CN1799294B - 填充微盲孔的方法 - Google Patents

填充微盲孔的方法 Download PDF

Info

Publication number
CN1799294B
CN1799294B CN2004800154362A CN200480015436A CN1799294B CN 1799294 B CN1799294 B CN 1799294B CN 2004800154362 A CN2004800154362 A CN 2004800154362A CN 200480015436 A CN200480015436 A CN 200480015436A CN 1799294 B CN1799294 B CN 1799294B
Authority
CN
China
Prior art keywords
electrolyte
copper
bath
metal
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2004800154362A
Other languages
English (en)
Chinese (zh)
Other versions
CN1799294A (zh
Inventor
A·厄兹柯克
B·O·勒尔夫斯
O·伊格尔
H·根特
K-J·马泰亚特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of CN1799294A publication Critical patent/CN1799294A/zh
Application granted granted Critical
Publication of CN1799294B publication Critical patent/CN1799294B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Peptides Or Proteins (AREA)
CN2004800154362A 2003-06-03 2004-06-01 填充微盲孔的方法 Expired - Fee Related CN1799294B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10325101A DE10325101A1 (de) 2003-06-03 2003-06-03 Verfahren zum Auffüllen von µ-Blind-Vias (µ-BVs)
DE10325101.4 2003-06-03
PCT/EP2004/005874 WO2004107834A1 (en) 2003-06-03 2004-06-01 Process for filing micro-blind vias

Publications (2)

Publication Number Publication Date
CN1799294A CN1799294A (zh) 2006-07-05
CN1799294B true CN1799294B (zh) 2012-02-08

Family

ID=33482448

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2004800154362A Expired - Fee Related CN1799294B (zh) 2003-06-03 2004-06-01 填充微盲孔的方法

Country Status (9)

Country Link
EP (1) EP1629704B1 (enExample)
JP (1) JP4392019B2 (enExample)
KR (1) KR20060004981A (enExample)
CN (1) CN1799294B (enExample)
AT (1) ATE348499T1 (enExample)
DE (2) DE10325101A1 (enExample)
MY (1) MY134649A (enExample)
TW (1) TWI350860B (enExample)
WO (1) WO2004107834A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004045451B4 (de) * 2004-09-20 2007-05-03 Atotech Deutschland Gmbh Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
ATE484943T1 (de) 2006-03-30 2010-10-15 Atotech Deutschland Gmbh Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen
DE102007036651A1 (de) * 2007-07-25 2009-01-29 A.C.K. Aqua Concept Gmbh Karlsruhe Prozessrecycling galvanischer Bäder
JP4957906B2 (ja) * 2007-07-27 2012-06-20 上村工業株式会社 連続電気銅めっき方法
JP5471276B2 (ja) * 2009-10-15 2014-04-16 上村工業株式会社 電気銅めっき浴及び電気銅めっき方法
CN102427684B (zh) * 2011-11-08 2014-04-23 汕头超声印制板（二厂）有限公司 一种高密度互连印制电路板的制造方法
TWI539033B (zh) * 2013-01-07 2016-06-21 Chang Chun Petrochemical Co Electrolytic copper foil and its preparation method
US11047064B2 (en) 2013-01-10 2021-06-29 Coventya, Inc. Apparatus and method to maintaining trivalent chromium bath plating
MX382861B (es) * 2013-01-10 2025-03-13 Macdermid Inc Aparato y metodo de mantenimiento de eficiencia galvanoplastia con baño de cromo trivalente.
CN103118506B (zh) * 2013-01-22 2016-05-04 金悦通电子（翁源）有限公司 一种焊盘上导通孔的电镀填孔方法
JP2017210644A (ja) * 2016-05-24 2017-11-30 メルテックス株式会社 溶解性銅陽極、電解銅めっき装置、電解銅めっき方法、及び酸性電解銅めっき液の保存方法
CN111705344A (zh) * 2020-07-01 2020-09-25 孙颖睿 一种用于脉冲镀铜工艺的工作液补充方法
CN119481358B (zh) * 2024-11-15 2025-08-22 广东工业大学 一种可用于高倍率锡金属负极和锡锰电池的水系电解液

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19525509A1 (de) * 1994-07-22 1996-01-25 Lpw Anlagen Gmbh Verfahren zur Aufbereitung eines Bades für die galvanotechnische Beschichtung von Gegenständen mit metallischen Überzügen

