 200711510 A TW200711510 A TW 200711510A TW 095125893 A TW095125893 A TW 095125893A TW 95125893 A TW95125893 A TW 95125893A TW 200711510 A TW200711510 A TW 200711510A
Authority
TW
Taiwan
Prior art keywords
die
microphone
package
alcu
backplate
Prior art date
Application number
TW095125893A
Other languages
Chinese (zh)
Inventor
Geert Langereis
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200711510A publication Critical patent/TW200711510A/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

Abstract

A microphone package has a first die (10), a microphone (15) formed on the first die, one or more passive components (20) formed on the first die, and an integrated circuit (25) on a second die (30), mounted on the first die and electrically coupled to the microphone or passive components. Compared to integrating the microphone on the same die as an integrated circuit, the first die can use fewer layers, and fewer processing steps. An integrated capacitive microphone has a diaphragm (70, 230) and a backplate (120, 190) for the microphone made of Al or AlCu on a substrate (40). These materials are more conductive and therefore the associated circuitry can be more sensitive or use less power. Forming the diaphragm and backplate by evaporation or sputtering of Al or AlCu on a substrate is more cost effective.
TW095125893A 2005-07-18 2006-07-14 Mems microphone and package TW200711510A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05106569 2005-07-18

Publications (1)

Publication Number Publication Date
TW200711510A true TW200711510A (en) 2007-03-16

Family

ID=37669195

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125893A TW200711510A (en) 2005-07-18 2006-07-14 Mems microphone and package

Country Status (2)

Country Link
TW (1) TW200711510A (en)
WO (1) WO2007010421A2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8546170B2 (en) 2007-08-17 2013-10-01 Wolfson Microelectronics Plc MEMS process and device
TWI457270B (en) * 2009-02-13 2014-10-21 Wolfson Microelectronics Plc Mems device and process
TWI458671B (en) * 2007-04-26 2014-11-01 Bosch Gmbh Robert Mikromechanisches bauelement und entsprechendes herstellungsverfahren
TWI754969B (en) * 2020-03-09 2022-02-11 鑫創科技股份有限公司 Structure of micro-electro-mechanical-system microphone and method for fabricating the same
TWI773903B (en) * 2018-06-25 2022-08-11 台灣積體電路製造股份有限公司 Mems microphone having diaphragm

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102349311B (en) 2009-03-09 2014-09-17 Nxp股份有限公司 Device comprising microphone and accelerometer, manufacturing method and using method
JP6245989B2 (en) * 2011-03-04 2017-12-13 Tdk株式会社 Method for positioning a membrane between a microphone and two backplates
GB2543443B (en) * 2014-06-10 2017-09-13 Cirrus Logic Int Semiconductor Ltd Packaging for MEMS transducers

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5938621A (en) * 1982-08-27 1984-03-02 Nissan Motor Co Ltd Analyzing device for vibration
US4495385A (en) * 1982-12-02 1985-01-22 Honeywell Inc. Acoustic microphone
US5889872A (en) * 1996-07-02 1999-03-30 Motorola, Inc. Capacitive microphone and method therefor

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458671B (en) * 2007-04-26 2014-11-01 Bosch Gmbh Robert Mikromechanisches bauelement und entsprechendes herstellungsverfahren
US8698256B2 (en) 2007-07-17 2014-04-15 Wolfson Microelectronics Plc MEMS process and device
US8546170B2 (en) 2007-08-17 2013-10-01 Wolfson Microelectronics Plc MEMS process and device
US8803261B2 (en) 2007-08-17 2014-08-12 Wolfson Microelectronics Plc MEMS process and device
US9363610B2 (en) 2007-08-17 2016-06-07 Cirrus Logic, Inc. MEMS process and device
US9756430B2 (en) 2007-08-17 2017-09-05 Cirrus Logic, Inc. MEMS process and device
TWI457270B (en) * 2009-02-13 2014-10-21 Wolfson Microelectronics Plc Mems device and process
TWI773903B (en) * 2018-06-25 2022-08-11 台灣積體電路製造股份有限公司 Mems microphone having diaphragm
TWI754969B (en) * 2020-03-09 2022-02-11 鑫創科技股份有限公司 Structure of micro-electro-mechanical-system microphone and method for fabricating the same
US11498830B2 (en) 2020-03-09 2022-11-15 Solid State System Co., Ltd. Structure of micro-electro-mechanical-system microphone and method for fabricating the same

Also Published As

Publication number Publication date
WO2007010421A2 (en) 2007-01-25
WO2007010421A3 (en) 2007-10-11

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