MXPA02010790A - Disipador termico y dispositivo para la disipacion de calor que utiliza el mismo. - Google Patents
Disipador termico y dispositivo para la disipacion de calor que utiliza el mismo.Info
- Publication number
- MXPA02010790A MXPA02010790A MXPA02010790A MXPA02010790A MXPA02010790A MX PA02010790 A MXPA02010790 A MX PA02010790A MX PA02010790 A MXPA02010790 A MX PA02010790A MX PA02010790 A MXPA02010790 A MX PA02010790A MX PA02010790 A MXPA02010790 A MX PA02010790A
- Authority
- MX
- Mexico
- Prior art keywords
- heatsink
- heat
- cool air
- plates
- dissipating efficiency
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
La presente invencion proporciona un disipador termico y un dispositivo para la disipacion de calor que utiliza el disipador termico. El disipador termico esta formado de una pluralidad de placas disipadoras de calor delgadas, y las placas disipadoras de calor individuales estan unidas entre si para que sean desplegadas radialmente hacia fuera, por lo cual agrandan el area superficial del disipador termico e incrementan su eficiencia para la disipacion del calor. En el dispositivo para la disipacion de calor, el disipador termico es instalado en un conducto de aire, y el aire frio es suministrado hacia el conducto de aire por un ventilador, para incrementar adicionalmente por medio de esto la eficiencia de la disipacion del calor. La fuerza de union del disipador termico a una fuente generadora de calor puede ser mantenida flexiblemente, lo cual permite que el disipador termico permanezca unido a la fuente generadora de calor aun despues de un impacto externo. Ademas, cortando una porcion superior de la placa disipadora de calor, las lineas de doblez de la placa disipadora de calor son acortadas de modo que las porciones absorbentes de calor de las placas disipadoras de calor apiladas una sobre la otra puedan ser unidas de manera cenida para formar un disipador termico por una fuerza reducida. El disipador termico resultante tiene un rebajo en el centro de su superficie superior. Esta estructura permite que el aire frio propulsado por el ventilador alcance el centro inferior del disipador termico, por lo cual se mejora adicionalmente la eficiencia de la disipacion del calor. Tambien, la vibracion y el ruido provocados mientras que el aire frio fluye sobre las porciones para la disipacion del calor del disipador termico, son reducidos.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010011056A KR20020070750A (ko) | 2001-03-03 | 2001-03-03 | 히트싱크장치 |
KR20010069985 | 2001-11-10 | ||
KR20010069984 | 2001-11-10 | ||
PCT/KR2002/000346 WO2002071822A1 (en) | 2001-03-03 | 2002-02-28 | Heatsink and heatsink device using the heatsink |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA02010790A true MXPA02010790A (es) | 2004-02-26 |
Family
ID=27350418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA02010790A MXPA02010790A (es) | 2001-03-03 | 2002-02-28 | Disipador termico y dispositivo para la disipacion de calor que utiliza el mismo. |
Country Status (11)
Country | Link |
---|---|
US (2) | US6712127B2 (es) |
EP (1) | EP1290928B1 (es) |
JP (1) | JP3637047B2 (es) |
KR (1) | KR100464914B1 (es) |
CN (1) | CN1215751C (es) |
AU (1) | AU2002235026B2 (es) |
BR (1) | BR0204457A (es) |
CA (1) | CA2408046A1 (es) |
DE (1) | DE60203858T2 (es) |
MX (1) | MXPA02010790A (es) |
WO (1) | WO2002071822A1 (es) |
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US6407919B1 (en) * | 2000-12-18 | 2002-06-18 | Fargo Chou | Structure of computer CPU heat dissipation module |
TW534371U (en) * | 2001-07-06 | 2003-05-21 | Jia-He Chen | CPU heat dissipation assembly part device |
-
2002
- 2002-02-28 CN CNB028000048A patent/CN1215751C/zh not_active Expired - Fee Related
- 2002-02-28 CA CA002408046A patent/CA2408046A1/en not_active Abandoned
- 2002-02-28 BR BR0204457-9A patent/BR0204457A/pt not_active IP Right Cessation
- 2002-02-28 KR KR10-2002-7014499A patent/KR100464914B1/ko active IP Right Grant
- 2002-02-28 DE DE60203858T patent/DE60203858T2/de not_active Expired - Lifetime
- 2002-02-28 MX MXPA02010790A patent/MXPA02010790A/es active IP Right Grant
- 2002-02-28 WO PCT/KR2002/000346 patent/WO2002071822A1/en active IP Right Grant
- 2002-02-28 EP EP02701795A patent/EP1290928B1/en not_active Expired - Fee Related
- 2002-02-28 JP JP2002570595A patent/JP3637047B2/ja not_active Expired - Fee Related
- 2002-02-28 AU AU2002235026A patent/AU2002235026B2/en not_active Expired - Fee Related
- 2002-03-04 US US10/086,368 patent/US6712127B2/en not_active Expired - Lifetime
- 2002-11-13 US US10/292,546 patent/US6782941B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1215751C (zh) | 2005-08-17 |
DE60203858T2 (de) | 2006-02-23 |
EP1290928A1 (en) | 2003-03-12 |
CN1456037A (zh) | 2003-11-12 |
KR100464914B1 (ko) | 2005-01-05 |
JP2004519854A (ja) | 2004-07-02 |
EP1290928A4 (en) | 2004-07-28 |
CA2408046A1 (en) | 2002-09-12 |
US20030079861A1 (en) | 2003-05-01 |
US20020121358A1 (en) | 2002-09-05 |
US6712127B2 (en) | 2004-03-30 |
AU2002235026B2 (en) | 2004-09-30 |
DE60203858D1 (de) | 2005-06-02 |
WO2002071822A1 (en) | 2002-09-12 |
EP1290928B1 (en) | 2005-04-27 |
JP3637047B2 (ja) | 2005-04-06 |
KR20020093995A (ko) | 2002-12-16 |
BR0204457A (pt) | 2004-06-22 |
US6782941B2 (en) | 2004-08-31 |
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