CN101839247A - 散热装置 - Google Patents

散热装置 Download PDF

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CN101839247A
CN101839247A CN200910300938A CN200910300938A CN101839247A CN 101839247 A CN101839247 A CN 101839247A CN 200910300938 A CN200910300938 A CN 200910300938A CN 200910300938 A CN200910300938 A CN 200910300938A CN 101839247 A CN101839247 A CN 101839247A
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fan
combination
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radiating fin
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刘恒
张晶
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Priority to US12/432,751 priority patent/US20100236765A1/en
Publication of CN101839247A publication Critical patent/CN101839247A/zh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
    • F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/60—Mounting; Assembling; Disassembling
    • F04D29/601—Mounting; Assembling; Disassembling specially adapted for elastic fluid pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

一种风扇组合，其包括一风扇及一与所述风扇配合的风扇固定架，所述风扇具有一扇框，所述风扇固定架包括一套设部及自套设部向外延伸的一承载板，所述承载板的一侧缘向上延伸有一扣持部，所述扣持部的顶端内侧向下凸伸有一用于按压风扇的扇框的凸块，所述扣持部的底端向下延伸有一操作部，所述操作部向内或向外运动时带动扣持部向外或向内运动，从而实现所述风扇与风扇固定架的卡扣或分离。与现有技术相比，本发明只需操作风扇固定架的操作部，从而使扣持部上的凸块按压或远离风扇，从而实现发明散热装置的装、拆，操作方便且无需借助任何工具。

Description

散热装置
技术领域
本发明涉及一种散热装置，特别是指一种对电子元件散热的散热装置。
背景技术
随着电子元件运算速度的加快，其产生的热量也不断增多。业界通常采用一散热装置贴置于该电子元件上以对电子元件散热。这种散热装置包括一与电子元件贴设的散热器及装设于散热器顶端的一风扇。一风扇固定架固定于散热器上并与风扇连接。该风扇固定架一侧凸伸有若干凸柱。这些凸柱的顶端可被压缩，从而使凸柱穿过风扇上对应的固定孔。这些凸柱穿过风扇的固定孔后顶端恢复形变而向外膨胀，从而将风扇固定在风扇固定架上。然而，要将风扇从风扇固定架上拆卸十分困难，且必须借助特定工具，浪费工时。
发明内容
有鉴于此，有必要提供一种装、卸简单的散热装置。
一种风扇组合，其包括一风扇及一与所述风扇配合的风扇固定架，所述风扇具有一扇框，所述风扇固定架包括一套设部及自套设部向外延伸的一承载板，所述承载板的一侧缘向上延伸有一扣持部，所述扣持部的顶端内侧向下凸伸有一用于按压风扇的扇框的凸块，所述扣持部的底端向下延伸有一操作部，所述操作部向内或向外运动时带动扣持部向外或向内运动，从而实现所述风扇与风扇固定架的卡扣或分离。
与现有技术相比，本发明只需操作风扇固定架的操作部，从而使扣持部上的凸块按压或远离风扇，从而实现发明散热装置的装、拆，操作方便且无需借助任何工具。
下面参照附图，结合具体实施例对本发明作进一步的描述。
附图说明
图1是本发明一实施例的散热装置的立体组装图。
图2是图1中散热装置的立体分解图。
图3是图2中散热装置的倒置图。
具体实施方式
请参阅图1，本发明一实施例的散热装置用于对电路板10上的电子元件(图未示)散热。该散热装置包括一散热器20、放置于散热器20一侧的一风扇40及一固定于散热器20上且连接风扇40的风扇固定架30。
请同时参阅图2及图3，散热器20由导热性能良好的材料如铜、铝等制成，其包括一圆柱状的吸热部21及自吸热部21外壁向外呈放射状凸伸的若干第一散热片23及若干第二散热片单元。每一第二散热片单元包括间隔设置的两个第二散热片24。本实施例中，四个第二散热片单元等距离间隔设置且均匀分布在吸热部21的周围。第一散热片23设于相邻两个第二散热片单元之间。每一第一散热片23包括与吸热部21相连的一纵长第一连接部231及自第一连接部231末端分叉向外延伸的二第一延伸部233。每一第二散热片24包括与吸热部21相连的一纵长的第二连接部241及自第二连接部241末端分叉向外延伸的二第二延伸部243。第一连接部231及第二连接部241的长度及高度相等。第二延伸部243的高度与第一延伸部233相等，其长度小于第一延伸部233的长度。第一、第二散热片23、24的第一、第二连接部231、241等距离间隔设置且自吸热部21向外呈放射状分布，第一、第二连接部233、243亦等距离间隔设置且呈放射状分布。这些第一散热片23及第二散热片24的顶端与吸热部21的顶端共面，其底端位于吸热部21底端上方，从而使散热片23与吸热部21的底端形成一台阶25，以便于风扇40产生的气流流出散热器20。
四固定臂26自吸热部21的外壁向外延伸且其长度及高度均与第一散热片23相同。每一固定臂26的厚度较第一、第二散热片23、24厚。每一固定臂26夹设于相连的二第二散热片24之间且与第二散热片24的第二连接部241的里端一体连接。每一固定臂26沿其高度方向间隔设置二固定部261。每一固定部261为一贯通其顶面及底面的的通槽用于与风扇固定架30配合。每一固定臂26的最外端下方向外凸设有一连接环263。螺钉50穿过这些连接环263并与电路板10配合，从而将散热器20固定于电路板10上。
所述风扇固定架30由塑胶材料制成，包括一圆环状的套设部31及自套设部31顶端向外延伸的四承载板33。该套设部31套设于散热器20的顶端。这些承载板33用于承载风扇40。四承载板33分布于套设部31顶端的四角上且相互之间通过一自套设部31顶端边缘向内延伸的连接板35连接。每一承载板33大致呈三角形，其一侧边中部向上垂直延伸有一扣持部331，自该扣持部331的底端向下延伸有一操作部333。该扣持部331及操作部333为一体成型的弹性片体。该扣持部331顶端内侧倾斜向下凸设有一凸块3312，用以抵压风扇40。向内或向外按压该操作部333，从而带动扣持部331远离或按压风扇40。每一承载板33与扣持部331连接处中部开设有一贯穿的开口332。每一承载板33上表面中部向上凸伸有一圆柱状插销335，用于连接风扇40。每一承载板33下表面中部向下延伸有一三角形的加强肋337，用以加强承载板33的强度。每一承载板33内侧的一角开设有一与散热器20对应固定臂26上的固定部261对应的沉头孔339，用于与散热器20配合。
该风扇40包括一矩形的扇框41及收容于扇框41内的叶片组43。该扇框41的四角中部向内凹陷，从而使该扇框41的上下两端形成四对大致呈三角形的安装板412。每一安装板412的中部开设有一通孔414，用以与风扇固定架30上的插销335配合。
安装时，使螺钉50穿过散热器20的连接环263并与电路板10配合，从而将散热器20固定于电路板10上。将风扇固定架30的套设部31套设于散热器20的顶端，并使承载板33上的沉头孔339与散热器20的固定臂26上的固定部261对应。四螺钉60穿过沉头孔339并与固定部261配合，从而将风扇固定架30固定于散热器20上。向内按压风扇固定架30的操作部333，使与之相连的扣持部331向外运动，然后将风扇40自风扇固定架30的上方向下按压，使风扇固定架30的插销335穿过风扇40下端安装板412上的通孔414。松开操作部333，使扣持部331因恢复弹性变形而朝向风扇40运动，最终使扣持部331的内壁抵顶安装板412的侧壁、扣持部331的凸块3312按压安装板412的上表面。
拆卸时，只需向内按压风扇固定架30的操作部333，使与之相连的扣持部331向外运动，并将风扇40自风扇固定架30抽离即可。
本发明的散热装置，只需操纵风扇固定架30的操作部333，即可轻松实现风扇40与散热器20的拆、装，操作方便且无需借助任何工具。
可以理解的是，虽然上述实施例中的散热装置的承载板33数量为四个，在其他实施例中，其也可是位于风扇固定架30套设部31对角上的两个。该二承载板33及其上的插销335、扣持部331、操作部333同样可以实现风扇40的固定。

