US20100236765A1 - Fan assembly and heat dissipation device having the same - Google Patents
Fan assembly and heat dissipation device having the same Download PDFInfo
- Publication number
- US20100236765A1 US20100236765A1 US12/432,751 US43275109A US2010236765A1 US 20100236765 A1 US20100236765 A1 US 20100236765A1 US 43275109 A US43275109 A US 43275109A US 2010236765 A1 US2010236765 A1 US 2010236765A1
- Authority
- US
- United States
- Prior art keywords
- fan
- connecting plate
- supporting portion
- heat sink
- dissipation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
- F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/60—Mounting; Assembling; Disassembling
- F04D29/601—Mounting; Assembling; Disassembling specially adapted for elastic fluid pumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
A heat dissipation device includes a heat sink, a fan mounted on a top side of the heat sink and a fan holder connecting the heat sink with the fan. The fan includes a blade assembly and a frame enclosing the blade assembly. The fan holder includes a supporting portion engaging with the heat sink. A connecting plate extends upwardly from an edge of the supporting portion. A ridge extends angulately and downwardly from an inner surface of the connecting plate. An operating plate extends downwardly from a bottom end of the connecting plate. The operating plate is pressed inwardly or pulled outwardly to make the ridge of the connecting plate space from or engage with the frame of the fan.
Description
- 1. Technical Field
- The present invention relates to heat dissipation devices and, particularly, to a fan assembly capable of being conveniently assembled to and disassembled from a heat sink, and a heat dissipation device having such a fan assembly and a heat sink.
- 2. Description of Related Art
- A heat sink is usually placed in thermal contact with a heat generating electronic device such as a central processing unit (CPU), and transfers heat through conduction away from the heat generating electronic device so as to prevent over-heating of the heat generating electronic device.
- Typically, a fan is mounted on a side of a heat sink by a fan holder to improve heat dissipation efficiency of the heat sink. The fan comprises a blade assembly and a frame enclosing the blade assembly. Diagonally corners of the frame define two mounting holes, respectively. Two elastic pins extend upwardly from diagonally corners of the fan holder and corresponds to the mounting holes of the frame. The elastic pins of the fan holder are pressed into the mounting holes of the frame. When the elastic pins extend through the mounting holes, the elastic pins expand and firmly contacts the frame. In that state, the fan and the fan holder are assembled together. However, it is difficult to disassemble the fan from the fan holder, and technical tools may be used. This is very time-consuming and trouble.
- For the foregoing reasons, there is a need in the art for a heat dissipation device which can overcome the limitations described.
-
FIG. 1 is an assembled view of a heat dissipation device in accordance with an embodiment of the present disclosure, in which the heat dissipation device is mounted on a printed circuit board. -
FIG. 2 is an exploded view of the heat dissipation device inFIG. 1 . -
FIG. 3 is an inverted view ofFIG. 2 . - Referring to
FIGS. 1-2 , an embodiment of a heat dissipation device comprises aheat sink 20, afan 40 mounted on a top side of theheat sink 20 and afan holder 30 connecting theheat sink 20 with thefan 40. - Referring to
FIG. 3 also, theheat sink 20 comprises a cylindricalheat absorbing portion 21, a number offirst fins 23 and a number ofsecond fins 24 extending outwardly and radially from a periphery of theheat absorbing portion 21. Thefirst fins 23 are divided into four groups which are equidistantly spaced from each other and oriented toward different directions by four mountingarms 26 extending evenly from the periphery of theheat absorbing portion 21. Each of thefirst fins 23 comprises an elongated first connectingplate 231 connected theheat absorbing portion 21 and two elongated and angled first extendingplates 233 extending outwardly from the outmost end of the first connectingplate 231. Thesecond fins 24 are divided into four groups also. Each group of thesecond fins 24 comprises two adjacentsecond fins 24 positioned between the two adjacent groups of thefirst fins 23. Eachsecond fin 24 comprises an elongated second connectingplate 241 extending from theheat absorbing portion 21 and two elongated and angledsecond extending plates 243 extending outwardly from the outmost end of the second connectingplate 241. A height of the first connectingplate 231 is equal to that of the second connectingplate 241. Heights of the first and second extendingplates heat absorbing portion 21. A width of the first connectingplate 231 is equal to that of the second connectingplate 241. A width of the first extendingplate 233 is larger than that of the second extendingplate 243. Tops of the first andsecond fins heat absorbing portion 21 are coplanar. The bottom portion of theheat absorbing portion 21 is below bottom ends of the first andsecond fins step 25 is defined at a bottom portion of theheat sink 20. - A height of the
