MY134649A - PROCESS FOR FILLING µ-BLIND VIAS - Google Patents
PROCESS FOR FILLING µ-BLIND VIASInfo
- Publication number
- MY134649A MY134649A MYPI20042090A MYPI20042090A MY134649A MY 134649 A MY134649 A MY 134649A MY PI20042090 A MYPI20042090 A MY PI20042090A MY PI20042090 A MYPI20042090 A MY PI20042090A MY 134649 A MY134649 A MY 134649A
- Authority
- MY
- Malaysia
- Prior art keywords
- bath
- electrolyte
- withdrawn
- galvanic
- filling
- Prior art date
Links
- 239000003792 electrolyte Substances 0.000 abstract 5
- 239000002184 metal Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 239000006259 organic additive Substances 0.000 abstract 2
- 239000007800 oxidant agent Substances 0.000 abstract 2
- 238000004090 dissolution Methods 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 238000004064 recycling Methods 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Peptides Or Proteins (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10325101A DE10325101A1 (de) | 2003-06-03 | 2003-06-03 | Verfahren zum Auffüllen von µ-Blind-Vias (µ-BVs) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY134649A true MY134649A (en) | 2007-12-31 |
Family
ID=33482448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20042090A MY134649A (en) | 2003-06-03 | 2004-05-31 | PROCESS FOR FILLING µ-BLIND VIAS |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP1629704B1 (enExample) |
| JP (1) | JP4392019B2 (enExample) |
| KR (1) | KR20060004981A (enExample) |
| CN (1) | CN1799294B (enExample) |
| AT (1) | ATE348499T1 (enExample) |
| DE (2) | DE10325101A1 (enExample) |
| MY (1) | MY134649A (enExample) |
| TW (1) | TWI350860B (enExample) |
| WO (1) | WO2004107834A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004045451B4 (de) * | 2004-09-20 | 2007-05-03 | Atotech Deutschland Gmbh | Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer |
| ATE484943T1 (de) | 2006-03-30 | 2010-10-15 | Atotech Deutschland Gmbh | Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen |
| DE102007036651A1 (de) * | 2007-07-25 | 2009-01-29 | A.C.K. Aqua Concept Gmbh Karlsruhe | Prozessrecycling galvanischer Bäder |
| JP4957906B2 (ja) * | 2007-07-27 | 2012-06-20 | 上村工業株式会社 | 連続電気銅めっき方法 |
| JP5471276B2 (ja) * | 2009-10-15 | 2014-04-16 | 上村工業株式会社 | 電気銅めっき浴及び電気銅めっき方法 |
| CN102427684B (zh) * | 2011-11-08 | 2014-04-23 | 汕头超声印制板（二厂）有限公司 | 一种高密度互连印制电路板的制造方法 |
| TWI539033B (zh) * | 2013-01-07 | 2016-06-21 | Chang Chun Petrochemical Co | Electrolytic copper foil and its preparation method |
| US11047064B2 (en) | 2013-01-10 | 2021-06-29 | Coventya, Inc. | Apparatus and method to maintaining trivalent chromium bath plating |
| MX382861B (es) * | 2013-01-10 | 2025-03-13 | Macdermid Inc | Aparato y metodo de mantenimiento de eficiencia galvanoplastia con baño de cromo trivalente. |
| CN103118506B (zh) * | 2013-01-22 | 2016-05-04 | 金悦通电子（翁源）有限公司 | 一种焊盘上导通孔的电镀填孔方法 |
| JP2017210644A (ja) * | 2016-05-24 | 2017-11-30 | メルテックス株式会社 | 溶解性銅陽極、電解銅めっき装置、電解銅めっき方法、及び酸性電解銅めっき液の保存方法 |
| CN111705344A (zh) * | 2020-07-01 | 2020-09-25 | 孙颖睿 | 一种用于脉冲镀铜工艺的工作液补充方法 |
| CN119481358B (zh) * | 2024-11-15 | 2025-08-22 | 广东工业大学 | 一种可用于高倍率锡金属负极和锡锰电池的水系电解液 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4344387C2 (de) * | 1993-12-24 | 1996-09-05 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens |
| DE19525509C2 (de) * | 1994-07-22 | 1997-10-02 | Lpw Anlagen Gmbh | Anwendung der UV/H¶2¶O¶2¶-Oxidationsbehandlung zur betriebsmäßigen Wiederverwendungs- oder Weiterverwendungsaufbereitung eines Bades für die galvanotechnische Beschichtung von Gegenständen mit metallischen Überzügen |
| US5523001A (en) * | 1994-12-30 | 1996-06-04 | At&T Corp. | Treatment of electroless plating waste streams |
| DE19810859A1 (de) * | 1998-03-13 | 1999-09-16 | A C K Aqua Concept Gmbh Wasser | Kombinationsverfahren zur Behandlung eines schäumend eingestellten galvanischen Bads |
| DE19915146C1 (de) * | 1999-01-21 | 2000-07-06 | Atotech Deutschland Gmbh | Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen |
| JP2001267726A (ja) * | 2000-03-22 | 2001-09-28 | Toyota Autom Loom Works Ltd | 配線基板の電解メッキ方法及び配線基板の電解メッキ装置 |
| US6942779B2 (en) * | 2000-05-25 | 2005-09-13 | Mykrolis Corporation | Method and system for regenerating of plating baths |
| US6881319B2 (en) * | 2000-12-20 | 2005-04-19 | Shipley Company, L.L.C. | Electrolytic copper plating solution and method for controlling the same |
| TWI268966B (en) * | 2001-06-07 | 2006-12-21 | Shipley Co Llc | Electrolytic copper plating method |
| JP4510369B2 (ja) * | 2002-11-28 | 2010-07-21 | 日本リーロナール有限会社 | 電解銅めっき方法 |
-
2003
- 2003-06-03 DE DE10325101A patent/DE10325101A1/de not_active Withdrawn
-
2004
- 2004-05-31 MY MYPI20042090A patent/MY134649A/en unknown
- 2004-05-31 TW TW093115557A patent/TWI350860B/zh not_active IP Right Cessation
- 2004-06-01 EP EP04739481A patent/EP1629704B1/en not_active Expired - Lifetime
- 2004-06-01 WO PCT/EP2004/005874 patent/WO2004107834A1/en not_active Ceased
- 2004-06-01 AT AT04739481T patent/ATE348499T1/de active
- 2004-06-01 DE DE602004003698T patent/DE602004003698T2/de not_active Expired - Lifetime
- 2004-06-01 JP JP2006508236A patent/JP4392019B2/ja not_active Expired - Fee Related
- 2004-06-01 CN CN2004800154362A patent/CN1799294B/zh not_active Expired - Fee Related
- 2004-06-01 KR KR1020057021326A patent/KR20060004981A/ko not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004107834A1 (en) | 2004-12-09 |
| KR20060004981A (ko) | 2006-01-16 |
| JP2006526890A (ja) | 2006-11-24 |
| CN1799294B (zh) | 2012-02-08 |
| JP4392019B2 (ja) | 2009-12-24 |
| DE602004003698D1 (de) | 2007-01-25 |
| TW200508422A (en) | 2005-03-01 |
| ATE348499T1 (de) | 2007-01-15 |
| EP1629704A1 (en) | 2006-03-01 |
| CN1799294A (zh) | 2006-07-05 |
| EP1629704B1 (en) | 2006-12-13 |
| DE10325101A1 (de) | 2004-12-30 |
| DE602004003698T2 (de) | 2007-04-12 |
| TWI350860B (en) | 2011-10-21 |
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