CN2799931Y - 风扇固定装置 - Google Patents

风扇固定装置 Download PDF

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Publication number
CN2799931Y
CN2799931Y CN200420102396.2U CN200420102396U CN2799931Y CN 2799931 Y CN2799931 Y CN 2799931Y CN 200420102396 U CN200420102396 U CN 200420102396U CN 2799931 Y CN2799931 Y CN 2799931Y
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China
Prior art keywords
plate body
fan
fixed
radiating fin
fixer
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Expired - Fee Related
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CN200420102396.2U
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English (en)
Inventor
余方祥
李孟慈
林淑和
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN200420102396.2U priority Critical patent/CN2799931Y/zh
Priority to US11/204,687 priority patent/US7269010B2/en
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Publication of CN2799931Y publication Critical patent/CN2799931Y/zh
Anticipated expiration legal-status Critical
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

一种固定风扇至散热器上的风扇固定装置,包括二固定片及若干定位件,散热鳍片的两侧设有卡槽,该固定片包括第一板体及第二板体,第一板体上设有可与散热鳍片相抵靠的挡片,第二板体上设有可与卡槽相结合的卡接部,该风扇通过定位件固定至第一板体上。本实用新型风扇固定装置成本低廉、散热效果良好。

Description

风扇固定装置
【技术领域】
本实用新型是关于一种风扇固定装置。
【背景技术】
随着信息技术的飞速发展,计算机中央处理器的运算速度越来越快,其产生的热量也越来越多,而过多的热量若无法及时排出,将严重影响中央处理器运行时的稳定性。
为此,业界通常在中央处理器顶面装设一散热器,并在散热器顶端设置一风扇,利用风扇与散热器的组合来协助排出热量,然而要将风扇快速稳固的安装在散热器上并非易事。
现有的风扇固定方法很多,大部分是利用螺丝将风扇直接锁固在散热鳍片上,来达到风扇与散热器的结合。然而,这种风扇固定方法在装设螺丝时极易损坏到散热鳍片,并使得散热鳍片产生变形,导致螺丝锁固变松而不能将风扇稳固在散热鳍片上,影响风扇和散热器的结合,进而影响热量的及时排出。
基于上述不足,业界改用风扇固定架固定风扇,现有的风扇固定架为一一方盒型固定卡扣结构,其上设有一圆形通风口,其两侧板可延伸至散热器基座上,从而将整个散热装置组合包容在一起,但是,此种结构材料成本较高,而且这种全包式风扇固定片对气流流动会有所影响,散热效果不佳,为此,业界希望设计一种成本低廉、散热效果良好的风扇固定装置。
【发明内容】
本实用新型要解决的技术问题是提供一种成本低廉、散热效果良好的风扇固定装置。
为解决上述技术问题,本实用新型提供一种固定风扇至散热器上的风扇固定装置,包括二固定片及若干定位件,散热鳍片的两侧设有卡槽,该固定片包括第一板体及第二板体,第一板体上设有可与散热鳍片相抵靠的挡片,第二板体上设有可与卡槽相结合的卡接部,该风扇通过定位件固定至第一板体上。
本实用新型风扇固定装置包括二固定片,该固定片包括第一板体及第二板体,结构较为简单,制造成本低廉;该固定片位于散热鳍片组上,未采用全包式结构,散热鳍片内外空气对流较好,散热效果良好。
下面参照附图结合实施例对本实用新型作进一步的描述。
【附图说明】
图1是本实用新型风扇固定装置的立体分解图。
图2是图1中固定片另一视角的立体图。
图3是本实用新型风扇固定装置的立体组合图。
【具体实施方式】
请参阅图1及图2,本实用新型风扇固定装置,用以将散热风扇20固定至散热器30上,包括二固定片10及若干定位件,本实施例中该定位件为螺钉12。散热风扇20四个角落分别贯穿开设有定位孔22,可供螺钉12穿过与固定片10结合。
该固定片10包括一两端设有固定孔13的第一板体14、由第一板体14两端垂直向下延伸的挡片15及由第一板体14外侧垂直向下延伸的第二板体16。该第二板体16底边向内垂直弯折形成一卡接部17。该第一板体14内侧向下及向内弯折形成一紧贴第一板体14的肋板部18,以增强第一板体14的强度。该肋板部18上设有与固定孔13对应的开孔。
散热器30包括一基座32及位于基座32上的散热鳍片组34,该散热鳍片组34由若干相互平行的散热鳍片34组成,各散热鳍片两侧分别设有一开口,这些开口相互对应,在散热鳍片组34的两侧形成二卡槽36,该卡槽36与固定片10的卡接部17相结合,将固定片10安装至散热器30上。
请一并参阅图3,组装时,将固定片10置于散热鳍片组34上设有卡槽36的两侧,使固定片10的卡接部17扣入散热器的卡槽36内,同时,固定片10的挡片15与散热鳍片34外侧的二散热鳍片相抵靠,防止卡接部17向卡槽36两侧移动。将散热风扇20置于固定片10上,使散热风扇20的定位孔22与固定片10的固定孔13对齐,利用螺钉12锁固该定位孔22和固定孔13,将散热风扇20和固定片10固定至散热器30上。

Claims (9)