mounting arm 26 is equal to that of thefirst fin 23. A width of themounting arm 26 is equal to that of thefirst fin 23. A thickness of themounting arm 26 is larger than that of the first andsecond fins arms 26 is sandwiched between the two adjoiningsecond fins 24. An inner section of themounting arm 26 and the second connectingplates 241 of the two adjoiningsecond fins 24 are integrated, and an outer section of themounting arm 26 is spaced from the second connectingplates 241 of the two adjoiningsecond fins 24. An outmost end of themounting arm 26 defines two spaced firstengaging portions 261 to engage with thefan holder 30 and a secondengaging portion 263 to engage with a printedcircuit board 10. Each of the firstengaging portions 261 is an elongated groove and extends along a height direction of themounting arm 26. The eight firstengaging portions 261 are divided into first and second groups. The firstengaging portions 261, which are located at front sides of the mountingarms 26, respectively, along a clockwise direction as viewed fromFIG. 2 , belong to the first group. The firstengaging portions 261, which are located at rear sides of the mountingarms 26, respectively, belong to the second group. The first and second groups of the first engagingportions 261 are engage with thefan holder 30. The secondengaging portion 263 is positioned between the two firstengaging portions 261 and has a C-shaped configuration. Fourscrews 50 extend through the secondengaging portions 263 and engage with the printedcircuit board 10 to mount theheat sink 20 on the printedcircuit board 10. - The
fan holder 30 is integrally formed by a plastic material and comprises an annularengaging member 31 and four supportingportions 33 extending outwardly from a top end of theengaging member 31. The four supportingportions 33 are equidistantly spaced from each other. The two adjacent supportingportions 33 are connected by a linkingplate 35 which extends inwardly from an edge of theengaging member 31. The supportingportion 33 is a triangular plate and is beyond theengaging member 31. Aconnecting plate 331 extends upwardly from an edge of the supportingportion 33. Aridge 3312 extends angulately and downwardly from a top end of theconnecting plate 331 to press thefan 40. Anoperating plate 333 extends downwardly from a bottom end of theconnecting plate 331. The connectingplate 331, theoperating plate 333 and theridge 3312 are integrally made of elastic material. Theoperating plate 333 is pressed inwardly or pulled outwardly to make theridge 3312 of the connectingplate 331 space from or engage with thefan 40. A throughhole 332 is defined in the supportingportion 33 and is adjacent to a joint of the supportingportion 33 and the connectingplate 331. Anelastic pin 335 extends upwardly from a top surface of the supportingportion 31 and is located at an outer side of the connectingplate 331. Thepins 335 engage with thefan 40. Ascrew hole 339 is defined at a corner of the supportingportion 33. Fourscrews 60 extend through thescrew holes 339 and engage with the first or second group of the firstengaging portions 261 of the four mountingarms 26 of theheat sink 20 to mount thefan holder 30 on theheat sink 20. A triangular reinforcingrib 337 is formed at a bottom surface of the supportingportion 33 and connects with theengaging member 31. - The
fan 40 comprises acubical bracket 41 and ablade assembly 43 received in thebracket 41. Central portions of four corners of thebracket 41 are recessed; thus, fourtriangular mounting portions 412 are formed at bottom end of thebracket 41. Central portion of the mountingportion 412 defines a throughhole 414 to receive thepin 335 of thefan holder 30. - In assembly, the
screws 50 extend through the secondengaging portions 263 of the mountingarms 26 of theheat sink 20 and engage with the printedcircuit board 10 to mount theheat sink 20 on the printedcircuit board 10. The engagingmember 31 of thefan holder 30 encloses a top end of theheat sink 20 and thescrew hole 339 of the supportingportion 33 aligns with the corresponding first engagingportion 261 of the mountingarm 26. Thescrews 60 extend through the screw holes 339 and engage with the first or second groups of the first engagingportion 261 to mount thefan holder 30 on theheat sink 20. The operatingplates 333 of thefan holder 30 are subjected to an external force, which presses the operatingplates 333 inwardly to make the connectingplates 331 run outwardly. Thereafter, thefan 40 is pressed towards thefan holder 30 until thepins 335 of thefan holder 30 extend in the throughholes 414 of the mountingportions 412. Then, the external force of the operatingplates 333 is released; a resilience of the operatingplates 333 impels the connectingplates 331 to move towards thefan 40. As a result, theridges 3312 of the connectingplates 331 press the top surfaces of the supportingportions 33. Therefore, the heat dissipation device is assembled completely. - In disassembly, the operating
plates 333 are pressed inwardly to make the connectingplates 331 run outwardly until theridges 3312 of the connectingplates 331 are separated from the supportingportions 33. Thereafter, thefan 40 is taken out from thefan holder 30. Thus, thefan 40 is disassembled from thefan holder 30. - It is to be understood, however, that even though numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the structure and function of the disclosure, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (15)
1. A fan assembly comprising:
a fan comprising a blade assembly and a frame supporting the blade assembly; and
a fan holder comprising a supporting portion, a connecting plate extending upwardly from an edge of the supporting portion, a ridge extending angulately and downwardly from a top end of the connecting plate, an operating plate extending downwardly from a bottom end of the connecting plate;
wherein the operating plate is pressed inwardly or pulled outwardly to make the ridge of the connecting plate space from or engage with the frame of the fan.