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
US5523001A (en) * 1994-12-30 1996-06-04 At&T Corp. Treatment of electroless plating waste streams
DE19810859A1 (de) * 1998-03-13 1999-09-16 A C K Aqua Concept Gmbh Wasser Kombinationsverfahren zur Behandlung eines schäumend eingestellten galvanischen Bads
DE19915146C1 (de) * 1999-01-21 2000-07-06 Atotech Deutschland Gmbh Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen
JP2001267726A (ja) * 2000-03-22 2001-09-28 Toyota Autom Loom Works Ltd 配線基板の電解メッキ方法及び配線基板の電解メッキ装置
US6942779B2 (en) * 2000-05-25 2005-09-13 Mykrolis Corporation Method and system for regenerating of plating baths
US6881319B2 (en) * 2000-12-20 2005-04-19 Shipley Company, L.L.C. Electrolytic copper plating solution and method for controlling the same
TWI268966B (en) * 2001-06-07 2006-12-21 Shipley Co Llc Electrolytic copper plating method
JP4510369B2 (ja) * 2002-11-28 2010-07-21 日本リーロナール有限会社 電解銅めっき方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19525509A1 (de) * 1994-07-22 1996-01-25 Lpw Anlagen Gmbh Verfahren zur Aufbereitung eines Bades für die galvanotechnische Beschichtung von Gegenständen mit metallischen Überzügen

Also Published As

Publication number Publication date
WO2004107834A1 (en) 2004-12-09
KR20060004981A (ko) 2006-01-16
JP2006526890A (ja) 2006-11-24
JP4392019B2 (ja) 2009-12-24
DE602004003698D1 (de) 2007-01-25
TW200508422A (en) 2005-03-01
ATE348499T1 (de) 2007-01-15
EP1629704A1 (en) 2006-03-01
CN1799294A (zh) 2006-07-05
EP1629704B1 (en) 2006-12-13
DE10325101A1 (de) 2004-12-30
MY134649A (en) 2007-12-31
DE602004003698T2 (de) 2007-04-12
TWI350860B (en) 2011-10-21

Similar Documents

Publication Publication Date Title
CN1799294B (zh) 填充微盲孔的方法
TWI448588B (zh) 連續電鍍銅之方法
EP0690934B1 (de) Verfahren und vorrichtung zur elektrolytischen abscheidung von metallschichten
TWI252870B (en) Plating bath and method for depositing a metal layer on a substrate
KR100740817B1 (ko) 전해질 내의 금속 이온 농도의 조절 방법 및 장치, 및그의 용도
KR100948197B1 (ko) 간헐반응 및 분리막과 전기분해장치를 이용한 질소 및 인 제거를 위한 고도 수처리 장치 및 이를 이용한 고도 수처리방법
CN115466957A (zh) 一种酸性氯化铜蚀刻废液沉淀取铜电解再生方法及其装置
CA1065272A (en) Treatment of dilute cyanide solutions
KR20230113249A (ko) 유가 물질 순환에서 회로 보드 및/또는 기판의 제조
KR100934729B1 (ko) 무전해 주석도금액 불순물 제거장치 및 방법
EP0524493A2 (en) Electrolytic process for reducing the organic content of an aqueous composition and apparatus therefore
JP3454829B2 (ja) プロセス有機物で電解液から金属を電解的に析出する方法
KR100426159B1 (ko) 금속막의전착방법및이를위한장치
EP3189170B1 (en) Process and apparatus for metal refining
JP2006206961A (ja) フィルム状物への連続銅めっき装置および方法
EP4400634A1 (en) Process for producing copper foil by electrolytic deposition of copper
JP2000160400A (ja) 非溶解性陽極による電気メッキ法及びその装置
KR100601490B1 (ko) 스택형 비아홀 충전 동도금액의 재생 처리방법
JP2005179736A (ja) 電解銅めっき方法及び電解銅めっき装置
KR20240159481A (ko) 전해 구리 도금액의 재생 처리 방법 및 전해 구리 도금액의 재생 처리 시스템
JP2006095391A (ja) 廃水処理装置および方法
JP2007100113A (ja) 銅めっき方法とそれに用いる塩素イオン電解除去装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120208

Termination date: 20190601