1.一种固定风扇至散热器上的风扇固定装置,包括二固定片及若干定位件,其特征在于:散热鳍片的两侧设有卡槽,该固定片包括第一板体及第二板体,第一板体上设有可与散热鳍片相抵靠的挡片,第二板体上设有可与卡槽相结合的卡接部,该风扇通过定位件固定至第一板体上。
2.如权利要求1所述的风扇固定装置,其特征在于:该挡片由第一板体两端垂直向下延伸形成。
3.如权利要求1所述的风扇固定装置,其特征在于:该第二板体由第一板体外侧垂直向下延伸形成。
4.如权利要求3所述的风扇固定装置,其特征在于:该卡接部由第二板体底边向内垂直弯折形成。
5.如权利要求1所述的风扇固定装置,其特征在于:该第一板体内侧向下及向内弯折形成一紧贴第一板体的肋板部。
6.如权利要求5所述的风扇固定装置,其特征在于:该风扇与第一板体上分别设有收容定位件的定位孔及固定孔,该定位件穿过定位孔及固定孔将风扇和第一板体固定至散热器上。
7.如权利要求6所述的风扇固定装置,其特征在于:该肋板部上设有与第一板体的固定孔对应的开孔。
8.如权利要求7所述的风扇固定装置,其特征在于:该定位件为螺钉。
9.如权利要求1所述的风扇固定装置,其特征在于:该卡槽由设于散热鳍片两侧的开口对应组合后形成。
CN200420102396.2U 2004-12-03 2004-12-03 风扇固定装置 Expired - Fee Related CN2799931Y (zh)

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Application Number Priority Date Filing Date Title
CN200420102396.2U CN2799931Y (zh) 2004-12-03 2004-12-03 风扇固定装置
US11/204,687 US7269010B2 (en) 2004-12-03 2005-08-15 Heat dissipation device

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CN200420102396.2U CN2799931Y (zh) 2004-12-03 2004-12-03 风扇固定装置

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7365975B2 (en) * 2006-05-02 2008-04-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a fan holder for attachment of a fan
CN100562237C (zh) * 2006-08-25 2009-11-18 富准精密工业(深圳)有限公司 散热装置
US7423873B2 (en) * 2006-09-22 2008-09-09 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having fan holder for attachment of a fan
US20080105735A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Packaging box and assembly incorporating the same
CN101231546A (zh) * 2007-01-24 2008-07-30 鸿富锦精密工业(深圳)有限公司 散热装置组合
US7719840B2 (en) * 2007-10-29 2010-05-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a fixing base thereof
CN101605443B (zh) * 2008-06-13 2011-06-08 富准精密工业(深圳)有限公司 散热装置及其散热器
CN101861083A (zh) * 2009-04-13 2010-10-13 富准精密工业(深圳)有限公司 散热装置
CN201726621U (zh) * 2010-05-28 2011-01-26 国基电子(上海)有限公司 电子装置
CN102469705A (zh) * 2010-11-03 2012-05-23 鸿富锦精密工业(深圳)有限公司 电子装置壳体
US11564329B2 (en) * 2020-11-03 2023-01-24 Asia Vital Components Co., Ltd. Heat dissipation device with multiple heat dissipation zones

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2293487B (en) * 1994-09-21 1998-08-12 Hewlett Packard Co Method and apparatus for attaching a heat sink and a fan to an intergrated circuit package
US6188131B1 (en) * 1998-01-20 2001-02-13 Emc Corporation Clip for retaining a heatsink onto an electronic component
US6396697B1 (en) * 2000-12-07 2002-05-28 Foxconn Precision Components Co., Ltd. Heat dissipation assembly
EP1290928B1 (en) * 2001-03-03 2005-04-27 Zalman Tech Co., Ltd. Heatsink and heatsink device using the heatsink
US6854181B2 (en) * 2001-05-30 2005-02-15 Tyco Electronics Canada Ltd. Folded-fin heat sink assembly and method of manufacturing same
US6449151B1 (en) * 2001-06-15 2002-09-10 Foxconn Precision Components Co., Ltd. Heat sink assembly having fastening means for attaching fan to heat sink
US6392889B1 (en) * 2001-08-21 2002-05-21 Foxconn Precision Components Co., Ltd. Fastener for heat sink
US6538888B1 (en) * 2001-09-28 2003-03-25 Intel Corporation Radial base heatsink
US6450248B1 (en) * 2001-10-29 2002-09-17 Hoya Tech Co., Ltd. Heat sink retainer
US20030136545A1 (en) * 2002-01-18 2003-07-24 Lin Yu-Sen Heat sink for heat-susceptible electronic devices
TW586741U (en) * 2002-03-29 2004-05-01 Hon Hai Prec Ind Co Ltd Heat sink assembly
US6950306B2 (en) * 2002-05-10 2005-09-27 Delta Electronics, Inc. Connection frame for fan
TW536139U (en) * 2002-09-09 2003-06-01 Hon Hai Prec Ind Co Ltd Dissipating assembly
TW539391U (en) * 2002-09-17 2003-06-21 Hon Hai Prec Ind Co Ltd Fixing apparatus
US6829143B2 (en) * 2002-09-20 2004-12-07 Intel Corporation Heatsink retention apparatus
US6816373B2 (en) * 2002-10-04 2004-11-09 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device
US20040085729A1 (en) * 2002-11-04 2004-05-06 Jen-Cheng Lin Heat dissipating fan
TW551790U (en) * 2002-12-31 2003-09-01 Hon Hai Prec Ind Co Ltd Securing device
TW587768U (en) * 2003-01-30 2004-05-11 Molex Inc Heat-dissipating device
US7000683B2 (en) * 2003-08-22 2006-02-21 Min-Ching Huang Heatsink device
US6967844B2 (en) * 2003-08-29 2005-11-22 Abc Taiwan Electronics Corp. Ceramic heat sink with micro-pores structure
US20060034057A1 (en) * 2004-08-11 2006-02-16 Mitac Precision Technology Clamper for mounting a heatsink
US7120019B2 (en) * 2004-08-18 2006-10-10 International Business Machines Corporation Coaxial air ducts and fans for cooling and electronic component

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US7269010B2 (en) 2007-09-11

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