Claims (10)

1.一种风扇组合，其包括一风扇及一与所述风扇配合的风扇固定架，所述风扇具有一扇框，所述风扇固定架包括一套设部及自套设部向外延伸的一承载板，其特征在于：所述承载板的一侧缘向上延伸有一扣持部，所述扣持部的顶端内侧向下凸伸有一用于按压风扇的扇框的凸块，所述扣持部的底端向下延伸有一操作部，所述操作部向内或向外运动时带动扣持部向外或向内运动，从而实现所述风扇与风扇固定架的卡扣或分离。
2.如权利要求1所述的风扇组合，其特征在于：所述扣持部及操作部为一体形成的弹性片体。
3.如权利要求1所述的风扇组合，其特征在于：所述承载板与扣持部相连处中部开设有一贯穿的开口。
4.如权利要求1所述的风扇组合，其特征在于：一插销自所述承载板的上表面向上凸伸形成并穿设风扇的扇框。
5.如权利要求1所述的风扇组合，其特征在于：每一承载板的下表面向下凸伸有一与套设部相连的加强肋。
6.如权利要求1所述的风扇组合，其特征在于：所述风扇组合还包括一散热器，其包括一吸热部及自吸热部外壁延伸的若干固定臂，每一固定臂的外端设置有一固定部，一螺钉穿过风扇固定架的承载板并与对应的固定臂的固定部配合。
7.如权利要求6所述的风扇组合，其特征在于：所述散热器进一步包括自吸热部外壁延伸的若干间隔设置的第一散热片，其自吸热部外壁向外延伸且呈放射状分布，每一第一散热片包括与吸热部相连的一纵长第一连接部及自第一连接部末端分叉向外延伸的二第一延伸部。
8.如权利要求7所述的风扇组合，其特征在于：所述散热器进一步包括自吸热部外壁向外延伸的若干第二散热片单元，这些第二散热片单元等距离间隔设置，第一散热片夹设于相邻的二第二散热片单元之间。
9.如权利要求8所述的风扇组合，其特征在于：所述每一第二散热片单元包括二间隔设置的第二散热片，每一第二散热片包括自吸热部延伸的一第二连接部及自连接部末端分叉向外延伸的二第二延伸部，所述每一固定臂夹设于二第二散热片之间且与二第二散热片的二连接部里端一体连接。
10.如权利要求6所述的风扇组合，其特征在于：所述套设部为一内空的筒体，其套设于散热器的一端。
CN200910300938A 2009-03-18 2009-03-18 散热装置 Pending CN101839247A (zh)