2. The fan assembly as claimed in claim 1 , wherein the connecting plate and the operating plate are integrally made of an elastic material.
3. The fan assembly as claimed in claim 1 , wherein a pin extends upwardly from a top surface of the supporting portion and extends through the frame of the fan.
4. The fan assembly as claimed in claim 1 , wherein an engaging member connects with the supporting portion, the engaging member adapted for engaging with a heat sink.
5. The fan assembly as claimed in claim 4 , wherein the engaging member is annular and the supporting portion extends outwardly from a top of the engaging member.
6. The fan assembly as claimed in claim 5 , wherein a reinforcing rib is formed at a bottom of the supporting portion and connects with the engaging member.
7. The fan assembly as claimed in claim 5 , wherein a plurality of supporting portions are formed at the top of the engaging member.
8. The fan assembly as claimed in claim 1 , wherein a through hole is defined in the supporting portion and is adjacent to a joint of the supporting portion and the connecting plate.
9. A heat dissipation device comprising:
a heat sink;
a fan mounted on a top side of the heat sink, the fan comprising a blade assembly and a frame enclosing the blade assembly; and
a fan holder comprising a supporting portion engaging with the heat sink, a connecting plate extending upwardly from an edge of the supporting portion, a ridge extending angulately and downwardly from a top end of the connecting plate, an operating plate extending downwardly from a bottom end of the connecting plate;
wherein the operating plate is pressed inwardly or pulled outwardly to make the ridge of the connecting plate space from or engage with the frame of the fan.
10. The heat dissipation device as claimed in claim 9 , wherein a pin extends upwardly from a top surface of the supporting portion and through the frame of the fan.
11. The heat dissipation device as claimed in claim 10 , wherein an engaging member connects with the supporting portion, and the engaging member encloses a top end of the heat sink therein.
12. The heat dissipation device as claimed in claim 9 , wherein the heat sink comprises a heat absorbing portion and a plurality of mounting arms extending outwardly and radially from a periphery of the heat absorbing portion, a screw extends through the supporting portion of the fan holder and engages with a corresponding mounting arm to mount the fan holder on the heat sink.
13. The heat dissipation device as claimed in claim 12 , wherein the heat sink comprises a plurality of fins extending outwardly and radially from a periphery of the heat absorbing portion, and a bottom end of the heat absorbing portion is below bottom ends of the fins.
14. The heat dissipation device as claimed in claim 13 , wherein each of the fins comprises a connecting plate connected the heat absorbing portion and two angled extending plates extending outwardly from an outmost end of the connecting plate.
