MY118754A - Holding cassette for precision substrates and method for the preparation thereof - Google Patents

Holding cassette for precision substrates and method for the preparation thereof

Info

Publication number
MY118754A
MY118754A MYPI96004885A MYPI9604885A MY118754A MY 118754 A MY118754 A MY 118754A MY PI96004885 A MYPI96004885 A MY PI96004885A MY PI9604885 A MYPI9604885 A MY PI9604885A MY 118754 A MY118754 A MY 118754A
Authority
MY
Malaysia
Prior art keywords
moulding
positioning
preparation
improvement
gas
Prior art date
Application number
MYPI96004885A
Other languages
English (en)
Inventor
Keiji Kogure
Original Assignee
Shinetsu Polymer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Polymer Co filed Critical Shinetsu Polymer Co
Publication of MY118754A publication Critical patent/MY118754A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1703—Introducing an auxiliary fluid into the mould
    • B29C45/1704—Introducing an auxiliary fluid into the mould the fluid being introduced into the interior of the injected material which is still in a molten state, e.g. for producing hollow articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging For Recording Disks (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
MYPI96004885A 1995-11-27 1996-11-22 Holding cassette for precision substrates and method for the preparation thereof MY118754A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32943695A JP3423512B2 (ja) 1995-11-27 1995-11-27 精密基板用カセットの製造方法および精密基板用カセット

Publications (1)

Publication Number Publication Date
MY118754A true MY118754A (en) 2005-01-31

Family

ID=18221358

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI96004885A MY118754A (en) 1995-11-27 1996-11-22 Holding cassette for precision substrates and method for the preparation thereof

Country Status (7)

Country Link
US (1) US6019231A (ko)
EP (1) EP0775566B1 (ko)
JP (1) JP3423512B2 (ko)
KR (1) KR100355644B1 (ko)
DE (1) DE69602706T2 (ko)
MY (1) MY118754A (ko)
TW (1) TW309467B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW296361B (ko) * 1995-06-26 1997-01-21 Kakizaki Seisakusho Kk
JP4315548B2 (ja) 1999-11-19 2009-08-19 株式会社ブリヂストン タイヤカーカスの形成装置および形成方法
WO2006120866A1 (ja) * 2005-05-06 2006-11-16 Shin-Etsu Polymer Co., Ltd. 基板収納容器及びその製造方法
KR100843983B1 (ko) * 2006-06-19 2008-07-07 (주)에스티아이 식각기용 카세트

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3480151A (en) * 1967-04-05 1969-11-25 Heraeus Schott Quarzschmelze Supporting rack of quartz
US4043451A (en) * 1976-03-18 1977-08-23 Fluoroware, Inc. Shipping container for silicone semiconductor wafers
JPS59199477A (ja) * 1983-04-25 1984-11-12 住友電気工業株式会社 ウエハ−ボツクス
US4718552A (en) * 1986-12-11 1988-01-12 Fluoroware, Inc. Disk shipper and transfer tray
JPH0788025B2 (ja) * 1987-04-28 1995-09-27 三菱瓦斯化学株式会社 偏肉補強部構造を有する合成樹脂成形品の製造法
US4949848A (en) * 1988-04-29 1990-08-21 Fluoroware, Inc. Wafer carrier
US5154301A (en) * 1991-09-12 1992-10-13 Fluoroware, Inc. Wafer carrier
US5545027A (en) * 1993-06-02 1996-08-13 Mitsubishi Gas Chemical Company, Inc. Gas-feeding device for injection molding
JPH0716882A (ja) * 1993-06-29 1995-01-20 Sharp Corp 射出成形用金型
US5484278A (en) * 1994-02-14 1996-01-16 Pebra Gmbh Paul Braun Blow-out vent valve
US5511967A (en) * 1994-02-14 1996-04-30 Pebra Gmbh Paul Braun Self-contained gas injector
JPH0826380A (ja) * 1994-05-10 1996-01-30 Toshio Ishikawa 基板用カセットにおけるサイドレール及び基板用カセット
TW296361B (ko) * 1995-06-26 1997-01-21 Kakizaki Seisakusho Kk

Also Published As

Publication number Publication date
KR970030622A (ko) 1997-06-26
TW309467B (ko) 1997-07-01
DE69602706D1 (de) 1999-07-08
KR100355644B1 (ko) 2002-12-18
EP0775566A1 (en) 1997-05-28
JPH09147512A (ja) 1997-06-06
DE69602706T2 (de) 2000-01-13
JP3423512B2 (ja) 2003-07-07
EP0775566B1 (en) 1999-06-02
US6019231A (en) 2000-02-01

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