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CN200910300938A CN101839247A (zh) 2009-03-18 2009-03-18 散热装置
US12/432,751 US20100236765A1 (en) 2009-03-18 2009-04-30 Fan assembly and heat dissipation device having the same

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103167777A (zh) * 2011-12-15 2013-06-19 富瑞精密组件（昆山）有限公司 散热模组

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI530663B (zh) * 2011-12-14 2016-04-21 鴻準精密工業股份有限公司 散熱模組
CN115632035A (zh) 2017-10-27 2023-01-20 伊姆西Ip控股有限责任公司 用于双侧散热器的固定装置和相关联的散热系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2477877Y (zh) * 2001-03-22 2002-02-20 富准精密工业(深圳)有限公司 风扇固定装置
CN2485466Y (zh) * 2001-03-21 2002-04-10 富准精密工业(深圳)有限公司 风扇固定架
CN2490347Y (zh) * 2001-05-31 2002-05-08 富准精密工业(深圳)有限公司 风扇固定装置
CN2746528Y (zh) * 2004-11-17 2005-12-14 英志企业股份有限公司 散热器支架结构

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5794685A (en) * 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
TW590268U (en) * 2000-08-08 2004-06-01 Wistron Corp Heat dissipating device
BR0204457A (pt) * 2001-03-03 2004-06-22 Zalman Tech Co Ltd Dissipador de calor para absorção de calor gerado de uma fonte geradora de calor e dispositivo de dissipação de calor
TW585386U (en) * 2001-03-13 2004-04-21 Foxconn Prec Components Co Ltd Fan fixing device
TW519255U (en) * 2001-08-03 2003-01-21 Thermal Integration Technology Buckling implement of IC heat sink
USD464939S1 (en) * 2001-12-26 2002-10-29 Thermal Integration Technology Inc. Heat sink
TW534377U (en) * 2002-01-31 2003-05-21 Delta Electronics Inc Heat-dissipating assembly and its used securing device
TWM246991U (en) * 2003-11-21 2004-10-11 Hon Hai Prec Ind Co Ltd Mounting assembly for heat sink
TW200421074A (en) * 2004-06-03 2004-10-16 Asia Vital Components Co Ltd A stand structure having positioning function
TWI274539B (en) * 2005-04-01 2007-02-21 Delta Electronics Inc Heat dissipating assembly with composite heat dissipating structure
CN100454722C (zh) * 2005-09-09 2009-01-21 富准精密工业(深圳)有限公司 风扇导线理线装置及其组合
CN100499975C (zh) * 2005-09-12 2009-06-10 富准精密工业(深圳)有限公司 散热装置
TWI267347B (en) * 2005-11-25 2006-11-21 Foxconn Tech Co Ltd Heat dissipation device
TW200721957A (en) * 2005-11-29 2007-06-01 Sunonwealth Electr Mach Ind Co Improvement in fixing seat of heat-dissipating module
CN100574595C (zh) * 2006-04-14 2009-12-23 鸿富锦精密工业（深圳）有限公司 散热装置
US7362573B2 (en) * 2006-04-28 2008-04-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20080066898A1 (en) * 2006-09-15 2008-03-20 Foxconn Technology Co., Ltd. Heat dissipation device
US7493940B2 (en) * 2006-10-10 2009-02-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having mounting brackets
US20080121369A1 (en) * 2006-11-28 2008-05-29 Foxconn Technology Co., Ltd. Heat dissipation assembly having fan duct
CN101222835A (zh) * 2007-01-12 2008-07-16 富准精密工业(深圳)有限公司 散热装置
US7440284B1 (en) * 2007-05-04 2008-10-21 Asia Vital Components Co., Ltd. Holding device for a heat sink
CN102098901A (zh) * 2009-12-15 2011-06-15 富准精密工业(深圳)有限公司 散热装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2485466Y (zh) * 2001-03-21 2002-04-10 富准精密工业(深圳)有限公司 风扇固定架
CN2477877Y (zh) * 2001-03-22 2002-02-20 富准精密工业(深圳)有限公司 风扇固定装置
CN2490347Y (zh) * 2001-05-31 2002-05-08 富准精密工业(深圳)有限公司 风扇固定装置
CN2746528Y (zh) * 2004-11-17 2005-12-14 英志企业股份有限公司 散热器支架结构

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103167777A (zh) * 2011-12-15 2013-06-19 富瑞精密组件（昆山）有限公司 散热模组

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