15. The heat dissipation device as claimed in claim 14 , wherein the fins are divided a plurality of groups and each group of the fins is sandwiched between two adjacent mounting arms.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910300938A CN101839247A (en) | 2009-03-18 | 2009-03-18 | Dissipation device |
CN200910300938.4 | 2009-03-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100236765A1 true US20100236765A1 (en) | 2010-09-23 |
Family
ID=42736483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/432,751 Abandoned US20100236765A1 (en) | 2009-03-18 | 2009-04-30 | Fan assembly and heat dissipation device having the same |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100236765A1 (en) |
CN (1) | CN101839247A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130153178A1 (en) * | 2011-12-14 | 2013-06-20 | Foxconn Technology Co., Ltd. | Heat dissipation device with fan |
US10571207B2 (en) * | 2017-10-27 | 2020-02-25 | EMC IP Holding Company LLC | Fixing device for double sided heat sink and associated heat dissipating system |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103167777A (en) * | 2011-12-15 | 2013-06-19 | 富瑞精密组件(昆山)有限公司 | Heat dissipation module |
Citations (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5794685A (en) * | 1996-12-17 | 1998-08-18 | Hewlett-Packard Company | Heat sink device having radial heat and airflow paths |
US20020018336A1 (en) * | 2000-08-08 | 2002-02-14 | Liang C. Y. | Heat sink apparatus |
US6392885B1 (en) * | 2001-03-13 | 2002-05-21 | Foxconn Precision Components Co., Ltd. | Fan holder |
USD464939S1 (en) * | 2001-12-26 | 2002-10-29 | Thermal Integration Technology Inc. | Heat sink |
US6662412B2 (en) * | 2001-08-03 | 2003-12-16 | Tsan-Wen Chuang | Buckle of IC heat dissipating device |
US6712127B2 (en) * | 2001-03-03 | 2004-03-30 | Zalman Tech Co., Ltd. | Heatsink and heatsink device using the heatsink |
US6822864B2 (en) * | 2002-01-31 | 2004-11-23 | Delta Electronics, Inc. | Heat-dissipating assembly and securing device used therein |
US20050111191A1 (en) * | 2003-11-21 | 2005-05-26 | Hon Hai Precision Industry Co., Ltd. | Locking device for heat dissipating device |
US20060219386A1 (en) * | 2005-04-01 | 2006-10-05 | Delta Electronics, Inc. | Heat dissipating assembly with composite heat dissipating structure |
US20070058342A1 (en) * | 2005-09-12 | 2007-03-15 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20070121293A1 (en) * | 2005-11-29 | 2007-05-31 | Sunonwealth Electric Machine Industry Co., Ltd. | Cooling module holder |
US20070119567A1 (en) * | 2005-11-25 | 2007-05-31 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US7281893B2 (en) * | 2004-06-03 | 2007-10-16 | Asia Vital Components Co., Ltd. | Supporting frame with locating function |
US20070242433A1 (en) * | 2006-04-14 | 2007-10-18 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
US7289324B2 (en) * | 2005-09-09 | 2007-10-30 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having power wires fixture |
US20070253160A1 (en) * | 2006-04-28 | 2007-11-01 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20080066898A1 (en) * | 2006-09-15 | 2008-03-20 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20080083528A1 (en) * | 2006-10-10 | 2008-04-10 | Foxconn Technology Co., Ltd. | Heat dissipation device having mounting brackets |
US20080121369A1 (en) * | 2006-11-28 | 2008-05-29 | Foxconn Technology Co., Ltd. | Heat dissipation assembly having fan duct |
US7440284B1 (en) * | 2007-05-04 | 2008-10-21 | Asia Vital Components Co., Ltd. | Holding device for a heat sink |
US7545643B2 (en) * | 2007-01-12 | 2009-06-09 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with a fan duct |
US20110141700A1 (en) * | 2009-12-15 | 2011-06-16 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation apparatus |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2485466Y (en) * | 2001-03-21 | 2002-04-10 | 富准精密工业(深圳)有限公司 | Fixer for electric fan |
CN2477877Y (en) * | 2001-03-22 | 2002-02-20 | 富准精密工业(深圳)有限公司 | Fan fixer |
CN2490347Y (en) * | 2001-05-31 | 2002-05-08 | 富准精密工业(深圳)有限公司 | Fixing device for fan |
CN2746528Y (en) * | 2004-11-17 | 2005-12-14 | 英志企业股份有限公司 | Heat sink support structure |
-
2009
- 2009-03-18 CN CN200910300938A patent/CN101839247A/en active Pending
- 2009-04-30 US US12/432,751 patent/US20100236765A1/en not_active Abandoned
Patent Citations (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5794685A (en) * | 1996-12-17 | 1998-08-18 | Hewlett-Packard Company | Heat sink device having radial heat and airflow paths |
US20020018336A1 (en) * | 2000-08-08 | 2002-02-14 | Liang C. Y. | Heat sink apparatus |
US6712127B2 (en) * | 2001-03-03 | 2004-03-30 | Zalman Tech Co., Ltd. | Heatsink and heatsink device using the heatsink |
US6392885B1 (en) * | 2001-03-13 | 2002-05-21 | Foxconn Precision Components Co., Ltd. | Fan holder |
