ATE348499T1 - Verfahren zum auffüllen von mikroblindlöchern - Google Patents

Verfahren zum auffüllen von mikroblindlöchern

Info

Publication number
ATE348499T1
ATE348499T1 AT04739481T AT04739481T ATE348499T1 AT E348499 T1 ATE348499 T1 AT E348499T1 AT 04739481 T AT04739481 T AT 04739481T AT 04739481 T AT04739481 T AT 04739481T AT E348499 T1 ATE348499 T1 AT E348499T1
Authority
AT
Austria
Prior art keywords
electrolyte
bath
withdrawn
galvanic
current density
Prior art date
Application number
AT04739481T
Other languages
German (de)
English (en)
Inventor
Akif Oezkoek
Bernd Ottmar Roelfs
Oswald Igel
Herko Genth
Kai-Jens Matejat
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE348499T1 publication Critical patent/ATE348499T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Peptides Or Proteins (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
AT04739481T 2003-06-03 2004-06-01 Verfahren zum auffüllen von mikroblindlöchern ATE348499T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10325101A DE10325101A1 (de) 2003-06-03 2003-06-03 Verfahren zum Auffüllen von µ-Blind-Vias (µ-BVs)

Publications (1)

Publication Number Publication Date
ATE348499T1 true ATE348499T1 (de) 2007-01-15

Family

ID=33482448

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04739481T ATE348499T1 (de) 2003-06-03 2004-06-01 Verfahren zum auffüllen von mikroblindlöchern

Country Status (9)

Country Link
EP (1) EP1629704B1 (enExample)
JP (1) JP4392019B2 (enExample)
KR (1) KR20060004981A (enExample)
CN (1) CN1799294B (enExample)
AT (1) ATE348499T1 (enExample)
DE (2) DE10325101A1 (enExample)
MY (1) MY134649A (enExample)
TW (1) TWI350860B (enExample)
WO (1) WO2004107834A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004045451B4 (de) 2004-09-20 2007-05-03 Atotech Deutschland Gmbh Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
KR101335480B1 (ko) * 2006-03-30 2013-12-02 아토테크 도이칠란드 게엠베하 홀 및 캐비티를 금속으로 충전하기 위한 전기분해 방법
DE102007036651A1 (de) * 2007-07-25 2009-01-29 A.C.K. Aqua Concept Gmbh Karlsruhe Prozessrecycling galvanischer Bäder
JP4957906B2 (ja) * 2007-07-27 2012-06-20 上村工業株式会社 連続電気銅めっき方法
JP5471276B2 (ja) * 2009-10-15 2014-04-16 上村工業株式会社 電気銅めっき浴及び電気銅めっき方法
CN102427684B (zh) * 2011-11-08 2014-04-23 汕头超声印制板（二厂）有限公司 一种高密度互连印制电路板的制造方法
TWI539033B (zh) * 2013-01-07 2016-06-21 Chang Chun Petrochemical Co Electrolytic copper foil and its preparation method
US11047064B2 (en) 2013-01-10 2021-06-29 Coventya, Inc. Apparatus and method to maintaining trivalent chromium bath plating
CN105264122B (zh) * 2013-01-10 2018-11-02 科文特亚股份有限公司 保持三价铬电镀浴电镀效率的仪器和方法
CN103118506B (zh) * 2013-01-22 2016-05-04 金悦通电子（翁源）有限公司 一种焊盘上导通孔的电镀填孔方法
JP2017210644A (ja) * 2016-05-24 2017-11-30 メルテックス株式会社 溶解性銅陽極、電解銅めっき装置、電解銅めっき方法、及び酸性電解銅めっき液の保存方法
CN111705344A (zh) * 2020-07-01 2020-09-25 孙颖睿 一种用于脉冲镀铜工艺的工作液补充方法
CN119481358B (zh) * 2024-11-15 2025-08-22 广东工业大学 一种可用于高倍率锡金属负极和锡锰电池的水系电解液

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
DE19525509C2 (de) * 1994-07-22 1997-10-02 Lpw Anlagen Gmbh Anwendung der UV/H¶2¶O¶2¶-Oxidationsbehandlung zur betriebsmäßigen Wiederverwendungs- oder Weiterverwendungsaufbereitung eines Bades für die galvanotechnische Beschichtung von Gegenständen mit metallischen Überzügen
US5523001A (en) * 1994-12-30 1996-06-04 At&T Corp. Treatment of electroless plating waste streams
DE19810859A1 (de) * 1998-03-13 1999-09-16 A C K Aqua Concept Gmbh Wasser Kombinationsverfahren zur Behandlung eines schäumend eingestellten galvanischen Bads
DE19915146C1 (de) * 1999-01-21 2000-07-06 Atotech Deutschland Gmbh Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen
JP2001267726A (ja) * 2000-03-22 2001-09-28 Toyota Autom Loom Works Ltd 配線基板の電解メッキ方法及び配線基板の電解メッキ装置
US6942779B2 (en) * 2000-05-25 2005-09-13 Mykrolis Corporation Method and system for regenerating of plating baths
US6881319B2 (en) * 2000-12-20 2005-04-19 Shipley Company, L.L.C. Electrolytic copper plating solution and method for controlling the same
TWI268966B (en) * 2001-06-07 2006-12-21 Shipley Co Llc Electrolytic copper plating method
JP4510369B2 (ja) * 2002-11-28 2010-07-21 日本リーロナール有限会社 電解銅めっき方法

Also Published As

Publication number Publication date
JP4392019B2 (ja) 2009-12-24
MY134649A (en) 2007-12-31
DE602004003698T2 (de) 2007-04-12
CN1799294B (zh) 2012-02-08
WO2004107834A1 (en) 2004-12-09
EP1629704A1 (en) 2006-03-01
EP1629704B1 (en) 2006-12-13
JP2006526890A (ja) 2006-11-24
TW200508422A (en) 2005-03-01
TWI350860B (en) 2011-10-21
KR20060004981A (ko) 2006-01-16
DE10325101A1 (de) 2004-12-30
CN1799294A (zh) 2006-07-05
DE602004003698D1 (de) 2007-01-25

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