US6662412B2 (en) * | 2001-08-03 | 2003-12-16 | Tsan-Wen Chuang | Buckle of IC heat dissipating device |
USD464939S1 (en) * | 2001-12-26 | 2002-10-29 | Thermal Integration Technology Inc. | Heat sink |
US6822864B2 (en) * | 2002-01-31 | 2004-11-23 | Delta Electronics, Inc. | Heat-dissipating assembly and securing device used therein |
US20050111191A1 (en) * | 2003-11-21 | 2005-05-26 | Hon Hai Precision Industry Co., Ltd. | Locking device for heat dissipating device |
US7281893B2 (en) * | 2004-06-03 | 2007-10-16 | Asia Vital Components Co., Ltd. | Supporting frame with locating function |
US20060219386A1 (en) * | 2005-04-01 | 2006-10-05 | Delta Electronics, Inc. | Heat dissipating assembly with composite heat dissipating structure |
US7289324B2 (en) * | 2005-09-09 | 2007-10-30 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having power wires fixture |
US20070058342A1 (en) * | 2005-09-12 | 2007-03-15 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20070119567A1 (en) * | 2005-11-25 | 2007-05-31 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20070121293A1 (en) * | 2005-11-29 | 2007-05-31 | Sunonwealth Electric Machine Industry Co., Ltd. | Cooling module holder |
US20070242433A1 (en) * | 2006-04-14 | 2007-10-18 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
US20070253160A1 (en) * | 2006-04-28 | 2007-11-01 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20080066898A1 (en) * | 2006-09-15 | 2008-03-20 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20080083528A1 (en) * | 2006-10-10 | 2008-04-10 | Foxconn Technology Co., Ltd. | Heat dissipation device having mounting brackets |
US20080121369A1 (en) * | 2006-11-28 | 2008-05-29 | Foxconn Technology Co., Ltd. | Heat dissipation assembly having fan duct |
US7545643B2 (en) * | 2007-01-12 | 2009-06-09 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with a fan duct |
US7440284B1 (en) * | 2007-05-04 | 2008-10-21 | Asia Vital Components Co., Ltd. | Holding device for a heat sink |
US20110141700A1 (en) * | 2009-12-15 | 2011-06-16 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation apparatus |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130153178A1 (en) * | 2011-12-14 | 2013-06-20 | Foxconn Technology Co., Ltd. | Heat dissipation device with fan |
US10571207B2 (en) * | 2017-10-27 | 2020-02-25 | EMC IP Holding Company LLC | Fixing device for double sided heat sink and associated heat dissipating system |
US11215409B2 (en) | 2017-10-27 | 2022-01-04 | EMC IP Holding Company LLC | Fixing device for double sided heat sink and associated heat dissipating system |
Also Published As
Publication number | Publication date |
---|---|
CN101839247A (en) | 2010-09-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6896046B2 (en) | Heat dissipation assembly with fan mounting device | |
US7493940B2 (en) | Heat dissipation device having mounting brackets | |
US7321492B2 (en) | Heat sink module for an electronic device | |
US8075250B2 (en) | Fastening device for fans | |
US20120293958A1 (en) | Heat disspating apparatus and electronic device | |
US8064201B2 (en) | Securing device and thermal module incorporating the same | |
US8608438B2 (en) | Mounting device for fan and fan module with the same | |
US8256736B2 (en) | Mounting rack structure and mounting hole adapter thereof | |
US20130149168A1 (en) | Mounting apparatus for fan | |
US20130306291A1 (en) | Strip heatsink | |
US20090166009A1 (en) | Heat dissipation device having heat pipes for supporting heat sink thereon | |
US20100236765A1 (en) | Fan assembly and heat dissipation device having the same | |
KR200490472Y1 (en) | Assembly for a radiator | |
US20090244849A1 (en) | Heat dissipation device | |
US7841388B2 (en) | Radiating fin assembly for thermal module | |
US8622119B2 (en) | Fixing frame and heat dissipation device using the same | |
US20130070418A1 (en) | Heat dissipation module | |
US20130186599A1 (en) | Heat dissipating device and method of manufacturing the same | |
US20130014920A1 (en) | Heat sink assembly | |
US20120018132A1 (en) | Heat dissipation device | |
US20100259896A1 (en) | Heat dissipation device having a fan holder thereon | |
US20100181049A1 (en) | Heat dissipation module | |
US9076769B2 (en) | Fixing device and thermal module incorporating the same | |
US8256500B2 (en) | Heat dissipation device having support brackets with buckles to support the fan | |
US20160351470A1 (en) | Base with heat absorber and heat dissipating module having the base |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, HENG;ZHANG, JING;REEL/FRAME:022617/0024 Effective date: 20090429 Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, HENG;ZHANG, JING;REEL/FRAME:022617/0024 Effective date: 20090429 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |